Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1023 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.1 V |
16 |
32 |
GRID ARRAY |
1 V |
105 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
2.77 mm |
33 mm |
YES |
64 |
30 |
245 |
33 mm |
CMOS |
1.05 V |
1 mm |
FLOATING POINT |
S-CBGA-B1023 |
3 |
1333 rpm |
YES |
e2 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
OTHER |
BALL |
225 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.32 V |
16 |
GRID ARRAY, FINE PITCH |
1.08 V |
70 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
2.85 mm |
13 mm |
YES |
16 |
35 MHz |
40 |
260 |
13 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B225 |
3 |
140 rpm |
NO |
e1 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
480 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.2 V |
32 |
32 |
GRID ARRAY, LOW PROFILE |
1.9 V |
105 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.65 mm |
37.5 mm |
YES |
64 |
66.66 MHz |
40 |
260 |
37.5 mm |
CMOS |
1.27 mm |
FLOATING POINT |
S-PBGA-B480 |
3 |
266 rpm |
NO |
e1 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
369 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
105 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
1.61 mm |
19 mm |
YES |
0 |
66.67 MHz |
40 |
260 |
19 mm |
CMOS |
1 V |
.8 mm |
FLOATING POINT |
S-PBGA-B369 |
3 |
333 rpm |
YES |
e2 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
15 |
32 |
1,1.8/2.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
.95 V |
105 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
YES |
32 |
40 |
260 |
27 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
266 rpm |
YES |
e2 |
||||||||||||||||||||||||||
|
Freescale Semiconductor |
MICROPROCESSOR |
OTHER |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.5 V |
32 |
32 |
1,1.8/2.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
.95 V |
105 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
66.67 MHz |
40 |
260 |
27 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
333 rpm |
YES |
e2 |
||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
516 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
15 |
32 |
1,1.8/2.5,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA516,26X26,40 |
.95 V |
105 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.55 mm |
27 mm |
YES |
32 |
40 |
260 |
27 mm |
CMOS |
1 V |
Microprocessors |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
333 rpm |
YES |
e0 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
783 |
HBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
64 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
105 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
3.75 mm |
29 mm |
YES |
64 |
166 MHz |
40 |
260 |
29 mm |
CMOS |
1.2 V |
1 mm |
FLOATING POINT |
R-PBGA-B783 |
3 |
Not Qualified |
667 rpm |
YES |
e2 |
||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1,1.2,1.8,1.8/3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
30 |
260 |
16 mm |
CMOS |
Graphics Processors |
.65 mm |
S-PBGA-B423 |
4 |
Not Qualified |
720 rpm |
e1 |
||||||||||||||||||||||||||||||||||||
Ibm Microelectronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.47 V |
0 |
24 |
32 |
3.3 |
FLATPACK |
QFP160,1.2SQ |
3.14 V |
85 Cel |
6 |
0 Cel |
QUAD |
4.5 mm |
0 |
28 mm |
DRAM CONTROLLER; TEMP SPECIFIED AS TC |
YES |
32 |
33 MHz |
28 mm |
CMOS |
260 mA |
3.3 V |
4 |
1 |
Microprocessors |
.65 mm |
FIXED POINT |
S-PQFP-G160 |
Not Qualified |
33 rpm |
YES |
||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
684 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.42 V |
8 |
28 |
32 |
0.95/1.35 |
GRID ARRAY, FINE PITCH |
BGA684,28X28,32 |
1.28 V |
90 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.06 mm |
16384 |
23 mm |
YES |
16 |
30 MHz |
NOT SPECIFIED |
250 |
23 mm |
CMOS |
1.35 V |
72 |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B684 |
4 |
Not Qualified |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
609 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.42 V |
27 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.28 V |
95 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.32 mm |
16 mm |
YES |
16 |
30 MHz |
30 |
260 |
16 mm |
CMOS |
1.35 V |
.5 mm |
FLOATING POINT |
S-PBGA-B609 |
3 |
1000 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.62 mm |
40 mm |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
R-PBGA-B1517 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1089 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.997 V |
16 |
GRID ARRAY, FINE PITCH |
.902 V |
85 Cel |
0 Cel |
BOTTOM |
3.55 mm |
27 mm |
YES |
64 |
27 mm |
CMOS |
.95 V |
.8 mm |
FLOATING POINT |
S-PBGA-B1089 |
1250 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
625 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.95 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.85 V |
90 Cel |
0 Cel |
BOTTOM |
1.7 mm |
21 mm |
YES |
32 |
26 MHz |
21 mm |
CMOS |
.9 V |
.8 mm |
FLOATING POINT |
S-PBGA-B625 |
600 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1200 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
298 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
16 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
13 mm |
YES |
16 |
26 MHz |
30 |
260 |
13 mm |
CMOS |
.65 mm |
FIXED POINT |
S-PBGA-B298 |
3 |
YES |
e1 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1089 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY, FINE PITCH |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.55 mm |
27 mm |
YES |
16 |
30 |
245 |
27 mm |
CMOS |
1 V |
.8 mm |
FLOATING POINT |
S-PBGA-B1089 |
4 |
1250 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1,1.2,1.8,1.8/3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,28X28,16 |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
.9 mm |
12 mm |
30 |
260 |
12 mm |
CMOS |
Graphics Processors |
.4 mm |
S-PBGA-B515 |
3 |
Not Qualified |
720 rpm |
e1 |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1089 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.997 V |
16 |
GRID ARRAY, FINE PITCH |
.902 V |
85 Cel |
0 Cel |
BOTTOM |
3.55 mm |
27 mm |
YES |
64 |
27 mm |
CMOS |
.95 V |
.8 mm |
FLOATING POINT |
S-PBGA-B1089 |
1400 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
609 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.42 V |
8 |
28 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.28 V |
95 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.32 mm |
655360 |
16 mm |
YES |
16 |
30 MHz |
30 |
260 |
16 mm |
CMOS |
1.35 V |
72 |
.5 mm |
FLOATING POINT |
S-PBGA-B609 |
3 |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
1200 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
423 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1,1.2,1.8,1.8/3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA423,24X24,25 |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
30 |
260 |
16 mm |
CMOS |
Graphics Processors |
.65 mm |
S-PBGA-B423 |
4 |
Not Qualified |
600 rpm |
e1 |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1089 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
8 |
16 |
GRID ARRAY, FINE PITCH |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.55 mm |
2097152 |
27 mm |
YES |
16 |
30 |
245 |
27 mm |
CMOS |
1 V |
5 |
.8 mm |
FLOATING POINT |
S-PBGA-B1089 |
4 |
1400 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
609 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.42 V |
8 |
28 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.28 V |
95 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.32 mm |
655360 |
16 mm |
YES |
16 |
30 MHz |
30 |
260 |
16 mm |
CMOS |
1.35 V |
72 |
.5 mm |
FLOATING POINT |
S-PBGA-B609 |
3 |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1089 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.997 V |
16 |
GRID ARRAY, FINE PITCH |
.902 V |
85 Cel |
0 Cel |
BOTTOM |
3.55 mm |
27 mm |
YES |
64 |
27 mm |
CMOS |
.95 V |
.8 mm |
FLOATING POINT |
S-PBGA-B1089 |
1000 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
256 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
13 |
32 |
1.2,1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA256,16X16,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
172032 |
17 mm |
YES |
16 |
30 MHz |
30 |
260 |
17 mm |
CMOS |
1.2 V |
40 |
Microprocessors |
.5 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
375 rpm |
YES |
e1 |
||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
ALSO OPERATES AT 1200 GHZ |
YES |
16 |
156.25 MHz |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1089 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.997 V |
16 |
GRID ARRAY, FINE PITCH |
.902 V |
85 Cel |
0 Cel |
BOTTOM |
3.55 mm |
27 mm |
YES |
64 |
27 mm |
CMOS |
.95 V |
.8 mm |
FLOATING POINT |
S-PBGA-B1089 |
1400 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
0 |
32 |
1.2,1.8,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.14 V |
90 Cel |
0 Cel |
QUAD |
1.6 mm |
24 mm |
YES |
0 |
50 MHz |
24 mm |
CMOS |
.3 mA |
1.2 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
Not Qualified |
375 rpm |
YES |
||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
684 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.42 V |
8 |
28 |
32 |
GRID ARRAY, FINE PITCH |
1.28 V |
90 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.06 mm |
1114112 |
23 mm |
YES |
16 |
30 MHz |
NOT SPECIFIED |
250 |
23 mm |
CMOS |
1.35 V |
72 |
.8 mm |
FLOATING POINT |
S-PBGA-B684 |
4 |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
256 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
16 |
32 |
1.2,1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA256,16X16,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
17 mm |
YES |
16 |
20 MHz |
30 |
260 |
17 mm |
CMOS |
1.2 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
375 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
64 |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1089 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.997 V |
16 |
GRID ARRAY, FINE PITCH |
.902 V |
85 Cel |
0 Cel |
BOTTOM |
3.55 mm |
27 mm |
YES |
64 |
27 mm |
CMOS |
.95 V |
.8 mm |
FLOATING POINT |
S-PBGA-B1089 |
1250 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1089 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.997 V |
16 |
GRID ARRAY, FINE PITCH |
.902 V |
85 Cel |
0 Cel |
BOTTOM |
3.55 mm |
27 mm |
YES |
64 |
27 mm |
CMOS |
.95 V |
.8 mm |
FLOATING POINT |
S-PBGA-B1089 |
1000 rpm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
609 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.42 V |
28 |
32 |
1.14/1.42 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA609,31X31,20 |
1.28 V |
95 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.32 mm |
8192 |
16 mm |
YES |
16 |
30 MHz |
30 |
260 |
16 mm |
CMOS |
1.35 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PBGA-B609 |
3 |
Not Qualified |
970 rpm |
YES |
e1 |
||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
256 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
13 |
32 |
1.3,1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA256,16X16,40 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.05 mm |
172032 |
17 mm |
YES |
16 |
30 MHz |
30 |
260 |
17 mm |
CMOS |
1.2 V |
40 |
Microprocessors |
.5 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
456 rpm |
YES |
e1 |
||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
YES |
16 |
156.25 MHz |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1089 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
8 |
16 |
GRID ARRAY, FINE PITCH |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.55 mm |
2097152 |
27 mm |
YES |
64 |
30 |
245 |
27 mm |
CMOS |
1 V |
5 |
.8 mm |
FLOATING POINT |
S-PBGA-B1089 |
4 |
1250 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
OTHER |
GULL WING |
100 |
BQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
0 |
23 |
32 |
5 |
FLATPACK, BUMPER |
SPQFP100,.9SQ |
3 V |
85 Cel |
3 |
0 Cel |
QUAD |
4.57 mm |
0 |
19.05 mm |
ADVANCED POWER MANAGEMENT FEATURES; HARDWARE MULTIPLIER |
NO |
16 |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
19.05 mm |
CMOS |
285 mA |
3.3 V |
0 |
0 |
Microprocessors |
.635 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
25 rpm |
YES |
||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
24 |
GRID ARRAY |
.95 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.75 mm |
40 mm |
ALSO OPERATES AT 1200 GHZ |
YES |
16 |
156.25 MHz |
30 |
245 |
40 mm |
CMOS |
1 V |
1 mm |
FLOATING POINT |
S-PBGA-B1517 |
4 |
1400 rpm |
YES |
e1 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.