OTHER Microprocessors 1,705

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8536AVJAULA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783	3		1333 rpm	YES	e2
P1022NSE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	133 MHz	40	260	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689	3		800 rpm	YES	e2
MPC8555EVTAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8347EVVAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		TIN SILVER	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349VVALD	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8280ZQKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel			BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	233 rpm	NO
MPC8347ZQAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8560VT667LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		TIN SILVER	BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V			1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC8347EVRALFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES
MPC8272ZQTIEX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	105 Cel			BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66 MHz			27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC8533VJANJA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel			BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783			800 rpm	YES
MPC8555EVTAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8568VTANGG	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40		105 Cel			BOTTOM														Microprocessors	1 mm		S-PBGA-B1023		Not Qualified	800 rpm
MC8640HX1067NC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	32	32		GRID ARRAY		.9 V	105 Cel		Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V			1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1067 rpm	YES	e0
MPC8555EPXAJEX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8306SVMAFFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel		TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm		YES	0	66.67 MHz			19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B369			333 rpm	YES	e1
MPC8536BVJAULA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783	3		1333 rpm	YES	e2
MPC8377EVRANG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V				GRID ARRAY	BGA689,29X29,40	1 V	125 Cel			BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS		1.05 V	4		1 mm		S-PBGA-B689
MPC8377VRAGD	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MC8640DHX1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V	32	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		TIN LEAD	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4	Microprocessors	1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1067 rpm	NO	e0
MPC8377VRAJFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	533 rpm	YES	e2
MPC8555EVTAPEX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8533VTARF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel			BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783			1067 rpm	YES
MPC8377EVRAJDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel			BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8541PXALE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8347EZQALDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES
MC8641DVJ1000GB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel			BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023			1000 rpm	YES
MC8640DHX1067NC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	32	32		GRID ARRAY		.9 V	105 Cel		Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V			1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1067 rpm	YES	e0
MC8610VT800GB	NXP Semiconductors		OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		TIN SILVER	BOTTOM	2.7 mm	29 mm		YES	64		30	245	29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783	3		800 rpm	YES	e2
MPC8555EPXAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8555EVTALEX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8541PXALD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8541VTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8347EVVADD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm	35 mm		YES	32	66 MHz			35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	266 rpm	YES
MPC8533ECVTARG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e2
MPC8280VRMHBX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel			BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8533CVTANF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e2
MPC8560VT667FC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC862TZP66B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		105 Cel			BOTTOM												3.3 V		Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	66 rpm
MPC8349VVAGFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC8377VRANG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1.05 V	4		1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
T2081NSE8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V	16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS		1.025 V			.8 mm	FIXED POINT	S-PBGA-B780	3		1533 rpm	YES	e1
P1010CSE5DFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MPC8533VJANGA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel			BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783			800 rpm	YES
MPC8349EZUAJDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	1	Not Qualified	533 rpm	YES
MPC8533ECVTARJA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e2
MPC8533VTAQJA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel			BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783			1000 rpm	YES
MPC8555VTAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.