OTHER Microprocessors 1,705

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Total Dose (V)	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
DM388AAAR11F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm		CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		970 rpm	YES	e1
KMC7448VU1267ND	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V			36	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz	40	260	25 mm		CMOS		1.1 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES
LS1012ASE7EKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V			16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm		CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		600 rpm	YES
AM3354BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm		CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
KMPC8347VVAJFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
LX2160SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
T1013NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm		CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
AM3703CBP100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	.9 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	65536	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm		CMOS	740 mA	1.1 V			Microprocessors	.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
AM5K2E04XABD4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		16			GRID ARRAY, FINE PITCH		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.55 mm	2097152	27 mm		YES	64		30	245	27 mm		CMOS		1 V	5			.8 mm	FLOATING POINT	S-PBGA-B1089	4		1400 rpm	YES	e1
MPC8245LVV266D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V			32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		35 mm		YES	32	66 MHz	30	245	35 mm		CMOS		1.8 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	266 rpm	YES	e1
MPC8313VRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm		CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm		CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8343VRADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm		CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e2
MPC8347EVVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES
MPC8349EZUAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8377VRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm		CMOS	.03 mA	1 V	4		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	400 rpm	YES	e2
T1013NSN7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel		BOTTOM	2.07 mm		19 mm		YES	32				19 mm		CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525			1000 rpm	YES
TMS320DM8147SCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		28	32	1.1/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	8192	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS		1.2 V	72		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
TMS320DM8148CCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS		1.2 V	72		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
AM3703CBP	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	.9 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	65536	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm		CMOS	740 mA	1.1 V			Microprocessors	.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
AM3703CUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	65536	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS	740 mA	1.1 V			Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
MPC8349EVVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349VVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349VVAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES
P1010NSE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm		CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
X66AK2H06AAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			24			GRID ARRAY		.95 V	85 Cel		0 Cel		BOTTOM	3.75 mm		40 mm	ALSO OPERATES AT 1200 GHZ	YES	16	156.25 MHz			40 mm		CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B1517			1400 rpm	YES
MPC8343ZQADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm		CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e0
XPC8240LZU200E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V			32	32		GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2.375 V	105 Cel	5	0 Cel		BOTTOM	1.65 mm		35 mm		YES	64	66 MHz			35 mm		CMOS		2.5 V	2			1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
A80960CF-40	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	8		32	32	5	GRID ARRAY	PGA168,17X17	4.5 V	85 Cel	9	0 Cel		PERPENDICULAR	4.57 mm	512	44.7 mm	OPERATING CASE TEMPERTURE 0 TO 85 C	NO	32	80 MHz			44.7 mm		MOS	1150 mA	5 V	4	0	Microprocessors	2.54 mm	FIXED POINT	S-CPGA-P168		Not Qualified	40 rpm	NO
A80960KA25	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.5 V	0		32	32	5	GRID ARRAY	PGA132,14X14	4.5 V	85 Cel	4	0 Cel		PERPENDICULAR	4.57 mm	0	37.08 mm	REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS	NO	32	32 MHz	NOT SPECIFIED	NOT SPECIFIED	37.08 mm		CMOS	420 mA	5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	S-CPGA-P132		Not Qualified	25 rpm	NO
LS1012ASE7KKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V			16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm		CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		1000 rpm	YES
LUPXA255A0C400	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.43 V			26	32	1.3,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.235 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2 mm		17 mm		YES	32	3.6864 MHz	40	250	17 mm		CMOS		1.3 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	400 rpm	YES	e1
LUPXA255A0C200	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			26	32	1,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2 mm		17 mm		YES	32	3.6864 MHz			17 mm		CMOS		1 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	200 rpm	YES	e1
P1013NSN2LFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm		CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		1067 rpm	YES	e2
FA80486SXSF-33	Intel	MICROPROCESSOR, RISC	OTHER	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.3 V	0		32	32	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	2.7 V	85 Cel	3	0 Cel	TIN LEAD	QUAD	1.7 mm	0	24 mm		YES	32	33.33 MHz			24 mm		CMOS	345 mA	3.3 V	0	0	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176		Not Qualified	33.33 rpm	YES	e0
XPC850DSLZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm		CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
5962R9572201QQC	Renesas Electronics	MICROPROCESSOR	OTHER	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V		MIL-PRF-38535 Class Q	20	16		IN-LINE		4.75 V	125 Cel		-35 Cel	GOLD	DUAL	5.72 mm		15.24 mm	QUALIFIED TO MIL-38535-Q	NO	16	5 MHz				100k Rad(Si)	CMOS		5 V				2.54 mm	FIXED POINT	R-CDIP-T40		Qualified	5 rpm	YES	e4
88AP312-A2-BGW2C624-TN02	Marvell Technology	MICROPROCESSOR, RISC	OTHER	BALL	416	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES				0		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA416,21X21,25		85 Cel		-25 Cel		BOTTOM	.93 mm		15 mm		YES	0	13.002 MHz			15 mm		CMOS					Graphics Processors	.65 mm	FLOATING POINT	S-PBGA-B416		Not Qualified	624 rpm	YES
A80486DX266	Intel	MICROPROCESSOR	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.25 V	0		32	32	5	GRID ARRAY	PGA168,17X17	4.75 V	85 Cel	2	0 Cel	TIN LEAD	PERPENDICULAR	4.57 mm	0	44.45 mm	DYNAMIC BUS SIZING; BURST BUS; MULTIPROCESSOR SUPPORT; BUILT IN SELF TEST	YES	32	33 MHz			44.45 mm		CMOS	1200 mA	5 V	0	0	Microprocessors	2.54 mm	FLOATING POINT	S-CPGA-P168		Not Qualified	66 rpm	YES	e0
A80960CF-25	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	8		32	32	5	GRID ARRAY	PGA168,17X17	4.5 V	100 Cel	9	0 Cel		PERPENDICULAR	4.57 mm	512	44.7 mm	OPERATING CASE TEMPERTURE 0 TO 100 C	NO	32	50 MHz			44.7 mm		MOS	950 mA	5 V	4	0	Microprocessors	2.54 mm	FIXED POINT	S-CPGA-P168		Not Qualified	25 rpm	NO
A80960HD66	Intel	MICROPROCESSOR, RISC	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	3.45 V	8		32	32	3.3,3.3/5	GRID ARRAY	PGA168,17X17	3.15 V	85 Cel	9	0 Cel		PERPENDICULAR	4.57 mm	1024	44.7 mm	OPERATING CASE TEMPERATURE 0 TO 90	YES	32	40 MHz			44.7 mm		MOS	1790 mA	3.3 V	0	0	Microprocessors	2.54 mm	FIXED POINT	S-CPGA-P168		Not Qualified	66 rpm	NO
KU80386EX25	Intel	MICROPROCESSOR	OTHER	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0		26	32	3/5	FLATPACK, BUMPER	SPQFP132,1.1SQ	2.7 V	100 Cel	10	0 Cel	Tin/Lead (Sn/Pb)	QUAD	4.57 mm	0	24.13 mm	DRAM REFRESH CONTROLLER	YES	16	50 MHz			24.13 mm		CMOS	420 mA	5 V	2	2	Microprocessors	.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	25 rpm	YES	e0
MPC8347VRAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz	40	260	29 mm		CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e1
MPC8347VVAJF	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.69 mm		35 mm		YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e1
20-668-0011	Digi International	MICROPROCESSOR	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V			20			FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel		-55 Cel		QUAD	1.6 mm		14 mm		NO	8				14 mm		CMOS		3.3 V				.4 mm	FIXED POINT	S-PQFP-G128			55 rpm	YES
AM486DX5-133V16BHC	Advanced Micro Devices	MICROPROCESSOR	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	0		32	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3 V	85 Cel	3	0 Cel	TIN LEAD	QUAD	3.7 mm	0	28 mm		YES	32	33.33 MHz			28 mm		CMOS	931 mA	3.3 V	0	0	Microprocessors	.5 mm	FLOATING POINT	S-PQFP-G208		Not Qualified	133 rpm	YES	e0
LS1043ASE8PQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V			14	64		GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm		CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
MC7448VU1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm		CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.