OTHER Microprocessors 1,705

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM3356BZCZ80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
DM3730CUS100NEP	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	30	260	16 mm	CMOS	37 mA	1.14 V			Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
DM3730CUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
AM3517AZERC	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	90 Cel		TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1500 mA	1.2 V	32		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
AM3351BZCE30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
AM3352BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
MIMXRT1051DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0		BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz			10 mm	CMOS	105 mA		32	29		.65 mm	FLOATING-POINT	S-PBGA-B196			600 rpm	YES
DM3730CUS	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	NOT SPECIFIED	260	16 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
MPC8321VRADDC	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
AM3351BZCE30R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64			.65 mm	FIXED POINT	S-PBGA-B298	3		300 rpm	YES	e1
MPC8313EVRAFFC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
DM3730CBP100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.08 V	90 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
VCBU3730GSCUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	90 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16 mm		YES	16	54 MHz	30	260	16 mm	CMOS		1.14 V				.65 mm	FLOATING POINT	S-PBGA-B423	3		1000 rpm	YES	e1
XAM5728BABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH		1.11 V	90 Cel		TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
MC7448HX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1400 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
AM3517AZER	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	90 Cel		TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1500 mA	1.2 V	32		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
MC7448VU800ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel			BOTTOM	2.8 mm		25 mm		NO	0	800 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	800 rpm	YES
MPC8347EVRAGDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
T1023NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
AM1705DPTP4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	13	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.25 V	90 Cel		NICKEL PALLADIUM GOLD	QUAD	1.6 mm	172032	24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.3 V	40		Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	4	Not Qualified	456 rpm	YES	e4
AM3354BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64			.8 mm	FIXED POINT	S-PBGA-B324	3		300 rpm	YES	e1
MPC8347VVAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8540VT833LB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel		Tin/Silver (Sn/Ag)	BOTTOM	3.85 mm		29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
TMS320DM8148CCYEA0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.2 V	72		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
AM5708BCBDJ	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	90 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM3352BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3356BZCZ60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
MC8641VJ1500KE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V		16	32		GRID ARRAY		1.05 V	105 Cel		TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	64		30	245	33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-CBGA-B1023	3		1500 rpm	YES	e2
MCIMX7D2DVK12SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		1.2 V	85 Cel			BOTTOM	1.1 mm		12 mm		YES	16		40	260	12 mm	CMOS		1.225 V				.4 mm	FLOATING POINT	S-PBGA-B488	3		1200 rpm	YES
AM1806BZCE4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.25 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM5706BCBDD	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	90 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
LS1012ASN7HKA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel			BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		800 rpm	YES
AM1808EZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V				.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
MPC8280ZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64		40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	YES	e0
DM388AAAR21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
MC7448HX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MC7448HX1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.05 V	105 Cel		TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz	40	260	25 mm	CMOS		1.1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1250 rpm	YES	e0
MC7448HX1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel		TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES	e0
MC7448HX600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	600 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	600 rpm	YES	e0
MC7448TVU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel			BOTTOM	2.8 mm		25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360	1		1000 rpm	YES
MC7448VS1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V		0	32	1.3,1.8/2.5	GRID ARRAY	LGA360,19X19,50	1.1 V	105 Cel			BOTTOM	2.8 mm		25 mm		NO	0	1400 MHz	30	245	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1400 rpm	YES
MC7448VU1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel			BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES
MC7448VU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel			BOTTOM	2.8 mm		25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1000 rpm	YES
MC7448VU1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.05 V	105 Cel			BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz	40	260	25 mm	CMOS		1.1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1250 rpm	YES
MC7448VU1267ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.1 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1 V	105 Cel			BOTTOM	2.8 mm		25 mm		NO	0	1267 MHz	40	260	25 mm	CMOS		1.05 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1267 rpm	YES
MC7448VU1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V		0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel			BOTTOM	2.8 mm		25 mm		NO	0	1400 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	1400 rpm	YES
MC7448VU1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.2 V	105 Cel			BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.25 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1600 rpm	YES
TMS320DM8147SCYE1	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	1.1/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.28 V	90 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	8192	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.