HBGA Microprocessors 1,238

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8314VRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8569EVTAUNLB	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V		16	32	1.1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.067 V				TIN SILVER COPPER OVER NICKEL	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz	30	245	29 mm	CMOS		1.1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1333 rpm	YES
MCIMX536AVV8CR2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		26	32	1.1,1.3,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	1450 mA	1.1 V		Graphics Processors	.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES	e2
MPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		32			GRID ARRAY, HEAT SINK/SLUG		1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V			1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8313EVRAFFC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8315CVRAFDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA620,28X28,40	.95 V				TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2
MPC8358ECZQAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	668	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V				TIN LEAD	BOTTOM	2.46 mm	29 mm		YES	32	66.67 MHz	40	260	29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B668	3	Not Qualified	400 rpm	YES	e0
LS1046ASE8Q1A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	HBGA	SQUARE	PLASTIC/EPOXY		YES						GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm					30	250	23 mm	CMOS					.8 mm		S-PBGA-B780	3		64 rpm		e1
XAM3517AZER	Texas Instruments	MICROPROCESSOR		BALL	484	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		16			GRID ARRAY, HEAT SINK/SLUG		1.152 V				TIN SILVER COPPER	BOTTOM	2.48 mm	23 mm		YES	16	26 MHz			23 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
MC8640DTVJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO	e2
MPC8544CVTALF	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8544CVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
SPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	AEC-Q100	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8323EVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		14			GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516			266 rpm	YES
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8377VRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS	.03 mA	1 V	4	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	400 rpm	YES	e2
MPC875VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
T4081NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS					1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
MPC8323EVRAFDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		14			GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516			333 rpm	YES
MPC7410HX500LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V		32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V				TIN LEAD	BOTTOM	3.2 mm	25 mm		YES	64	133 MHz	40	260	25 mm	CMOS		1.8 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	500 rpm	YES	e0
CH80566EE014DT/SLGPP	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	437	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	AEC-Q100	28	64	1	GRID ARRAY, HEAT SINK/SLUG	BGA437,21X21,40	.9 V	85 Cel		-40 Cel		BOTTOM	2.792 mm	22 mm	IT ALSO OPERATES IN 800 MHZ AT 0.9V SUPPLY	YES	64		NOT SPECIFIED	NOT SPECIFIED	22 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B437		Not Qualified	1330 rpm	YES
MPC5123VY400B	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
P1013NSN2LFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B689	3		1067 rpm	YES	e2
P4040NSE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1295,36X36,40	.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1200 rpm	YES	e1
MPC8569ECVJAQLJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.97 V				TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz	30	245	29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1067 rpm	YES	e1
MPC8544EAVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.95 V				Tin/Silver (Sn/Ag)	BOTTOM	2.8 mm	29 mm		YES	32	1000 MHz	40	260	29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	400 rpm	NO	e2
RJ80530KZ800512	Intel	MICROPROCESSOR		BALL	479	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			36	32	1.15,1.25	GRID ARRAY, HEAT SINK/SLUG	BGA479,26X26,50						BOTTOM	2.77 mm	35 mm		YES	64	133 MHz			35 mm	CMOS		1.15 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B479		Not Qualified	800 rpm	YES
MPC8313ECVRAFFC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	NICKEL GOLD	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e4
D6417750RBA240HVU0	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		26	32		GRID ARRAY, HEAT SINK/SLUG		1.35 V	85 Cel		-40 Cel		BOTTOM	2.6 mm	27 mm		YES	64	34 MHz			27 mm	CMOS		1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B256	3		240 rpm	YES
MC8640DTHJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		-40 Cel		BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO
MPC5200CVR400	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13			GRID ARRAY, HEAT SINK/SLUG		1.42 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm	27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.5 V			1.27 mm	FIXED POINT	S-PBGA-B272	3		400 rpm	YES	e1
MPC8313ECVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313ECVRAGDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8313EVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313EVRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313ZQAFFC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e0
MPC8541EVTALF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC8569EVJANKGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.97 V				TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz	30	245	29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	800 rpm	YES	e1
SCIMX6Q5EYM10CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, HEAT SINK/SLUG		1.35 V					BOTTOM	1.6 mm	21 mm		YES	64	24 MHz			21 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES
TDA2SXBTQABCQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	760	HBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	AEC-Q100	16	32		GRID ARRAY, HEAT SINK/SLUG		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1176 rpm	YES	e1
XAM3715CBC	Texas Instruments	MICROPROCESSOR		BALL	515	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16			GRID ARRAY, HEAT SINK/SLUG							BOTTOM	1 mm	14 mm		YES	16	38.4 MHz			14 mm	CMOS					.5 mm	FLOATING POINT	S-PBGA-B515		Not Qualified	1000 rpm	YES
TMS320DM8127BCYE3L	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		16			GRID ARRAY, HEAT SINK/SLUG		1.28 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	23 mm		YES	32	30 MHz	30	250	23 mm	CMOS		1.35 V			.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
P5020NSN1QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
T4161NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS					1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
P5040NXE1TMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5040NXE7VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
T4161NXE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS					1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
P5040NXE72QB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.