HBGA Microprocessors 1,238

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
P5040PSE72QB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5020NSN1MMB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, HEAT SINK/SLUG		.95 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
P5010NSE1MMB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, HEAT SINK/SLUG		.95 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
P5040PSN7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5040PSN72QB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5010NSE7VNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
P5040NXE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P4040NXN7MMC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1295,36X36,40	.95 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1200 rpm	YES	e1
P5040PXE72QC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5040PSE7VNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5040PXE12QC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
SCIMX6Q5EYM10CC	NXP Semiconductors	MICROPROCESSOR	BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64	1.05/1.5	GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.35 V		BOTTOM	1.6 mm		21 mm	YES	64	24 MHz	NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS	3920 mA		Graphics Processors	.8 mm	FIXED POINT	S-PBGA-B624		Not Qualified	1000 rpm	YES
P5040NSN12QC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
MSC8152TAG1000B	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,2.5	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.97 V	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm	YES	64		30	245	29 mm	CMOS		1 V	Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	1000 rpm	YES	e1
P5040NSN1VNC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
T4161NSE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG			TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm	YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
P5010NSE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
P5010NXE7QMB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
P5040PSE7VNC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5040PXE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5010NSN7MMB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, HEAT SINK/SLUG		.95 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
P5010NSN7TNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040PSN12QC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5040PXN1VNC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5040NSN7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5020NSE7TNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5010NXN1TNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040NXE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040NSN72QC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295	3		2200 rpm	YES	e1
P5040NXN12QB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5020NSN7TNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040NSE7VNC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
P5010NSE1TNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040PSE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5040NXE12QB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P4040NXN1MMB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, HEAT SINK/SLUG		.95 V	TIN SILVER COPPER OVER NICKEL	BOTTOM	3.53 mm		37.5 mm	YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES
P4040NSE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1295,36X36,40	.95 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V	Microprocessors	1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1500 rpm	YES	e1
P5020NXN7QMB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
P5040NSE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P4040NSE7PNAC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, HEAT SINK/SLUG		.97 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V		1 mm	FIXED POINT	S-PBGA-B1295			1500 rpm	YES	e1
P5010NXN7TNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040PXN72QC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5010NXN1QMB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
P5020NSE7QMB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
P5010NXE7TNB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040PXE72QB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5010NSE7QMB	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
P5040NSE1TMC	NXP Semiconductors	MICROPROCESSOR, RISC	BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.