OTHER Microprocessors 1,705

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8378VRAJF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64		NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC857DSLZQ50B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B357	3		50 rpm	YES	e0
MC8640DVJ1067NC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		.95 V				1 mm	FLOATING POINT	S-CBGA-B1023			1067 rpm	YES
MPC8343EVRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8540VTAQFC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	3.85 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC8541EVTAJD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	533 rpm	YES	e2
MPC8555PXAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541PXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	30	245	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	833 rpm	YES	e0
MC8610VT800GZ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.7 mm	29 mm		YES	64				29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	800 rpm	YES
MC8641DVJ1000GE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023			1000 rpm	YES
MPC8377EVRALG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES					31 mm	CMOS		1 V	4			1 mm		S-PBGA-B689
MPC8541EPXAJD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	3.75 mm	29 mm		YES	64	166 MHz	30	245	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	533 rpm	YES	e0
P1010CSN5DHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
P1010CSN5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
MPC8280VRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel		0 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8306CVMABDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	133 rpm	YES	e2
MPC8309VMAHFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	489	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32	1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA489,23X23,32	.95 V	105 Cel		0 Cel		BOTTOM	1.61 mm	19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V			Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B489	3	Not Qualified	417 rpm	YES
MPC8306CVMACDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	200 rpm	YES	e2
MPC8560VT667FB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
T1013NSN7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MPC8377VRAJF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8347EVRAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8379VRANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32	1.05,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	800 rpm	YES
MC9328MX1DVM20R2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2 V	25	32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.8 V	70 Cel		-30 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	14 mm	CMOS		1.9 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	200 rpm	YES
MPC8347EVRAJD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8245LZU266D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	220	35 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	266 rpm	YES	e0
MPC8347VRAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MPC8379EVRANF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8560VT833LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.85 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	833 rpm	YES
MPC8555VTAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541EVTAQE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MC8640DVJ1250HC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023			1250 rpm	YES
P1010CSE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
MPC8347EVVALFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	667 rpm	YES	e2
MPC8555EVTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8555EPXAPE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541VTAJF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MC8640VJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO	e2
MPC8533CVTANJA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e2
MPC8533CVTARGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e2
MPC8555EVTAJF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MC7448HX1267ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.1 V	0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm	25 mm		NO	0	1267 MHz	40	260	25 mm	CMOS		1.05 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES	e0
MPC8379EVRANG	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8379EVRAJF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1 V	4			1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC859DSLVR66A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC8533CVTARJA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES	e2
P1013NSE2LFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	0	133 MHz	40	260	31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1067 rpm	YES	e2
MPC8280VRSLDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel		0 Cel		BOTTOM	2.55 mm	27 mm		YES	64	83.33 MHz			27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	375 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.