HBGA Microprocessors 1,238

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8541EPXAQE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8569EVJAUNGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8377VRAGF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8569ECVTAUKJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8313CVRAGD	NXP Semiconductors	MICROPROCESSOR		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8358EZQAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	668	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V				Tin/Lead (Sn/Pb)	BOTTOM	2.46 mm	29 mm		YES	32	66.67 MHz	40	260	29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B668	3	Not Qualified	400 rpm	YES	e0
MPC8541EVTALD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8569ECVTAQKJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8536EAVJAUL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V					BOTTOM	2.76 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1333 rpm	YES
MPC8569EVJAQNL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8533EVJANF	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8358EVRADDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	668	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V				TIN SILVER COPPER	BOTTOM	2.46 mm	29 mm		YES	32	66.67 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B668		Not Qualified	266 rpm	YES	e1
MPC8533EVJARJ	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MC8640TVJ1000HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel		BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz			33 mm	CMOS		1.05 V	4		1 mm	FLOATING POINT	S-CBGA-B1023			1000 rpm	NO
SPC5123YVY300B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	AEC-Q100	0	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	0	35 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS		1.4 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B516		Not Qualified	300 rpm	YES
T4081NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS					1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
MPC8569EVTAQKL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8541CVTAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8569ECVJAUNLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8544ECVJARG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8569EVTANNG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8569EVJANKLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8313CZQAFFA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	YES	e0
MPC8569EVTAQNGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8569EVTAQLGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8378CVRAJF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8569ECVTAUNLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8377ECVRALDA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MPC8379ECVRAGF	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8541CPXAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8572EPXAVNE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32		GRID ARRAY, HEAT SINK/SLUG		1.045 V				TIN LEAD SILVER	BOTTOM	3.38 mm	33 mm		YES	64	133 MHz	30	245	33 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023	3		1500 rpm	YES	e0
MPC8377EVRALFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MPC8377ECVRANDA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8541EPXAQF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	30	245	29 mm	CMOS		1.3 V			1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	1000 rpm	YES	e0
MPC8379ECVRAJD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8379ECVRANF	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V	4		1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8313EZQADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516	3		266 rpm	YES	e0
MPC8569ECVJAQNGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8379EVRAGDA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS		1 V	4	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	400 rpm	YES	e2
MPC8541ECPXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8533EVTANG	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8569EVTANKLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8379EVRAGD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8377CVRANDA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8544EVTANF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8569ECVJAQLG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8314ECVRAFDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2
MPC8541CVTALF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.