HBGA Microprocessors 1,238

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8378EVRALD	NXP Semiconductors	MICROPROCESSOR		BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.46 mm	31 mm		YES		66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MPC8569ECVJANNLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
SPC5123YVY300BR	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	AEC-Q100	0	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	0	35 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS		1.4 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	300 rpm	YES
MPC8377CVRAJF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE		689	HBGA	SQUARE	PLASTIC/EPOXY	YES		1.05 V		15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MC8640HJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO
MPC8541ECPXALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8378EVRAJD	NXP Semiconductors	MICROPROCESSOR		BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.46 mm	31 mm		YES		66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8569ECVTAQLLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8569ECVTAUNJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8379ECVRAND	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V	4		1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8569EVJAQNJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8544EVTARJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		1067 rpm	YES	e2
MPC8569EVJAUKJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8377VRANDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8569EVTANNLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MC8640DVU1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz			33 mm	CMOS		1.05 V	4		1 mm	FLOATING POINT	S-CBGA-B1023			1250 rpm	NO
MPC8569ECVJAQLJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8544ECVJARJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8544EVJALJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8569ECVJAQKJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8544ECVTAQF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES
MPC8569EVTAUKLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8541EPXAPE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8569ECVJAUNGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8544EVJARGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8378EVRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8569EVJAQNJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8541EPXAKF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8544EVTARG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8378CVRAJD	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8379ECVRAJG	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MC8640TVJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO	e2
MPC8377VRALFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MPC8377VRAJD	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8569EVJAUNJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8544EBVJANJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8544EVJALG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8536EAVJAVL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.045 V					BOTTOM	2.76 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1500 rpm	YES
MPC8536EAVJAULA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V				TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64	133 MHz	40	260	29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1333 rpm	YES	e2
MPC8569ECVTANNJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC875CZT66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
MPC8569EVJAQKLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8313EVRAGDA	NXP Semiconductors	MICROPROCESSOR		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	YES	e1
MPC8544EBVTAQFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES
MPC8569ECVTANNJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8569ECVJANLJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8533EVJALJA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8535EBVJATHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.76 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1250 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.