Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
CACHE COHERENCY |
YES |
64 |
88 MHz |
52.324 mm |
CMOS |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
88 rpm |
NO |
e0 |
||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
160 |
QFP |
SQUARE |
METAL |
NO |
YES |
0 |
32 |
32 |
FLATPACK |
85 Cel |
6 |
0 Cel |
TIN LEAD |
QUAD |
0 |
5 PIPELINE STAGES |
NO |
32 |
CMOS |
5 V |
0 |
0 |
FIXED POINT |
S-MQFP-G160 |
Not Qualified |
50 rpm |
NO |
e0 |
|||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
BALL |
264 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.7 V |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.4 V |
70 Cel |
-30 Cel |
BOTTOM |
1.4 mm |
15 mm |
YES |
64 |
34 MHz |
15 mm |
CMOS |
1.5 V |
.8 mm |
FLOATING POINT |
S-PBGA-B264 |
133 rpm |
YES |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
5.25 V |
64 |
64 |
5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
28 mm |
NO |
64 |
40 MHz |
30 |
225 |
28 mm |
CMOS |
1250 mA |
5 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
3 |
Not Qualified |
80 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
5.25 V |
32 |
64 |
5 |
FLATPACK |
QFP128,1.2SQ,32 |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.86 mm |
27.69 mm |
NO |
32 |
100 MHz |
27.69 mm |
CMOS |
1350 mA |
5 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
100 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
BALL |
271 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
3.3 |
GRID ARRAY |
BGA272,21X21,50 |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
YES |
64 |
90 MHz |
CMOS |
1100 mA |
3.3 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
R-PBGA-B271 |
Not Qualified |
180 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
8 PIPELINE STAGES |
YES |
64 |
50 MHz |
52.324 mm |
CMOS |
2000 mA |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
50 rpm |
NO |
e0 |
|||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
120 |
TFQFP |
SQUARE |
PLASTIC |
NO |
YES |
5.5 V |
8 |
32 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP120,.64SQ,16 |
4.5 V |
75 Cel |
9 |
-20 Cel |
QUAD |
1.2 mm |
4096 |
14 mm |
NO |
14 mm |
CMOS |
5 V |
4 |
.4 mm |
FIXED POINT |
S-PQFP-G120 |
20 rpm |
YES |
|||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
BALL |
272 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
GRID ARRAY, LOW PROFILE |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.7 mm |
29 mm |
YES |
64 |
250 MHz |
29 mm |
MOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
Not Qualified |
250 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
32 |
64 |
FLATPACK |
2.97 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
100 MHz |
28 mm |
CMOS |
3.3 V |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
200 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
100 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
200 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
8 PIPELINE STAGES; CACHE COHERENCY |
YES |
64 |
67 MHz |
52.324 mm |
CMOS |
2400 mA |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
67 rpm |
NO |
e0 |
|||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
120 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.5 V |
64 |
3.3 |
FLATPACK |
QFP120,1.2SQ,32 |
3 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.5 mm |
28 mm |
YES |
100 MHz |
28 mm |
CMOS |
510 mA |
3.3 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PQFP-G120 |
Not Qualified |
100 rpm |
NO |
e0 |
||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
84 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
32 |
32 |
GRID ARRAY |
4.75 V |
85 Cel |
6 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
5.207 mm |
0 |
30.6705 mm |
5 PIPELINE STAGES; CACHE COHERENCY SUPPORT; 35 VUPS AND 64000 DHRYSTONES AND 11 MFLOPS LINPACK |
NO |
32 |
80 MHz |
30.6705 mm |
CMOS |
1200 mA |
5 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P84 |
Not Qualified |
40 rpm |
YES |
e0 |
|||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
PERPENDICULAR |
5.207 mm |
47.244 mm |
NO |
64 |
50 MHz |
47.244 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
100 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
3.3 |
FLATPACK |
QFP128,1.2SQ,32 |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.86 mm |
27.69 mm |
NO |
32 |
100 MHz |
30 |
225 |
27.69 mm |
CMOS |
950 mA |
3.3 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
200 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP208,1.2SQ,20 |
3.135 V |
85 Cel |
6 |
0 Cel |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
90 MHz |
28 mm |
CMOS |
1200 mA |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
180 rpm |
YES |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
64 |
64 |
FLATPACK, FINE PITCH |
2.375 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
125 MHz |
28 mm |
CMOS |
2.5 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
200 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
64 |
64 |
FLATPACK, FINE PITCH |
2.97 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
100 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
3 |
Not Qualified |
200 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
150 MIPS; 8 PIPELINE STAGES |
YES |
64 |
75 MHz |
52.324 mm |
CMOS |
2800 mA |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
75 rpm |
NO |
e0 |
|||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
OTHER |
BALL |
399 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
32 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.12 V |
85 Cel |
0 Cel |
BOTTOM |
1.7 mm |
17 mm |
YES |
32 |
12 MHz |
17 mm |
CMOS |
1.22 V |
.8 mm |
FLOATING POINT |
S-PBGA-B399 |
Not Qualified |
400 rpm |
YES |
||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
299 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
32 |
32 |
GRID ARRAY |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.7564 mm |
52.324 mm |
NO |
64 |
30 |
225 |
52.324 mm |
MOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P299 |
Not Qualified |
66 rpm |
NO |
e0 |
|||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
OTHER |
BALL |
399 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
32 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.12 V |
85 Cel |
0 Cel |
BOTTOM |
1.7 mm |
17 mm |
YES |
32 |
12 MHz |
17 mm |
CMOS |
1.22 V |
.8 mm |
FLOATING POINT |
S-PBGA-B399 |
Not Qualified |
500 rpm |
YES |
||||||||||||||||||||||||||||||||||
|
Broadcom |
MICROPROCESSOR |
OTHER |
BALL |
372 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
15 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.95 V |
85 Cel |
0 Cel |
BOTTOM |
1.4 mm |
19 mm |
YES |
16 |
260 |
19 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B372 |
3 |
333 rpm |
YES |
|||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
OTHER |
BALL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2 V |
27 |
32 |
GRID ARRAY |
1.7 V |
85 Cel |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
YES |
32 |
60 MHz |
CMOS |
1.8 V |
FIXED POINT |
S-PBGA-B119 |
2 |
Not Qualified |
60 rpm |
YES |
e1 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.