FBGA Microprocessors 830

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
T1023NSE7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16		64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		19 mm			YES		32		40	260	19 mm		CMOS		5 mA	1 V	2		5			.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
T2081NSE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16				GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.61 mm		23 mm			YES		64		30	250	23 mm		CMOS			1.025 V						.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
P1014CXE5HFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		0	100 MHz			19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425			800 rpm	YES	e2
P1014NSE5FFA,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V						BOTTOM		1.9 mm		19 mm			YES		0	100 MHz			19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425			667 rpm	YES
P1014CSE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		0 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		0	100 MHz			19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425			800 rpm	YES	e2
P1010CSN5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel			BOTTOM		1.9 mm		19 mm			YES		32				19 mm		CMOS			1 V	4					.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
P1010NXN5FHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel			BOTTOM		1.9 mm		19 mm			YES		32				19 mm		CMOS			1 V	4					.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
P1010CXN5FHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel			BOTTOM		1.9 mm		19 mm			YES		32				19 mm		CMOS			1 V	4					.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MCIMX6DP4AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm		21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE					40	260	21 mm		CMOS									.8 mm		S-PBGA-B624	3				e1
P1010NSE5FHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel			BOTTOM		1.9 mm		19 mm			YES		32				19 mm		CMOS			1 V	4					.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
P1014CSN5HHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		0 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		0	100 MHz			19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425			800 rpm	YES	e2
P1010NSN5DHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel			BOTTOM		1.9 mm		19 mm			YES		32				19 mm		CMOS			1 V	4					.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1014CXE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		0	100 MHz			19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425			800 rpm	YES	e2
T1042NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16		32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm			YES		64	133.3 MHz	30	250	23 mm		CMOS			1 V						.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
MCIMX31LDVMN5DR2	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	473	FBGA	SQUARE	PLASTIC/EPOXY		YES						1.2/1.5,1.8/3.3	GRID ARRAY, FINE PITCH	BGA473,23X23,32		70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM											40	260										Microprocessors		.8 mm		S-PBGA-B473	3	Not Qualified			e1
P1014NXE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V				TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		0	100 MHz	40	260	19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425	3		800 rpm	YES	e2
LS1043ASN8MQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		14		64		GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel			BOTTOM		2.07 mm		23 mm		ALSO OPERATES AT 1V NOMINAL SUPPLY	YES		32		30	250	23 mm		CMOS			.9 V						.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES
P1014PXE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		0	100 MHz			19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425			800 rpm	YES	e2
P1010NXN5DHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel			BOTTOM		1.9 mm		19 mm			YES		32				19 mm		CMOS			1 V	4					.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1014CXE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		0	100 MHz			19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425			800 rpm	YES	e2
P1010CSE5DHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel			BOTTOM		1.9 mm		19 mm			YES		32				19 mm		CMOS			1 V	4					.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1014NSN5HFA,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V						BOTTOM		1.9 mm		19 mm			YES		0	100 MHz			19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425			800 rpm	YES
P1014CXN5DFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0		32		GRID ARRAY, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		0	100 MHz			19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B425			533 rpm	YES	e2
T1042NSE7PQA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16		32		GRID ARRAY, FINE PITCH		.97 V						BOTTOM		2.07 mm		23 mm			YES		64	133.3 MHz	NOT SPECIFIED	NOT SPECIFIED	23 mm		CMOS			1 V						.8 mm	FIXED POINT	S-PBGA-B780			1400 rpm	YES
HD6417705BP100BV	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA208,17X17,25		70 Cel		-20 Cel			BOTTOM															CMOS		200 mA					Microprocessors		.635 mm		S-PBGA-B208		Not Qualified	100 rpm
UPD30122F1-150-GA1	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	224	FBGA	SQUARE	PLASTIC/EPOXY		YES					64	1.8,3.3	GRID ARRAY, FINE PITCH	BGA224,18X18,32		85 Cel		-40 Cel			BOTTOM															CMOS							Microprocessors		.8 mm		S-PBGA-B224		Not Qualified	150 rpm
HD6417751RBG240V	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	292	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		26		32		GRID ARRAY, FINE PITCH		1.4 V	75 Cel		-20 Cel			BOTTOM		2 mm		17 mm			YES		32	34 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm		CMOS			1.5 V						.8 mm	FLOATING POINT	S-PBGA-B292			240 rpm	YES
UPD30131F1-200-GA2	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	224	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA224,18X18,32		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM															CMOS							Microprocessors		.8 mm		S-PBGA-B224		Not Qualified	200 rpm		e0
UPD30111S1-70-3C	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	224	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	2.5,3.3	GRID ARRAY, FINE PITCH	BGA224,18X18,32		70 Cel		-10 Cel			BOTTOM															CMOS		140 mA					Microprocessors		.8 mm		S-PBGA-B224		Not Qualified	70 rpm
HD64404BTV	Renesas Electronics	MICROPROCESSOR, RISC		BALL	352	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.6 V		32				GRID ARRAY, FINE PITCH		1.4 V				TIN SILVER COPPER		BOTTOM		1.8 mm		23 mm			YES		32	33.33 MHz	20	260	23 mm		CMOS			1.5 V						.8 mm	FIXED POINT	S-PBGA-B352	3	Not Qualified	100 rpm	YES	e1
HD6417750RBG200V	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	292	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.7 V		26		32		GRID ARRAY, FINE PITCH		1.4 V	75 Cel		-20 Cel			BOTTOM		2 mm		17 mm			YES		64	34 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm		CMOS			1.5 V						.8 mm	FLOATING POINT	S-PBGA-B292			200 rpm	YES
HD6417750RBG240	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	292	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.7 V		26		32		GRID ARRAY, FINE PITCH		1.4 V	75 Cel		-20 Cel			BOTTOM		2 mm		17 mm			YES		64	34 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm		CMOS			1.5 V						.8 mm	FLOATING POINT	S-PBGA-B292			240 rpm	YES
UPD30121F1-131-GA1	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	224	FBGA	SQUARE	PLASTIC/EPOXY		YES					64	2.5,3.3	GRID ARRAY, FINE PITCH	BGA224,18X18,32		70 Cel		-10 Cel			BOTTOM															CMOS		340 mA					Microprocessors		.8 mm		S-PBGA-B224		Not Qualified	131 rpm
UPD30121F1-168-GA1	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	224	FBGA	SQUARE	PLASTIC/EPOXY		YES					64	2.5,3.3	GRID ARRAY, FINE PITCH	BGA224,18X18,32		70 Cel		-10 Cel			BOTTOM															CMOS		340 mA					Microprocessors		.8 mm		S-PBGA-B224		Not Qualified	168 rpm
HD6417751RBG200V	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	292	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		26		32		GRID ARRAY, FINE PITCH		1.35 V	75 Cel		-20 Cel			BOTTOM		2 mm		17 mm			YES		32	34 MHz			17 mm		CMOS			1.5 V						.8 mm	FLOATING POINT	S-PBGA-B292			200 rpm	YES
HD6417750RBG240V	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	292	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.7 V		26		32		GRID ARRAY, FINE PITCH		1.4 V	75 Cel		-20 Cel			BOTTOM		2 mm		17 mm			YES		64	34 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm		CMOS			1.5 V						.8 mm	FLOATING POINT	S-PBGA-B292			240 rpm	YES
UPD30131F1-200-GA2-A	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	224	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA224,18X18,32		85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM											10	260			CMOS							Microprocessors		.8 mm		S-PBGA-B224	3	Not Qualified	200 rpm		e1
HD6417750RBG200	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	BALL	292	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.7 V		26		32		GRID ARRAY, FINE PITCH		1.4 V	75 Cel		-20 Cel			BOTTOM		2 mm		17 mm			YES		64	34 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm		CMOS			1.5 V						.8 mm	FLOATING POINT	S-PBGA-B292			200 rpm	YES
R7S721011VCBG	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26	NO	32		GRID ARRAY, FINE PITCH	BGA324,22X22,32	1.1 V	85 Cel	8	-40 Cel		YES	BOTTOM	YES	2.1 mm	5242880	19 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			19 mm	5242880	CMOS	8-Ch 12-Bit		1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)	.8 mm	FLOATING POINT	S-PBGA-B324			400 rpm	YES		169
UPD30122F1-180-GA1	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	224	FBGA	SQUARE	PLASTIC/EPOXY		YES					64	1.8,3.3	GRID ARRAY, FINE PITCH	BGA224,18X18,32		70 Cel		-10 Cel			BOTTOM															CMOS							Microprocessors		.8 mm		S-PBGA-B224		Not Qualified	180 rpm
HD6417705BP133BV	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA208,17X17,25		70 Cel		-20 Cel			BOTTOM															CMOS		200 mA					Microprocessors		.635 mm		S-PBGA-B208		Not Qualified	133 rpm
S3C2410X01-YOR0	Samsung	MICROPROCESSOR, RISC	COMMERCIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.8,3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		70 Cel		0 Cel			BOTTOM															CMOS							Microprocessors		.8 mm		S-PBGA-B272		Not Qualified	203 rpm
S3C24A0XXX-YA	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	337	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.2	GRID ARRAY, FINE PITCH	BGA337,23X23,20		85 Cel		-40 Cel			BOTTOM															CMOS			1.2 V				Microprocessors		.5 mm		S-PBGA-B337		Not Qualified	200 rpm
S3C2413X26-YQ8N	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA289,17X17,32		85 Cel		-40 Cel			BOTTOM															CMOS							Microprocessors		.8 mm		S-PBGA-B289		Not Qualified	266 rpm
S3C2440AXX-YQ	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	2.5/3.3,3.3	GRID ARRAY, FINE PITCH	BGA289,17X17,32		85 Cel		-40 Cel			BOTTOM															CMOS							Microprocessors		.8 mm		S-PBGA-B289		Not Qualified	400 rpm
S3C2412X20-YO80	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel		-40 Cel			BOTTOM											NOT SPECIFIED	NOT SPECIFIED			CMOS		.1 mA					Microprocessors		.8 mm		S-PBGA-B272		Not Qualified	20 rpm
S3C2410A01-YOR0	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel		-40 Cel			BOTTOM															CMOS							Microprocessors		.8 mm		S-PBGA-B272		Not Qualified	266 rpm
S3C2412X26-YO8N	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	FBGA	SQUARE	PLASTIC/EPOXY		YES					32	1.8/3.3	GRID ARRAY, FINE PITCH	BGA272,17X17,32		85 Cel		-40 Cel			BOTTOM															CMOS		.1 mA					Microprocessors		.8 mm		S-PBGA-B272		Not Qualified	20 rpm

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.