OTHER Microprocessors 1,705

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8377EVRANDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		0 Cel		BOTTOM	2.46 mm			31 mm		YES	64				31 mm		CMOS		1.05 V					1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8347ZQALDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm			29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm		CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES
P1010CSE5DHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm			19 mm		YES	32				19 mm		CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MC9328MX1DVM15R2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25	32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel		-30 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm			14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	14 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MC8640VU1000HC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		32	32		GRID ARRAY		1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.97 mm			33 mm		YES	32	166.66 MHz	30	245	33 mm		CMOS		1.05 V					1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1000 rpm	YES	e2
MPC8535AVJAQGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY		.95 V	90 Cel		0 Cel		BOTTOM	2.76 mm			29 mm		YES	64				29 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			1000 rpm	YES
MPC8272VRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V		32	32		GRID ARRAY		1.425 V	105 Cel		0 Cel		BOTTOM	2.55 mm			27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66 MHz			27 mm		CMOS		1.5 V					1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8555PXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm			29 mm		YES	64	166 MHz			29 mm		CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8347EVVAJDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm			35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm		CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	533 rpm	YES
MPC8541EPXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	3.75 mm			29 mm		YES	64	166 MHz	30	245	29 mm		CMOS		1.2 V					1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	833 rpm	YES	e0
MPC8541VTAQD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		0 Cel		BOTTOM	3.75 mm			29 mm		YES	64	166 MHz			29 mm		CMOS		1.3 V					1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8349ZUALD	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm			35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm		CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B672	1	Not Qualified	667 rpm	YES
SAB-R3000-20-QF	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	FLAT	172	QFF	SQUARE	CERAMIC		YES				32	5	FLATPACK	QFL172,1.2SQ,25		90 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS	630 mA	5 V			Microprocessors		.635 mm		S-XQFP-F172		Not Qualified	20 rpm		e0
SAB-R3000-16-A	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	PIN/PEG	144	PGA	SQUARE	CERAMIC		NO				32	5	GRID ARRAY	PGA144,15X15		90 Cel		0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR													CMOS	600 mA	5 V			Microprocessors		2.54 mm		S-XPGA-P144		Not Qualified	16.67 rpm		e0
SAB-R3000-25-A	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	PIN/PEG	144	PGA	SQUARE	CERAMIC		NO				32	5	GRID ARRAY	PGA144,15X15		90 Cel		0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR													CMOS	650 mA	5 V			Microprocessors		2.54 mm		S-XPGA-P144		Not Qualified	25 rpm		e0
R4000MC-75	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	PIN/PEG	447	PGA	SQUARE	CERAMIC		NO				64	5	GRID ARRAY	SPGA447,39X39		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR													CMOS	1820 mA	5 V			Microprocessors		1.27 mm		S-XPGA-P447		Not Qualified	75 rpm		e0
SAB-R3000-25-QF	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	FLAT	172	QFF	SQUARE	CERAMIC		YES				32	5	FLATPACK	QFL172,1.2SQ,25		90 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS	650 mA	5 V			Microprocessors		.635 mm		S-XQFP-F172		Not Qualified	25 rpm		e0
SAB-R3000-20-A	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	PIN/PEG	144	PGA	SQUARE	CERAMIC		NO				32	5	GRID ARRAY	PGA144,15X15		90 Cel		0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR													CMOS	630 mA	5 V			Microprocessors		2.54 mm		S-XPGA-P144		Not Qualified	20 rpm		e0
SAB80286-12-N	Infineon Technologies	MICROPROCESSOR	OTHER	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	85 Cel		0 Cel	TIN LEAD	QUAD	5.1 mm			24.3 mm		NO	16	25 MHz			24.3 mm		NMOS	600 mA	5 V			Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	12.5 rpm	YES	e0
SAB80286-16-N	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				16	5	CHIP CARRIER	LDCC68,1.0SQ		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS	600 mA	5 V			Microprocessors		1.27 mm		S-PQCC-J68		Not Qualified	16 rpm		e0
SAB80286-6-R	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	NO LEAD	68	QCCN	SQUARE	CERAMIC		YES				16	5	CHIP CARRIER	LCC68A,.95SQ		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS	500 mA	5 V			Microprocessors		1.27 mm		S-XQCC-N68		Not Qualified	6 rpm		e0
SAB80286-12-A	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	PIN/PEG	68	PGA	SQUARE	CERAMIC		NO				16	5	GRID ARRAY	PGA68,11X11		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR													CMOS	600 mA	5 V			Microprocessors		2.54 mm		S-XPGA-P68		Not Qualified	12.5 rpm		e0
SAB80286-R	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	NO LEAD	68	QCCN	SQUARE	CERAMIC		YES				16	5	CHIP CARRIER	LCC68A,.95SQ		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS	600 mA	5 V			Microprocessors		1.27 mm		S-XQCC-N68		Not Qualified	8 rpm		e0
SAB80286-12-R	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	NO LEAD	68	QCCN	SQUARE	CERAMIC		YES				16	5	CHIP CARRIER	LCC68A,.95SQ		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS	600 mA	5 V			Microprocessors		1.27 mm		S-XQCC-N68		Not Qualified	12.5 rpm		e0
SAB80286-6-N	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				16	5	CHIP CARRIER	LDCC68,1.0SQ		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS	500 mA	5 V			Microprocessors		1.27 mm		S-PQCC-J68		Not Qualified	6 rpm		e0
SAB80286-1-R	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	NO LEAD	68	QCCN	SQUARE	CERAMIC		YES				16	5	CHIP CARRIER	LCC68A,.95SQ		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS	600 mA	5 V			Microprocessors		1.27 mm		S-XQCC-N68		Not Qualified	10 rpm		e0
SAB80286-1-N	Infineon Technologies	MICROPROCESSOR	OTHER	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	85 Cel		0 Cel	TIN LEAD	QUAD	5.1 mm			24.3 mm		NO	16	20 MHz			24.3 mm		NMOS	600 mA	5 V			Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	10 rpm	YES	e0
SAB80286-A	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	PIN/PEG	68	PGA	SQUARE	CERAMIC		NO				16	5	GRID ARRAY	PGA68,11X11		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR													CMOS	600 mA	5 V			Microprocessors		2.54 mm		S-XPGA-P68		Not Qualified	8 rpm		e0
SAB80286-1-A	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	PIN/PEG	68	PGA	SQUARE	CERAMIC		NO				16	5	GRID ARRAY	PGA68,11X11		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR													CMOS	600 mA	5 V			Microprocessors		2.54 mm		S-XPGA-P68		Not Qualified	10 rpm		e0
SAB80286-N	Infineon Technologies	MICROPROCESSOR	OTHER	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	85 Cel		0 Cel	TIN LEAD	QUAD	5.1 mm			24.3 mm		NO	16	16 MHz			24.3 mm		NMOS	600 mA	5 V			Microprocessors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified	8 rpm	YES	e0
SAB80286-6-A	Infineon Technologies	MICROPROCESSOR, RISC	OTHER	PIN/PEG	68	PGA	SQUARE	CERAMIC		NO				16	5	GRID ARRAY	PGA68,11X11		85 Cel		0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR													CMOS	500 mA	5 V			Microprocessors		2.54 mm		S-XPGA-P68		Not Qualified	6 rpm		e0
TC86R4600Y-100BE	Toshiba	MICROPROCESSOR, RISC	OTHER	PIN/PEG	179	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	3.46 V	0	64	64		GRID ARRAY		3.14 V	85 Cel	7	0 Cel		PERPENDICULAR	4.52 mm		0	47.24 mm	5 PIPELINE STAGES; 100 PEAK MIPS; 33 PEAK MFLOPS; TLB	YES	64	50 MHz			47.24 mm		CMOS		3.3 V	0	0			2.54 mm	FLOATING POINT	S-CPGA-P179		Not Qualified	100 rpm	YES
TMP19A43FZXBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	193	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V		24	32	1.5,2.5,3.3	GRID ARRAY	BGA193,14X14,25	1.35 V	85 Cel		-20 Cel		BOTTOM		393216				YES	16	40 MHz				20480	CMOS	74 mA				Microcontrollers	FLASH	.635 mm	FIXED POINT	S-PBGA-B193		Not Qualified	40 rpm	NO
TMP1962C10BXBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	281	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V		24	32	1.5,2.5,3,3.3	GRID ARRAY	BGA281,18X18,25	1.35 V	85 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			13 mm	LOW POWER TAKEN FROM STANDBY MODE	YES	16	13.5 MHz			13 mm		CMOS	46 mA	1.5 V			Microprocessors		.65 mm	FIXED POINT	S-PBGA-B281		Not Qualified	40.5 rpm	YES	e1
TZ2002XBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	280	BGA	SQUARE	PLASTIC/EPOXY	YES	YES						GRID ARRAY			70 Cel		-20 Cel		BOTTOM													CMOS		1.1 V							S-PBGA-B280			200 rpm
TMP19A61C10XBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V		24	32	1.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,20X20,20	1.35 V	85 Cel		-20 Cel		BOTTOM	1.06 mm	1048576		11 mm	SEATED HGT-NOM	YES	16	13.5 MHz			11 mm	49152	CMOS	49 mA	1.5 V			Microcontrollers	MROM	.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	54 rpm	YES
TMP68HC003F	Toshiba	MICROPROCESSOR	OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V					FLATPACK		4.75 V	85 Cel		-20 Cel		QUAD	3.05 mm			14 mm				12.5 MHz			20 mm		CMOS		5 V					.8 mm		R-PQFP-G80		Not Qualified
TZ1041MBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	136	LFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH		2.1 V	70 Cel		-20 Cel		BOTTOM	1.59 mm			6.7 mm		YES	0				8 mm		CMOS		3.3 V					.5 mm	FLOATING POINT	R-PBGA-B136			48 rpm	YES
TMP19A43FDXBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	193	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V		24	32	1.5,2.5,3.3	GRID ARRAY	BGA193,14X14,25	1.35 V	85 Cel		-20 Cel		BOTTOM		524288				YES	16	40 MHz				24576	CMOS	74 mA				Microcontrollers	FLASH	.635 mm	FIXED POINT	S-PBGA-B193		Not Qualified	40 rpm	NO
TMP19A61CDXBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V		24	32	1.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,20X20,20	1.35 V	85 Cel		-20 Cel		BOTTOM	1.06 mm	524288		11 mm	SEATED HGT-NOM	YES	16	13.5 MHz			11 mm	40960	CMOS	49 mA	1.5 V			Microcontrollers	MROM	.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	54 rpm	YES
TMP1962F10AXB	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	281	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.3 V		24	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	85 Cel		-20 Cel	TIN LEAD	BOTTOM	1.4 mm			13 mm		YES	16	13.5 MHz			13 mm		CMOS		1.65 V					.65 mm	FIXED POINT	S-PBGA-B281		Not Qualified	40.5 rpm	YES	e0
TMP1962C10AXB	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	281	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.3 V		24	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	85 Cel		-20 Cel	TIN LEAD	BOTTOM	1.4 mm			13 mm		YES	16	13.5 MHz			13 mm		CMOS		1.65 V					.65 mm	FIXED POINT	S-PBGA-B281		Not Qualified	40.5 rpm	YES	e0
TMP68HC003DF-12	Toshiba	MICROPROCESSOR	OTHER	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V		24			FLATPACK		4.75 V	85 Cel		-20 Cel		QUAD					IT CAN ALSO OPERATE AT 5V +/-5% SUPPLY, BUILT-IN CLOCK GENERATOR	NO	16	4 MHz					CMOS		5 V						FIXED POINT	S-PQFP-G80		Not Qualified	4 rpm	YES
TMP19A63F10XBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V		24	32	1.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,20X20,20	1.35 V	85 Cel		-20 Cel		BOTTOM	1.06 mm	1048576		11 mm	SEATED HGT-NOM	YES	16	13.5 MHz			11 mm	49152	CMOS	70 mA	1.5 V			Microcontrollers	FLASH	.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	54 rpm	YES
TMP19A44F10XBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	241	TFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V		24	32		GRID ARRAY, THIN PROFILE, FINE PITCH		2.7 V	85 Cel		-20 Cel		BOTTOM	1.2 mm			12 mm		YES	16	10 MHz			12 mm		CMOS		3.3 V					.65 mm	FLOATING POINT	S-PBGA-B241		Not Qualified	80 rpm	YES
TMP19A43CDXBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	193	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.65 V		24	32	1.5,2.5,3.3	GRID ARRAY	BGA193,14X14,25	1.35 V	85 Cel		-20 Cel		BOTTOM		524288				YES	16	40 MHz				24576	CMOS	74 mA				Microcontrollers	MROM	.635 mm	FIXED POINT	S-PBGA-B193		Not Qualified	40 rpm	NO
TMP19A64C1DXBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	281	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	8	24	32	1.8/3.3,3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA281,18X18,25	1.35 V	85 Cel	12	-20 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	1536	57344	13 mm		YES	16	13.5 MHz			13 mm	57344	CMOS	60 mA	1.5 V	8	7	Microcontrollers	MROM	.65 mm	FIXED POINT	S-PBGA-B281		Not Qualified	54 rpm	YES	e1
TMP1962F10AXBG	Toshiba	MICROPROCESSOR, RISC	OTHER	BALL	281	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.3 V		24	32	2.5,3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA281,18X18,25	2.2 V	85 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			13 mm	LOW POWER TAKEN FROM STANDBY MODE	YES	16	13.5 MHz			13 mm		CMOS	110 mA	2.5 V			Microprocessors		.65 mm	FIXED POINT	S-PBGA-B281		Not Qualified	40.5 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.