HBGA Microprocessors 1,238

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8569ECVTAQNL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8572EVTATLE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.045 V				TIN SILVER	BOTTOM	3.38 mm	33 mm	YES	64	133 MHz	30	245	33 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B1023	3		1200 rpm	YES	e2
MPC8569ECVTANNGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8569ECVTAULL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MC8640VU1000HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm	YES	32	166.66 MHz			33 mm	CMOS	1.05 V	4		1 mm	FLOATING POINT	S-CBGA-B1023			1000 rpm	NO
P1022NSE2EFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	YES	64		40	260	31 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B689	3		600 rpm	YES	e2
MPC8378ECVRANF	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm	YES	64				31 mm	CMOS	1.05 V	4		1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8536EAVJANG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V					BOTTOM	2.76 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	800 rpm	YES
MC7410VU500LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V					BOTTOM	2.8 mm	25 mm	YES	64	133 MHz	40	260	25 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	500 rpm	YES
MPC8569ECVTANNJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MC8640VU1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm	YES	32	166.66 MHz	NOT SPECIFIED	NOT SPECIFIED	33 mm	CMOS	1.05 V	4	Microprocessors	1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1250 rpm	NO
MPC8569ECVJAULGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8378ECVRAGG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32		GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm	YES		66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8377VRANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32	1.05,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	YES	64		40	260	31 mm	CMOS	1.05 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	800 rpm	YES	e2
MPC8536EBVJAQG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V					BOTTOM	2.76 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC875CVR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm	YES	32		30	245	23 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC8541PXAJF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC870CZT66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	2.54 mm	23 mm	YES	32		30	245	23 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
MPC8544EVTARGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8541EPXAKD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8569EVTANKJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8533EVJANGA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.8 mm	29 mm	YES	64	133 MHz	40	260	29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		800 rpm	YES
MPC8569ECVTAULLA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8379EVRAGGA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm	YES	64				31 mm	CMOS	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8569ECVJAULGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8569EVTANNJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8377CVRAJG	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm	YES	64				31 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8536ECVJATHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V				TIN SILVER	BOTTOM	2.76 mm	29 mm	YES	64	133 MHz	40	260	29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1250 rpm	YES	e2
MPC8569EVTANNJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8379CVRALGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	YES	64		40	260	31 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	667 rpm	YES	e2
MPC8544EVJARFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8569EVJANKJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8533EVJALF	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC8569ECVJAUKJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8358VRADDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	668	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V				TIN SILVER COPPER	BOTTOM	2.46 mm	29 mm	YES	32	66.67 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B668		Not Qualified	266 rpm	YES	e1
MPC8544EBVJANFA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8536EAVJANGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V				TIN SILVER	BOTTOM	2.76 mm	29 mm	YES	64	133 MHz	40	260	29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	800 rpm	YES	e2
MPC8533EVJAQGA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm	YES	64	133 MHz	40	260	29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
MPC8535ECVJAKG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.76 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			600 rpm	YES
MPC8314ECVRAGDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm	YES		66.67 MHz	40	260	29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8358ZQAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	668	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V				Tin/Lead (Sn/Pb)	BOTTOM	2.46 mm	29 mm	YES	32	66.67 MHz	40	260	29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B668	3	Not Qualified	400 rpm	YES	e0
MPC8377EVRANFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm	YES	64				31 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
T4081NSE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm	YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
MPC8541CPXAQF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm	YES	64	166 MHz			29 mm	CMOS	1.3 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8544ECVJAQJ	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES
MPC8379ECVRALFA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm	YES	64				31 mm	CMOS	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MPC8544ECVJARF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm	YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8533EVJALGA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm	YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.