OTHER Microprocessors 1,705

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8347EZQADF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC8349ZUAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8555EVTAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8555EVTAKD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MC8640VJ1250HC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023			1250 rpm	YES
MPC8378EVRAGD	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8536BVJAVLA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783	3		1500 rpm	YES	e2
MPC8533VTALG	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783			667 rpm	YES
MCIMX27FVOP4A	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	404	FBGA	SQUARE	PLASTIC/EPOXY		YES				1.4	GRID ARRAY, FINE PITCH	BGA404,24X24,25		85 Cel		-20 Cel		BOTTOM										CMOS		1.4 V			Microprocessors	.635 mm		S-PBGA-B404		Not Qualified
MPC8555EPXAQDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8379VRAJFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64		40	260	31 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	533 rpm	YES	e2
MPC8572ELPXAULE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	3.38 mm	33 mm		YES	64	133 MHz	30	245	33 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1023	3		1333 rpm	YES	e0
MC8640DVU1000HC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32		GRID ARRAY		1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1000 rpm	YES	e2
MPC8533VTARFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783			1067 rpm	YES
P1010NSN5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
MPC862PVR66B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32				25 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES	e1
MPC8314EVRADDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e2
MPC857TZP100B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		105 Cel		0 Cel		BOTTOM												3.3 V			Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	100 rpm
MPC8555EVTAQE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	15	32		GRID ARRAY		1.25 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.3 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8541VTALF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	667 rpm	YES
T1023NSN7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel		BOTTOM	2.07 mm	19 mm		YES	32				19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525			1000 rpm	YES
MPC8533CVTANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e2
MPC8245LZU333D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	220	35 mm	CMOS		2 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	333 rpm	YES	e0
MPC8555EVTAKEX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8541EVTAPF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	833 rpm	YES	e2
MPC8349EVVAGF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
P1010NSE5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	TIN SILVER	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
MPC8560VTAQLB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
T1023NSE7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MPC8347EVRAJF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8533VJAQJA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783			1000 rpm	YES
MPC8306SVMACCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm		YES	0	33.33 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B369			200 rpm	YES	e1
MPC8347VRALDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES
MPC8555EPXAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC850ZQ50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e0
MC8640HX1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4		Microprocessors	1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	NO	e0
MPC8560VT833JB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	3.85 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541EVTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8555VTAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC850SRZQ80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		0 Cel	TIN LEAD	BOTTOM	2.54 mm	23 mm		YES	32				23 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	80 rpm	YES	e0
MC7448VU867ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	867 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	867 rpm	YES
MPC8280ZUMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	105 Cel		0 Cel		BOTTOM	1.65 mm	37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			37.5 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm	NO
MPC857DSLZP50B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		105 Cel		0 Cel		BOTTOM												3.3 V			Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	50 rpm
MC8640DHJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO
MPC8541EVTAJF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8377EVRAGGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4			1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8533ECVTARJ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e2
MPC8535BVJAKGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm	29 mm		YES	64		40	260	29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783	3		600 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.