OTHER Microprocessors 1,705

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8555EPXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MC8641VJ1250HB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel			BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023			1250 rpm	YES
MPC8541VTAKF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8347EVRAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8555VTAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
P1022NSN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
P1010NSN5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS	1 V	4	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
MPC8306VMABFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm		YES	0	66.67 MHz			19 mm	CMOS	1 V			.8 mm	FLOATING POINT	S-PBGA-B369			133 rpm	YES	e1
MPC8533VTALFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	64		40	260	29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8306VMACFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm		YES	0	66.67 MHz			19 mm	CMOS	1 V			.8 mm	FLOATING POINT	S-PBGA-B369			200 rpm	YES	e1
MPC866TZP100A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	95 Cel		Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm		YES	32		30	220	25 mm	CMOS	1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	100 rpm	YES	e0
MPC8343EZQAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel			BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	1	Not Qualified	400 rpm	YES
MPC8533CVTARF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e2
T1040NSN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		YES	64		30	250	23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES	e1
MPC8379EVRANDA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	1.05 V	4		1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8347EVVALD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm	35 mm		YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8535BVJATLA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783	3		1250 rpm	YES	e2
P1010NSE5DHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1010NSE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3		667 rpm	NO	e2
MPC8572EVJAULE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		TIN SILVER	BOTTOM	3.38 mm	33 mm		YES	64	133 MHz	30	245	33 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1023	3		1333 rpm	YES	e2
P1010CSN5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS	1 V	4		.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MCIMX6L7DVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	95 Cel		TIN SILVER COPPER	BOTTOM	1.1 mm	13 mm					40	260	13 mm	CMOS				.5 mm		S-PBGA-B	3				e1
MPC8240LZU200E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V	32	32		GRID ARRAY, LOW PROFILE		2.375 V	105 Cel			BOTTOM	1.65 mm	35 mm		YES	64	66 MHz			35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
MPC8540VT667LC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		TIN SILVER	BOTTOM	3.85 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC8533ECVTAQJ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e2
MPC8533VJALFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	64		40	260	29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8567EVTAQGG	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40	1.045 V	105 Cel			BOTTOM	2.75 mm	33 mm		YES	64		40	260	33 mm	CMOS	1.1 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B1023	3	Not Qualified	1000 rpm	YES	e2
MPC8533CVTAQF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e2
MPC8349EZUAGFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC8314VRAFDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		TIN SILVER	BOTTOM	2.46 mm	29 mm		YES		66.67 MHz	40	260	29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2
MPC8314EVRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		TIN SILVER	BOTTOM	2.46 mm	29 mm		YES		66.67 MHz	40	260	29 mm	CMOS	1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8272VRPIEX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	105 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8280ZUPKBX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	105 Cel			BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS	1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	300 rpm	NO
MPC8377EVRAJF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel			BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS	1 V	4		1 mm		S-PBGA-B689
MPC8347EZUAJFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm	35 mm		YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	1	Not Qualified	533 rpm	YES
MC8640DVJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		TIN SILVER	BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS	.95 V	4		1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO	e2
MPC8555EVTAQD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	15	32		GRID ARRAY		1.25 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS	1.3 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8347ZUAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		TIN LEAD	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8377VRAND	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel			BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8555PXALFX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8535BVTATLA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V	105 Cel			BOTTOM	2.76 mm	29 mm		YES	32				29 mm	CMOS	1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		1250 rpm	YES	e2
MPC8280ZQSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel			BOTTOM	2.55 mm	27 mm		YES	64	83.33 MHz			27 mm	CMOS	1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	375 rpm	NO
MPC8555PXAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS	1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8533VTANF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel			BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS	1 V			1 mm	FIXED POINT	S-PBGA-B783			800 rpm	YES
MPC8572ELVTATLE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel			BOTTOM	3.38 mm	33 mm		YES	64	133 MHz			33 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1023			1200 rpm	YES
MPC8555EPXAKF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MC8610PX1333JZ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.075 V	16	32		GRID ARRAY		.975 V	105 Cel			BOTTOM	2.7 mm	29 mm		YES	64				29 mm	CMOS	1.025 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1333 rpm	YES
MPC8349EVVALDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.3,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.