HBGA Microprocessors 1,238

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
P5040PSE1TMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5040NXN12QC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
T4161NSE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1500 rpm	YES	e1
P5020NSE1QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
P5020NSE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
T4160NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
P5010NSE1QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
P5040PSN7VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5040PSE1TMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5040NXE72QC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295	3		2200 rpm	YES	e1
P5040NXN7VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5040PSE72QC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5020NXE7QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
MPC755CPX350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.8 V				TIN LEAD	BOTTOM	2.77 mm	25 mm		YES	64	100 MHz	30	245	25 mm	CMOS	2 V			1.27 mm	FLOATING POINT	S-PBGA-B360	3		350 rpm	YES	e0
C5ENPA1-DS/D	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	840	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.26 V	12	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	125 Cel		-40 Cel		BOTTOM	3.55 mm	30.8 mm		YES	139	266 MHz			30.8 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-CBGA-B840			266 rpm	NO
MPC7410HX450LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	3.2 mm	25 mm		YES	64	133 MHz	40	260	25 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	450 rpm	YES	e0
MPC7410VS500LE	NXP Semiconductors	MICROPROCESSOR, RISC		BUTT	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V					BOTTOM	2.2 mm	25 mm		YES	64	133 MHz	40	260	25 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-CBGA-BU360	1	Not Qualified	500 rpm	YES
C3ENPB0-DS	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	728	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.26 V	12	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	125 Cel		-40 Cel		BOTTOM	3.39 mm	28.8 mm		YES	139	180 MHz			28.8 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-CBGA-B728			180 rpm	NO
C3ENPA1-DS/D	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	728	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V	12	32		GRID ARRAY, HEAT SINK/SLUG		1.04 V	125 Cel		-40 Cel		BOTTOM	3.39 mm	28 mm		YES	139	180 MHz			28 mm	CMOS	1.16 V			1 mm	FIXED POINT	S-CBGA-B728			180 rpm	NO
MPC7410HX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V				TIN LEAD	BOTTOM	3.2 mm	25 mm		YES	64	133 MHz	30	245	25 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	400 rpm	YES	e0
MPC755CRX350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.8 V				Tin/Lead (Sn/Pb)	BOTTOM	3.2 mm	25 mm		YES	64	100 MHz	30	220	25 mm	CMOS	2 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1		350 rpm	YES	e0
MPC755BRX350TE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.8 V				Tin/Lead (Sn/Pb)	BOTTOM	3.2 mm	25 mm		YES	64	100 MHz	30	220	25 mm	CMOS	2 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1		350 rpm	YES	e0
MPC755CRX400TE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.9 V				Tin/Lead (Sn/Pb)	BOTTOM	3.2 mm	25 mm		YES	64	100 MHz	30	220	25 mm	CMOS	2 V			1.27 mm	FLOATING POINT	S-CBGA-B360	1		400 rpm	YES	e0
MPC755CVT350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.8 V					BOTTOM	2.77 mm	25 mm		YES	64	100 MHz	40	260	25 mm	CMOS	2 V			1.27 mm	FLOATING POINT	S-PBGA-B360	3		350 rpm	YES	e2
MPC8313CVRAFFA	NXP Semiconductors	MICROPROCESSOR		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	YES	e1
MPC8379CVRAJFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	533 rpm	YES
MC860ENCVR50D4R2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA357,19X19,50	3.135 V					BOTTOM	2.52 mm	25 mm		YES	32	50 MHz			25 mm	CMOS	3.3 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	50 rpm	YES
MC8640DTVJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	.95 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO	e2
MPC8377VRAJDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8569EVJANKJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
MPC8544EBVJALGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MPC875CVR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		30	245	23 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	133 rpm	YES	e1
MPC8541ECPXAJE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8315CVRAGDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA620,28X28,40	.95 V				TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8379ECVRALGA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS	1 V	4	Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	667 rpm	YES	e2
MPC8569EVTAUKJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8536ECVJAVL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32	1,1.5/1.8,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.045 V					BOTTOM	2.76 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1500 rpm	YES
MPC8569ECVTANKLB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e1
P1023NXE5CFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	457	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	1.9 mm	19 mm		YES	32	100 MHz	40	260	19 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B457	3		500 rpm	YES	e1
MPC8569ECVJAQNJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8533EVJANFA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
MPC8377CVRALGA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	667 rpm	YES	e2
MPC8541CVTAKF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8379EVRAJGA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8569EVJAULJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8569ECVJAQNL	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e1
MPC8569EVTAUKG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V	16	32		GRID ARRAY, HEAT SINK/SLUG		1.067 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.94 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1.1 V			1 mm	FLOATING POINT	S-PBGA-B783			1333 rpm	YES	e1
MPC8541ECVTAKF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.