FBGA Microprocessors 830

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
AM6411AKCGHAALV	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		0		64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel			BOTTOM		2.652 mm	1048576	17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES		16	25 MHz			17.2 mm		CMOS			.75 V						.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
T2080NXN8MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		64		GRID ARRAY, FINE PITCH	BGA896,30X30,32	.995 V	105 Cel	12	-40 Cel			BOTTOM		2.61 mm		25 mm			YES		64		30	250	25 mm		CMOS			1.025 V			8			.8 mm	FIXED POINT	S-PBGA-B896	3		1200 rpm	NO
TMS320DM8147SCYE1	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28		32	1.1/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.06 mm	8192	23 mm			YES		16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS			1.35 V	72			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
DRA829VMTGBALFR	Texas Instruments	MICROPROCESSOR, RISC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0		64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER		BOTTOM		2.8 mm	3670016	24 mm			YES		32	27 MHz		250	24 mm		CMOS			.8 V			31			.8 mm	FIXED POINT	S-PBGA-B827	3		2000 rpm	YES	e1
T1013NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		19 mm			YES		32		40	260	19 mm		CMOS		5 mA	1 V	2		5			.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T1042NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm			YES		64	133.3 MHz	30	250	23 mm		CMOS			1 V						.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
XTDA4VMXXXGALF	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0		64		GRID ARRAY, FINE PITCH	BGA827,29X29,32	.77 V	125 Cel		-40 Cel			BOTTOM		2.8 mm	5242880	24 mm			YES		32	27 MHz			24 mm		CMOS			.8 V						.8 mm	FLOATING POINT	S-PBGA-B827			1000 rpm	YES
AM5K2E04XABD4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		16				GRID ARRAY, FINE PITCH		.95 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		3.55 mm	2097152	27 mm			YES		64		30	245	27 mm		CMOS			1 V	5					.8 mm	FLOATING POINT	S-PBGA-B1089	4		1400 rpm	YES	e1
AM6412BKCGGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		14		64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel			BOTTOM		2.652 mm	2359296	17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES		16	25 MHz			17.2 mm		CMOS			.75 V			7			.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
AM6412BSCGGAALV	Texas Instruments	MICROPROCESSOR, RISC		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		14		64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel			BOTTOM		2.652 mm	2359296	17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES		16	25 MHz			17.2 mm		CMOS			.75 V			7			.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
MCIMX6Q4AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm		21 mm		PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.	YES		64		40	260	21 mm		CMOS									.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
P1010NXN5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		32		40	260	19 mm		CMOS			1 V	4			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
R7S721001VCBG	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		26	NO	32		GRID ARRAY, FINE PITCH	BGA324,22X22,32	1.1 V	85 Cel	8	-40 Cel		YES	BOTTOM	YES	2.1 mm	10485760	19 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			19 mm	10485760	CMOS	8-Ch 12-Bit		1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)	.8 mm	FLOATING POINT	S-PBGA-B324			400 rpm	YES		169
T1013NSN7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel			BOTTOM		2.07 mm		19 mm			YES		32				19 mm		CMOS		5 mA	1 V	2		5			.8 mm	FIXED POINT	S-PBGA-B525			1000 rpm	YES
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		19 mm			YES		32		40	260	19 mm		CMOS		5 mA	1 V	2		5			.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
TMS320DM8147SCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		28		32	1.1/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.06 mm	8192	23 mm			YES		16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS			1.2 V	72			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
TMS320DM8148CCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		28		32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.06 mm	16384	23 mm			YES		16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS			1.2 V	72			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
P1010NSE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	Tin/Silver (Sn/Ag)		BOTTOM		1.9 mm		19 mm			YES		32		40	260	19 mm		CMOS			1 V	4			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
T1022NXN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		32		GRID ARRAY, FINE PITCH		.97 V						BOTTOM		2.07 mm		23 mm			YES		64	133.3 MHz	30	250	23 mm		CMOS			1 V						.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES
P1010NXN5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16				GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER		BOTTOM		1.9 mm		19 mm			YES		32		40	260	19 mm		CMOS			1 V	4					.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
AC80566UC005DE/SLB2C	Intel	MICROPROCESSOR, RISC		BALL	441	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES						32	1.05,1.5	GRID ARRAY, FINE PITCH	BGA441,31X29,16							BOTTOM											NOT SPECIFIED	NOT SPECIFIED			CMOS		2500 mA					Microprocessors		.4 mm		R-PBGA-B441		Not Qualified	1100 rpm
AC80566UE014DW/SLB2H	Intel	MICROPROCESSOR, RISC		BALL	441	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES						32	1.05,1.5	GRID ARRAY, FINE PITCH	BGA441,31X29,16							BOTTOM															CMOS		2500 mA					Microprocessors		.4 mm		R-PBGA-B441		Not Qualified	1330 rpm
CT80618003201AA/SLJ34	Intel	MICROPROCESSOR, RISC		BALL	676	FBGA	SQUARE	PLASTIC/EPOXY		YES						32	0.75/1.15	GRID ARRAY, FINE PITCH	BGA676,37X37,32							BOTTOM															CMOS		3500 mA					Microprocessors		.8 mm		S-PBGA-B676		Not Qualified	1.3 rpm
AM5729BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		2.96 mm		23 mm		ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES		32	32 MHz		250	23 mm		CMOS			1.15 V						.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5729BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm		23 mm		ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES		32	32 MHz	30	250	23 mm		CMOS			1.15 V						.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
CT80618003201AB	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	676	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			32		32		GRID ARRAY, FINE PITCH		.75 V	85 Cel		-40 Cel			BOTTOM		2.35 mm		22 mm			NO		32	14.318 MHz	NOT SPECIFIED	NOT SPECIFIED	22 mm		CMOS			1.05 V						.8 mm	FLOATING POINT	S-PBGA-B676			1300 rpm	YES
LS1020ASN7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm		19 mm			YES		32	133.3 MHz	40	260	19 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B525	3		800 rpm	YES	e1
LS1043ASE8PQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V			14		64		GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm		ALSO OPERATES AT 1V NOMINAL SUPPLY	YES		32		30	250	23 mm		CMOS			.9 V						.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
MCF5253CVM140	NXP Semiconductors		OTHER	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.32 V			16				GRID ARRAY, FINE PITCH		1.08 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		2.85 mm		13 mm			YES		16	35 MHz	40	260	13 mm		CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B225	3		140 rpm	NO	e1
T1022NXE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm			YES		64	133.3 MHz	30	250	23 mm		CMOS			1 V						.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
T1042ME3PQB	Teledyne E2v (Uk)	MICROPROCESSOR, RISC	MILITARY	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			32		64		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.97 V	125 Cel	12	-55 Cel			BOTTOM		2.07 mm		23 mm			YES		16	133.3 MHz			23 mm		CMOS			1 V	6		8			.8 mm	FIXED POINT	S-PBGA-B780			1400 rpm	YES
T1042NSE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm			YES		64	133.3 MHz	30	250	23 mm		CMOS			1 V						.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
TMS320DM8147BCYE1	Texas Instruments	MICROPROCESSOR, RISC		BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V			28		32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA688,28X28,32	1.28 V				TIN SILVER COPPER		BOTTOM		3.06 mm	16384	23 mm			YES		16	30 MHz	30	250	23 mm		CMOS			1.35 V				Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
TMS320DM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28		32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.06 mm	16384	23 mm			YES		16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS			1.35 V	72			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
TDA1MDRCCYEA0	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			28		32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.06 mm	16384	23 mm			YES		16	30 MHz	30	250	23 mm		CMOS			1.2 V				Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
AM5K2E04ABDA	Texas Instruments	MICROPROCESSOR, RISC		BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.997 V			16				GRID ARRAY, FINE PITCH		.902 V						BOTTOM		3.55 mm		27 mm			YES		64				27 mm		CMOS			.95 V						.8 mm	FLOATING POINT	S-PBGA-B1089			1000 rpm	YES
AM5K2E02DABDA4	Texas Instruments	MICROPROCESSOR, RISC		BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.997 V			16				GRID ARRAY, FINE PITCH		.902 V						BOTTOM		3.55 mm		27 mm			YES		64				27 mm		CMOS			.95 V						.8 mm	FLOATING POINT	S-PBGA-B1089			1400 rpm	YES
66AK2E05XABDA25	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		16				GRID ARRAY, FINE PITCH		.95 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.55 mm	2097152	27 mm			YES		16		30	245	27 mm		CMOS			1 V	5					.8 mm	FLOATING POINT	S-PBGA-B1089	4		1250 rpm	YES	e1
PM3872BCYEA100	Texas Instruments	MICROPROCESSOR		BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				15		32		GRID ARRAY, FINE PITCH								BOTTOM		3.06 mm		23 mm			YES		32	30 MHz			23 mm		CMOS									.8 mm	FLOATING POINT	S-PBGA-B684		Not Qualified	1000 rpm	YES
AM5K2E02SABD25	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.997 V			16				GRID ARRAY, FINE PITCH		.902 V	85 Cel		0 Cel			BOTTOM		3.55 mm		27 mm			YES		64				27 mm		CMOS			.95 V						.8 mm	FLOATING POINT	S-PBGA-B1089			1250 rpm	YES
PM3874BCYEA100	Texas Instruments	MICROPROCESSOR		BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				15		32		GRID ARRAY, FINE PITCH								BOTTOM		3.06 mm		23 mm			YES		32	30 MHz			23 mm		CMOS									.8 mm	FLOATING POINT	S-PBGA-B684		Not Qualified	1000 rpm	YES
X66AK2E05XABD25	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16				GRID ARRAY, FINE PITCH		.95 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		3.55 mm		27 mm			YES		16		30	245	27 mm		CMOS			1 V						.8 mm	FLOATING POINT	S-PBGA-B1089	4		1250 rpm	YES	e1
AM5K2E04SABD4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.997 V			16				GRID ARRAY, FINE PITCH		.902 V	85 Cel		0 Cel			BOTTOM		3.55 mm		27 mm			YES		64				27 mm		CMOS			.95 V						.8 mm	FLOATING POINT	S-PBGA-B1089			1400 rpm	YES
AM5K2E04SABDA	Texas Instruments	MICROPROCESSOR, RISC		BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.997 V			16				GRID ARRAY, FINE PITCH		.902 V						BOTTOM		3.55 mm		27 mm			YES		64				27 mm		CMOS			.95 V						.8 mm	FLOATING POINT	S-PBGA-B1089			1000 rpm	YES
66AK2E05XABD4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		16				GRID ARRAY, FINE PITCH		.95 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		3.55 mm	2097152	27 mm			YES		16		30	245	27 mm		CMOS			1 V	5					.8 mm	FLOATING POINT	S-PBGA-B1089	4		1400 rpm	YES	e1
AM5K2E02SABDA	Texas Instruments	MICROPROCESSOR, RISC		BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.997 V			16				GRID ARRAY, FINE PITCH		.902 V						BOTTOM		3.55 mm		27 mm			YES		64				27 mm		CMOS			.95 V						.8 mm	FLOATING POINT	S-PBGA-B1089			1000 rpm	YES
TDA2HABRQAASQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16		32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel			BOTTOM		2.95 mm		17 mm			YES		32	38.4 MHz			17 mm		CMOS			1.15 V						.65 mm	FLOATING POINT	S-PBGA-B625			750 rpm	YES
AM5K2E02SABD	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.997 V			16				GRID ARRAY, FINE PITCH		.902 V	85 Cel		0 Cel			BOTTOM		3.55 mm		27 mm			YES		64				27 mm		CMOS			.95 V						.8 mm	FLOATING POINT	S-PBGA-B1089			1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.