OTHER Microprocessors 1,705

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MPC8541PXAPD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

R-PBGA-B783

Not Qualified

833 rpm

YES

T1040NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

YES

64

30

250

23 mm

CMOS

1 V

8

.8 mm

FIXED POINT

S-PBGA-B780

3

1400 rpm

YES

e1

MPC8377EVRAJGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

533 rpm

YES

MPC8540VT833JB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

1.2,2.5/3.3

GRID ARRAY

BGA783,28X28,40

1.14 V

105 Cel

0 Cel

BOTTOM

3.85 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

667 rpm

YES

MC8640DVJ1000HC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

1000 rpm

YES

MPC862PZP100B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

3.3

GRID ARRAY

BGA357,19X19,50

3.135 V

105 Cel

0 Cel

BOTTOM

2.05 mm

25 mm

YES

32

33 MHz

25 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B357

Not Qualified

100 rpm

YES

MC8641VJ1333JE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.77 mm

33 mm

YES

64

30

245

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

1333 rpm

YES

e2

MPC8555EPXALEX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

667 rpm

YES

P1013NSE2HFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, HEAT SINK/SLUG

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

40

260

31 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B689

3

800 rpm

YES

e2

MPC8572ELPXARLE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

0 Cel

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

1067 rpm

YES

P1022NSE2LFB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

133 MHz

40

260

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

3

1067 rpm

YES

e2

MPC859TVR133A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

1.8,3.3

GRID ARRAY

BGA357,19X19,50

1.7 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.52 mm

25 mm

YES

32

30

245

25 mm

CMOS

1.8 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

133 rpm

YES

e1

MPC8572ELVTARLE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

0 Cel

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

1067 rpm

YES

MPC859PZP133A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

1.8,3.3

GRID ARRAY

BGA357,19X19,50

1.7 V

95 Cel

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.52 mm

25 mm

YES

32

30

220

25 mm

CMOS

1.8 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

133 rpm

YES

e0

MC8640DHJ1067NE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

HBGA

SQUARE

CERAMIC

YES

YES

1 V

32

32

GRID ARRAY, HEAT SINK/SLUG

BGA1023,32X32,40

.9 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

.95 V

4

1 mm

FLOATING POINT

S-CBGA-B1023

3

1067 rpm

NO

MPC8347ZUALD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

1

Not Qualified

667 rpm

YES

MPC8533VJANF

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

800 rpm

YES

MPC8347EZQADFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

0 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

1

Not Qualified

266 rpm

YES

MPC8347EVVALDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

667 rpm

YES

MPC8240RZU200X

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

352

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.625 V

32

32

GRID ARRAY, LOW PROFILE

2.375 V

105 Cel

0 Cel

BOTTOM

1.65 mm

35 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

64

66 MHz

35 mm

CMOS

2.5 V

1.27 mm

FLOATING POINT

S-PBGA-B352

Not Qualified

200 rpm

YES

MPC866PVR133A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

1.8,3.3

GRID ARRAY

BGA357,19X19,50

1.7 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.52 mm

25 mm

YES

32

30

245

25 mm

CMOS

1.8 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

133 rpm

YES

e1

MPC8555EVTAJDX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

533 rpm

YES

MPC8378VRALD

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

NOT SPECIFIED

NOT SPECIFIED

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

667 rpm

YES

MPC8360VVAGDGA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

740

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.8/2.5,3.3

GRID ARRAY, LOW PROFILE

BGA740,37X37,40

1.14 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.69 mm

37.5 mm

YES

32

66.67 MHz

40

260

37.5 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B740

3

Not Qualified

400 rpm

YES

e2

MPC8309VMAGDCA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

489

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

1

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA489,23X23,32

.95 V

105 Cel

0 Cel

BOTTOM

1.61 mm

19 mm

YES

0

66.67 MHz

40

260

19 mm

CMOS

1 V

Microprocessors

.8 mm

FLOATING POINT

S-PBGA-B489

3

Not Qualified

400 rpm

YES

T1023NSN7KQA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1000 rpm

YES

e1

MPC8377EVRAGFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

GRID ARRAY, HEAT SINK/SLUG

BGA689,29X29,40

.95 V

125 Cel

8

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

.03 mA

1 V

4

1 mm

FLOATING POINT

S-PBGA-B689

400 rpm

YES

MPC8533CVTALJA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

667 rpm

YES

e2

MPC8533CVTARFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

1067 rpm

YES

e2

MPC8306CVMABFCA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

369

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.61 mm

19 mm

YES

0

66.67 MHz

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B369

133 rpm

YES

e1

MPC8541EPXAJE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

R-PBGA-B783

Not Qualified

533 rpm

YES

MPC8377EVRAND

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

31 mm

CMOS

1.05 V

4

1 mm

S-PBGA-B689

MPC8533VJANJ

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

800 rpm

YES

MPC8377EVRALD

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

GRID ARRAY

BGA689,29X29,40

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

31 mm

CMOS

1 V

4

1 mm

S-PBGA-B689

MPC8272VRTIEX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.575 V

32

32

GRID ARRAY

1.425 V

105 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

66 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

400 rpm

NO

MPC8572EVJARLE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

30

245

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

3

1067 rpm

YES

e2

MPC8555EVTAQFX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

64

32

GRID ARRAY

1.25 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.3 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

1000 rpm

YES

MPC8306VMACDCA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

369

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.61 mm

19 mm

YES

0

66.67 MHz

40

260

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B369

3

Not Qualified

200 rpm

YES

e2

MPC866PVR100A

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

1.8,3.3

GRID ARRAY

BGA357,19X19,50

1.7 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.52 mm

25 mm

YES

32

30

245

25 mm

CMOS

1.8 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B357

3

Not Qualified

100 rpm

YES

e1

MPC8533VJALGA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

667 rpm

YES

MPC8541EPXALE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

R-PBGA-B783

Not Qualified

667 rpm

YES

MPC8379EVRALFA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

GRID ARRAY, HEAT SINK/SLUG

BGA689,29X29,40

.95 V

125 Cel

8

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

1 V

4

1 mm

FLOATING POINT

S-PBGA-B689

667 rpm

YES

MPC8313EZQAGDA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

516

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

32

32

1,1.8/2.5,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA516,26X26,40

.95 V

105 Cel

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.55 mm

27 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

66.67 MHz

27 mm

CMOS

1 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

400 rpm

YES

e0

MC8641VJ1000NC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

1000 rpm

YES

MPC8313EZQAGDC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

516

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

2.55 mm

27 mm

YES

32

40

260

27 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B516

3

400 rpm

YES

e0

MPC8533CVTANJ

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

800 rpm

YES

e2

LS1012ASN7HKB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

211

VFLGA

SQUARE

UNSPECIFIED

YES

YES

.93 V

16

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.87 V

105 Cel

0 Cel

BOTTOM

.925 mm

9.6 mm

YES

16

25 MHz

40

260

9.6 mm

CMOS

.9 V

.5 mm

FIXED POINT

S-XBGA-N211

3

800 rpm

YES

LS1012ASN7EKA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

211

VFLGA

SQUARE

UNSPECIFIED

YES

YES

.93 V

16

64

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.87 V

105 Cel

0 Cel

BOTTOM

.925 mm

9.6 mm

YES

16

25 MHz

40

260

9.6 mm

CMOS

.9 V

.5 mm

FIXED POINT

S-XBGA-N211

3

600 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.