OTHER Microprocessors 1,705

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

P1010NSE5FFA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

1

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B425

3

Not Qualified

667 rpm

NO

e2

MPC862PZQ50B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

GRID ARRAY

3.135 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

2.52 mm

25 mm

YES

32

25 mm

CMOS

3.3 V

1.27 mm

FIXED POINT

S-PBGA-B357

3

50 rpm

YES

e0

MPC8349ZUAJFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,1.8/2.5,2.5/3.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

40

260

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

3

Not Qualified

533 rpm

YES

e0

MPC8377VRALFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

667 rpm

YES

MPC8377VRAJD

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

533 rpm

YES

P1010NSE5DFA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

1

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

Tin/Silver (Sn/Ag)

BOTTOM

1.9 mm

19 mm

YES

32

40

260

19 mm

CMOS

1 V

4

Microprocessors

.8 mm

FIXED POINT

S-PBGA-B425

3

Not Qualified

533 rpm

NO

e2

MPC8533VJAQJ

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1000 rpm

YES

MPC8568EVTAUJJ

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1.045 V

105 Cel

0 Cel

BOTTOM

2.75 mm

33 mm

YES

64

40

260

33 mm

CMOS

1.1 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B1023

3

Not Qualified

1333 rpm

YES

e2

MPC8280ZQTPEX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

32

32

GRID ARRAY

1.45 V

105 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

YES

64

100 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

400 rpm

NO

MPC8533VJARJ

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1067 rpm

YES

MPC8535AVJAKGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.76 mm

29 mm

YES

64

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

600 rpm

YES

MC8641DVJ1500KC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.15 V

16

32

GRID ARRAY

1.05 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-CBGA-B1023

1500 rpm

YES

MC8640DVU1067NC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

32

32

GRID ARRAY

.9 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

Not Qualified

1067 rpm

YES

e2

MPC862TZP50B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA357,19X19,50

105 Cel

0 Cel

BOTTOM

3.3 V

Microprocessors

1.27 mm

S-PBGA-B357

Not Qualified

50 rpm

MPC8533ECVTANJ

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

800 rpm

YES

e2

MCIMX7S5EVM08SC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

541

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.95 V

105 Cel

-20 Cel

BOTTOM

1.42 mm

19 mm

SEATED-HGT CALCULATED

YES

32

40

260

19 mm

CMOS

1 V

.75 mm

FLOATING POINT

S-PBGA-B541

3

800 rpm

YES

MPC8349ZUAGFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,1.8/2.5,2.5/3.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

400 rpm

YES

MPC8533VJARFA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1067 rpm

YES

P1010NSE5KFB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

1000 rpm

NO

MPC8347VRAJFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

533 rpm

YES

MPC8535AVJATLA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.76 mm

29 mm

YES

64

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1250 rpm

YES

MC8641DVJ1500KE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.15 V

16

32

GRID ARRAY

1.05 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.77 mm

33 mm

YES

64

30

245

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

1500 rpm

YES

e2

MPC8377EVRAJD

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

GRID ARRAY

BGA689,29X29,40

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

31 mm

CMOS

1 V

4

1 mm

S-PBGA-B689

T1013NSE7MQA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

525

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, FINE PITCH

BGA525,23X23,32

.97 V

105 Cel

6

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

YES

32

40

260

19 mm

CMOS

5 mA

1 V

2

5

.8 mm

FIXED POINT

S-PBGA-B525

3

1200 rpm

YES

e1

MPC8533ECVTANGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

800 rpm

YES

e2

MPC8306SVMADDCA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

369

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

32

1,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA369,23X23,32

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.61 mm

19 mm

YES

0

66.67 MHz

40

260

19 mm

CMOS

1 V

Microprocessors

.8 mm

FLOATING POINT

S-PBGA-B369

3

Not Qualified

266 rpm

YES

e2

MC8640DHX1000HC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

32

32

GRID ARRAY

1 V

105 Cel

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

Not Qualified

1000 rpm

YES

e0

T1040NSN7MQA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

64

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

12

0 Cel

BOTTOM

2.07 mm

23 mm

YES

64

23 mm

CMOS

1 V

8

.8 mm

FIXED POINT

S-PBGA-B780

1200 rpm

YES

MPC8349EZUALDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.3,1.8/2.5,2.5/3.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

667 rpm

YES

P1010CSN5HHA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

800 rpm

NO

MPC8377VRAGGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

GRID ARRAY, HEAT SINK/SLUG

BGA689,29X29,40

.95 V

125 Cel

8

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

.03 mA

1 V

4

1 mm

FLOATING POINT

S-PBGA-B689

400 rpm

YES

MPC8377EVRAGG

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

GRID ARRAY

BGA689,29X29,40

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

31 mm

CMOS

1 V

4

1 mm

S-PBGA-B689

MPC8347EZUAGFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

1

Not Qualified

400 rpm

YES

MPC8555EPXAKEX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

600 rpm

YES

P1013SSN2MHA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

0

32

GRID ARRAY

1 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

0

133 MHz

31 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-PBGA-B689

1200 rpm

YES

e2

MPC8555EVTAJFX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

533 rpm

YES

MPC8377VRALF

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

667 rpm

YES

MPC8541EPXALD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

R-PBGA-B783

Not Qualified

667 rpm

YES

MPC8533VJANFA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

800 rpm

YES

MPC8379EVRAGG

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

GRID ARRAY, HEAT SINK/SLUG

BGA689,29X29,40

.95 V

125 Cel

8

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

1 V

4

1 mm

FLOATING POINT

S-PBGA-B689

400 rpm

YES

MPC857TZP50B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA357,19X19,50

105 Cel

0 Cel

BOTTOM

3.3 V

Microprocessors

1.27 mm

S-PBGA-B357

Not Qualified

50 rpm

MPC8560VTAQJC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

64

32

GRID ARRAY

1.25 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.3 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

1000 rpm

YES

MPC8377VRALDA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

667 rpm

YES

MPC8347EZQAJF

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

2.46 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

533 rpm

YES

e0

MPC850DEZQ50BUR2

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

26

32

3.3

GRID ARRAY

BGA256,16X16,50

3 V

95 Cel

0 Cel

TIN LEAD

BOTTOM

2.54 mm

23 mm

YES

32

40

260

23 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

50 rpm

YES

e0

MPC850DEZQ50BU

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

26

32

3.3

GRID ARRAY

BGA256,16X16,50

3 V

95 Cel

0 Cel

TIN LEAD

BOTTOM

2.54 mm

23 mm

YES

32

40

260

23 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

50 rpm

YES

e0

MPC8347EZQAGFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

0 Cel

BOTTOM

2.46 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

1

Not Qualified

400 rpm

YES

MPC8347ZUADFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, LOW PROFILE

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

266 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.