HBGA Microprocessors 1,238

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8572EVTAVNE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.045 V				TIN SILVER	BOTTOM	3.38 mm	33 mm		YES	64	133 MHz	30	245	33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023	3		1500 rpm	YES	e2
MPC875VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e1
MPC8569ECVJAUNLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8541ECVTALE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8544ECVJALFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	133 MHz	40	260	29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8313CZQAGDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e0
MPC8313ECZQAGDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B516	3		400 rpm	YES	e0
MPC8569EVTAULJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8533EVJAQG	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES
MPC8313EZQAFFC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e0
MPC8569ECVTAQNJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8569EVJANNLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8536ECVJATH	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V					BOTTOM	2.76 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1250 rpm	YES
MPC8569EVTAUKL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8377VRALD	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MPC8544EBVJALJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8377CVRAJD	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8544ECVJAQF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES
MPC8544ECVTALJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8569ECVTANNGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8544EBVTANF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MC8640DVJ1000HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	1.05 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1000 rpm	NO	e2
MPC8569EVJAUNGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8569ECVJAQNJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8544ECVJANGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	133 MHz	40	260	29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		800 rpm	YES	e2
MPC8533EVTANFA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8536EBVJAQGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V				TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64	133 MHz	40	260	29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1000 rpm	YES	e2
MPC8544EVJALFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	133 MHz	40	260	29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC870VR80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e1
MPC8536EAVJAQG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V					BOTTOM	2.76 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8569ECVJAULG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8536ECVJANGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V					BOTTOM	2.76 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	800 rpm	YES
MPC8323ECZQADDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	14			GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.55 mm	27 mm		YES	32				27 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B516			266 rpm	YES
MPC8544EBVTALJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8569ECVJAQKLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8535EAVJATLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.76 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1250 rpm	YES
MPC8544ECVTANFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8358ZQADDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	668	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V				TIN LEAD SILVER	BOTTOM	2.46 mm	29 mm		YES	32	66.67 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B668		Not Qualified	266 rpm	YES	e0
MPC870CZT133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e0
MPC8569ECVTAUNGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8541VTAJD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	533 rpm	YES	e2
MPC8569EVTAQLLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8569ECVTAUKJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8313EVRAFFA	NXP Semiconductors	MICROPROCESSOR		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	YES	e1
MPC8379ECVRAGGA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8533EVJARFA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8569ECVJANNJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8541ECPXAQD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.3 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.