OTHER Microprocessors 1,705

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

AM3352BZCZ100

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.378 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.272 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.325 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

1000 rpm

YES

e1

AM3358BZCZ100

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.378 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.272 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.325 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

1000 rpm

YES

e1

AM3352BZCZ60

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

600 rpm

YES

e1

MIMXRT1052DVL6B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,25

1.25 V

95 Cel

0

0 Cel

TIN SILVER COPPER

BOTTOM

1.43 mm

524288

10 mm

YES

0

24 MHz

40

260

10 mm

CMOS

105 mA

32

29

.65 mm

FLOATING-POINT

S-PBGA-B196

3

600 rpm

YES

e1

MCIMX535DVP1C2

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.4 V

8

26

32

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.2 V

85 Cel

-20 Cel

BOTTOM

1.85 mm

147456

19 mm

YES

32

27 MHz

40

260

19 mm

CMOS

800 mA

1.25 V

5

.8 mm

FLOATING POINT

S-PBGA-B529

3

1000 rpm

YES

AM3354BZCZ100

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.378 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.272 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.325 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

1000 rpm

YES

e1

MIMXRT1052DVJ6B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.25 V

95 Cel

0

0 Cel

TIN SILVER

BOTTOM

1.52 mm

524288

12 mm

YES

0

24 MHz

40

260

12 mm

CMOS

105 mA

32

29

.8 mm

FLOATING-POINT

S-PBGA-B196

3

600 rpm

YES

e2

MIMXRT1021DAG5A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

13

32

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

1.25 V

95 Cel

0 Cel

TIN

YES

QUAD

YES

1.6 mm

262144

20 mm

YES

32

24 MHz

40

260

20 mm

CMOS

90 mA

32

YES

14

.5 mm

FLOATING POINT

S-PQFP-G144

3

500 rpm

YES

e3

96

MIMXRT1064DVL6A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,25

1.25 V

85 Cel

0

0 Cel

BOTTOM

1.43 mm

1048576

10 mm

YES

0

24 MHz

40

260

10 mm

CMOS

110 mA

32

10

.65 mm

FLOATING-POINT

S-PBGA-B196

3

600 rpm

YES

AM3894CCYG120

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.31 mm

65536

25 mm

YES

16

27 MHz

30

245

25 mm

CMOS

1 V

72

Microprocessors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

1200 rpm

YES

e1

MIMXRT1051DVJ6B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.25 V

95 Cel

0

0 Cel

TIN SILVER

BOTTOM

1.52 mm

524288

12 mm

YES

0

24 MHz

40

260

12 mm

CMOS

105 mA

32

29

.8 mm

FLOATING-POINT

S-PBGA-B196

3

600 rpm

YES

e2

AM5728BABCX

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

16

GRID ARRAY, FINE PITCH

BGA760,28X28,31

1.11 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.55 mm

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

.8 mm

FLOATING POINT

S-PBGA-B760

3

1500 rpm

YES

e1

OSD3358-512M-BSM

Octavo Systems

MICROPROCESSOR, RISC

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

NO

YES

GRID ARRAY

BGA256, 16X16,50

85 Cel

0 Cel

BOTTOM

3.08 mm

21 mm

GPMC OF 28 BIT-ADDRESS LINES AND 16 BIT-DATA LINES AVAILABLE

YES

245

21 mm

CMOS

2000 mA

1.1 V

1.27 mm

FIXED POINT

S-PBGA-B256

4

1000 rpm

NO

MIMXRT1024DAG5A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

8

13

32

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

3 V

95 Cel

0 Cel

QUAD

1.6 mm

262144

20 mm

YES

16

24 MHz

40

260

20 mm

CMOS

90 mA

3.3 V

32

8

.5 mm

FLOATING POINT

S-PQFP-G144

3

500 rpm

YES

MIMXRT1021DAF5B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

13

32

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.25 V

95 Cel

0 Cel

TIN

QUAD

1.7 mm

262144

14 mm

YES

32

24 MHz

40

260

14 mm

CMOS

90 mA

32

14

.5 mm

FLOATING POINT

S-PQFP-G100

3

500 rpm

YES

e3

AM3352BZCZ80

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.326 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.21 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.26 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

800 rpm

YES

e1

MIMXRT1021DAF5A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

13

32

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.25 V

95 Cel

0 Cel

TIN

YES

QUAD

YES

1.7 mm

262144

14 mm

YES

32

24 MHz

40

260

14 mm

CMOS

90 mA

32

YES

14

.5 mm

FLOATING POINT

S-PQFP-G100

3

500 rpm

YES

e3

57

AM3354BZCZ80

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.326 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.21 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.26 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

800 rpm

YES

e1

SN278792960

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

8

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

GPMC 28 BIT ADDRESS BUS AND 16 BIT DATA BUS AVAILABLE

YES

16

26 MHz

30

260

15 mm

CMOS

64

.8 mm

FIXED POINT

S-PBGA-B324

3

YES

e1

AM3358BZCZ80

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.326 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.21 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.26 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

800 rpm

YES

e1

MIMXRT1064DVL6B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,25

1.25 V

85 Cel

0

0 Cel

BOTTOM

1.43 mm

1048576

10 mm

YES

0

24 MHz

40

260

10 mm

CMOS

110 mA

32

10

.65 mm

FLOATING-POINT

S-PBGA-B196

3

600 rpm

YES

MIMXRT1021DAG5B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

13

32

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

1.25 V

95 Cel

0 Cel

QUAD

1.6 mm

262144

20 mm

YES

32

24 MHz

40

260

20 mm

CMOS

90 mA

32

14

.5 mm

FLOATING POINT

S-PQFP-G144

3

500 rpm

YES

MIMXRT1064DVJ6B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.25 V

85 Cel

0

0 Cel

BOTTOM

1.52 mm

1048576

12 mm

YES

0

24 MHz

40

260

12 mm

CMOS

110 mA

32

10

.8 mm

FLOATING-POINT

S-PBGA-B196

3

600 rpm

YES

AM3354BZCZ60

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

600 rpm

YES

e1

OSD3358-512M-BCB

Octavo Systems

MICROPROCESSOR, RISC

OTHER

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

16

GRID ARRAY

85 Cel

0 Cel

BOTTOM

2.6 mm

27 mm

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

YES

8

245

27 mm

CMOS

1.1 V

1.27 mm

FIXED POINT

S-PBGA-B400

4

1000 rpm

YES

MIMXRT1051DVL6B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,25

1.25 V

95 Cel

0

0 Cel

TIN SILVER COPPER

BOTTOM

1.43 mm

524288

10 mm

YES

0

24 MHz

40

260

10 mm

CMOS

105 mA

32

29

.65 mm

FLOATING-POINT

S-PBGA-B196

3

600 rpm

YES

e1

AM3358BZCZ60

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

324

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA324,18X18,32

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

131072

15 mm

YES

16

26 MHz

30

260

15 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B324

3

Not Qualified

600 rpm

YES

e1

AM3517AZCN

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

491

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.248 V

8

16

16

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA491,25X25,25

1.152 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

65536

17 mm

YES

16

26 MHz

30

260

17 mm

CMOS

1500 mA

1.2 V

32

Microprocessors

.65 mm

FLOATING POINT

S-PBGA-B491

3

Not Qualified

600 rpm

YES

e1

MIMXRT1064DVL6AR

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196.14X14,25

1.25 V

85 Cel

0 Cel

BOTTOM

1.43 mm

1048576

10 mm

YES

40

260

10 mm

CMOS

100 mA

.65 mm

FLOATING POINT

S-PBGA-B196

3

600 rpm

YES

MIMXRT1064DVJ6A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.25 V

85 Cel

0

0 Cel

TIN SILVER COPPER

BOTTOM

1.52 mm

1048576

12 mm

YES

0

24 MHz

40

260

12 mm

CMOS

110 mA

32

10

.8 mm

FLOATING-POINT

S-PBGA-B196

3

600 rpm

YES

e1

AM3352BZCE30

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

0.95/1.1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA298,19X19,25

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

131072

13 mm

ALSO OPERATES AT MIN 0.912 V

YES

16

26 MHz

30

260

13 mm

CMOS

400 mA

1.1 V

64

Microprocessors

.65 mm

FIXED POINT

S-PBGA-B298

3

Not Qualified

300 rpm

YES

e1

XAM3517AZCN

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

491

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.248 V

15

GRID ARRAY, LOW PROFILE, FINE PITCH

1.152 V

90 Cel

0 Cel

BOTTOM

1.3 mm

17 mm

YES

32

59 MHz

17 mm

CMOS

1.2 V

.65 mm

FLOATING POINT

S-PBGA-B491

600 rpm

YES

AM3894CCYG135

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.31 mm

65536

25 mm

YES

16

27 MHz

30

245

25 mm

CMOS

1 V

72

Microprocessors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

1200 rpm

YES

e1

MPC8314VRAGDA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

1,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA620,28X28,40

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

29 mm

YES

66.67 MHz

40

260

29 mm

CMOS

1 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

3

Not Qualified

400 rpm

YES

e2

AM3505AZCNC

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

491

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.248 V

8

16

16

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA491,25X25,25

1.152 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

65536

17 mm

YES

16

26 MHz

30

260

17 mm

CMOS

1400 mA

1.2 V

32

Microprocessors

.65 mm

FLOATING POINT

S-PBGA-B491

3

Not Qualified

600 rpm

YES

e1

30026-13

National Semiconductor

MICROPROCESSOR

OTHER

PIN/PEG

320

SPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

NO

2.31 V

32

32

GRID ARRAY, SHRINK PITCH

2.09 V

85 Cel

0 Cel

PERPENDICULAR

3.07 mm

49.595 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

33.61 MHz

49.595 mm

CMOS

2.2 V

1.27 mm

FLOATING POINT

S-CPGA-P320

Not Qualified

166 rpm

YES

AM3505AZER

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.248 V

8

16

16

1.2,1.8,3.3

GRID ARRAY

BGA484,22X22,40

1.152 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.48 mm

65536

23 mm

YES

16

26 MHz

30

260

23 mm

CMOS

1400 mA

1.2 V

32

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B484

3

Not Qualified

600 rpm

YES

e1

MCIMX535DVP2C2

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.4 V

8

26

32

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.3 V

85 Cel

-20 Cel

BOTTOM

1.85 mm

147456

19 mm

YES

32

27 MHz

40

260

19 mm

CMOS

800 mA

1.35 V

5

.8 mm

FLOATING POINT

S-PBGA-B529

3

1200 rpm

YES

P3041NSN7PNC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

BGA1295,36X36,40

.95 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

133 MHz

30

245

37.5 mm

CMOS

1 V

8

8

1 mm

FIXED POINT

S-PBGA-B1295

3

1500 rpm

YES

e1

AM3358BZCE60

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

ALSO HAVING MULTIPLEXED 16 BIT ADDRESS

YES

16

26 MHz

30

260

13 mm

CMOS

1.1 V

.65 mm

FIXED POINT

S-PBGA-B298

3

600 rpm

YES

e1

MCIMX6L8DVN10AB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

576

TFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

16

32

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA432,24X24,20

1.375 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.1 mm

16384

13 mm

YES

32

40

260

13 mm

CMOS

1100 mA

CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB

.5 mm

FIXED POINT

S-PBGA-B

3

Not Qualified

1000 rpm

YES

e1

162

MIMXRT1015DAF5A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.25 V

95 Cel

0

0 Cel

TIN

QUAD

1.7 mm

131072

14 mm

YES

0

24 MHz

40

260

14 mm

CMOS

90 mA

32

16

.5 mm

FLOATING POINT

S-PQFP-G100

3

500 rpm

YES

e3

AM3351BZCE60

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

131072

13 mm

YES

16

26 MHz

30

260

13 mm

CMOS

400 mA

1.1 V

64

.65 mm

FIXED POINT

S-PBGA-B298

3

600 rpm

YES

e1

MIMXRT1052DVL6A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

8

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,25

1.25 V

95 Cel

0

0 Cel

BOTTOM

1.43 mm

524288

10 mm

YES

0

24 MHz

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

105 mA

32

29

.65 mm

FLOATING-POINT

S-PBGA-B196

600 rpm

YES

APQ-8016E-1-760NSP-TR-01-0

Qualcomm

MICROPROCESSOR, RISC

OTHER

BALL

760

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.12 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.84 V

60 Cel

-30 Cel

BOTTOM

.96 mm

12 mm

255

14 mm

CMOS

R-PBGA-B760

3

e1

AM3351BZCE60R

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

298

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.144 V

8

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.056 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

131072

13 mm

YES

16

26 MHz

30

260

13 mm

CMOS

400 mA

1.1 V

64

.65 mm

FIXED POINT

S-PBGA-B298

3

600 rpm

YES

e1

MCIMX6U5EVM10ACR

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

105 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

21 mm

YES

64

24 MHz

40

260

21 mm

CMOS

.8 mm

FLOATING POINT

S-PBGA-B624

3

1000 rpm

YES

e1

AM3505AZCN

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

491

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.248 V

8

16

16

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA491,25X25,25

1.152 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

65536

17 mm

YES

16

26 MHz

30

260

17 mm

CMOS

1400 mA

1.2 V

32

Microprocessors

.65 mm

FLOATING POINT

S-PBGA-B491

3

Not Qualified

600 rpm

YES

e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.