OTHER Microprocessors 1,705

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
LX2120SN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MPC7457VG1200LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50		105 Cel			BOTTOM											CMOS					Microprocessors		1.27 mm		S-XBGA-B483		Not Qualified	1200 rpm
LX2080SN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
LX2080SN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
LX2160SC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MPC7457RX1267LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50		105 Cel			BOTTOM											CMOS					Microprocessors		1.27 mm		S-XBGA-B483		Not Qualified	1260 rpm
MPC7457RX1000LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50		105 Cel			BOTTOM											CMOS					Microprocessors		1.27 mm		S-XBGA-B483		Not Qualified	1000 rpm
LX2080SC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
LX2160SN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MPC7457VG867LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50		105 Cel			BOTTOM											CMOS					Microprocessors		1.27 mm		S-XBGA-B483		Not Qualified	867 rpm
MCIMX6L2DVN10AB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	576	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	95 Cel		TIN SILVER COPPER	BOTTOM	1.1 mm	16384	13 mm		YES	32		40	260	13 mm	CMOS	1.1 mA					CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B	3	Not Qualified	1000 rpm	YES	e1	162
MPC859DSLZP50A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	95 Cel		Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm		25 mm		YES	32		30	220	25 mm	CMOS		1.8 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC8535BVTANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V	105 Cel			BOTTOM	2.76 mm		29 mm		YES	32	133 MHz			29 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	800 rpm	YES	e2
MPC8377VRAJDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel			BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MC8640HX1000HC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32		GRID ARRAY		1 V	105 Cel		Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V					1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1000 rpm	YES	e0
MC8610VT1066JZ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel			BOTTOM	2.7 mm		29 mm		YES	64				29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1066 rpm	YES
MPC8535BVJANG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel			BOTTOM	2.76 mm		29 mm		YES	64				29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			800 rpm	YES
MPC8306SVMAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel		TIN SILVER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V			Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	333 rpm	YES	e2
MPC8377EVRALF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel			BOTTOM	2.46 mm		31 mm		YES					31 mm	CMOS		1 V	4				1 mm		S-PBGA-B689
MPC862PVR80B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		3.3 V					1.27 mm	FIXED POINT	S-PBGA-B357	3		80 rpm	YES	e1
MPC8347VRALFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel			BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES
MPC8280VRQLDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel			BOTTOM	2.55 mm		27 mm		YES	64	66.67 MHz			27 mm	CMOS		1.5 V					1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	333 rpm	NO
MPC866PZP133A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	95 Cel		Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm		25 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	32	133 MHz	30	220	25 mm	CMOS		1.8 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC8533ECVTALJ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	32	66 MHz			29 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES	e2
MPC8349EZUAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	1	Not Qualified	400 rpm	YES
MPC8555VTAQDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	105 Cel			BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V					1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8245LZU350D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V	32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		TIN LEAD	BOTTOM	1.65 mm		35 mm		YES	32	66 MHz	30	220	35 mm	CMOS		2 V			Microprocessors		1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	350 rpm	YES	e0
MPC8379EVRAJGA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1 V	4				1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8533ECVTANJA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	32	66 MHz			29 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES	e2
MPC8280ZQPKBX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel			BOTTOM	2.55 mm		27 mm		YES	64	66.67 MHz			27 mm	CMOS		1.5 V					1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	300 rpm	NO
MPC8349VVALFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.3,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	667 rpm	YES	e2
MPC8533VTALJ	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel			BOTTOM	2.8 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			667 rpm	YES
MPC8535AVJATHA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		TIN SILVER	BOTTOM	2.76 mm		29 mm		YES	64		40	260	29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783	3		1250 rpm	YES	e2
MPC8314EVRAFDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		TIN SILVER	BOTTOM	2.46 mm		29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2
MPC8533VJALG	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel			BOTTOM	2.8 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			667 rpm	YES
MPC8377VRANF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel			BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1.05 V					1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MCIMX6L3DVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	95 Cel		TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm					40	260	13 mm	CMOS							.5 mm		S-PBGA-B	3				e1
MPC8306CVMAFFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		TIN SILVER COPPER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz			19 mm	CMOS		1 V					.8 mm	FLOATING POINT	S-PBGA-B369			333 rpm	YES	e1
MPC8379EVRALD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1 V	4				1 mm	FLOATING POINT	S-PBGA-B689			667 rpm	YES
MPC8377VRAGG	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4				1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8343VRAGDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
LS1043ASE7PQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V	16	64		GRID ARRAY, FINE PITCH		.87 V	105 Cel		TIN SILVER COPPER	BOTTOM	2.07 mm		21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS		.9 V					.8 mm	FIXED POINT	S-PBGA-B621	3		1400 rpm	YES	e1
P1010NSN5DHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MPC8377EVRAGF	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				GRID ARRAY	BGA689,29X29,40	.95 V	125 Cel			BOTTOM	2.46 mm		31 mm		YES					31 mm	CMOS		1 V	4				1 mm		S-PBGA-B689
MC8640HJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel			BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4				1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO
MPC8349EZUALD	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B672	1	Not Qualified	667 rpm	YES
MPC8572ELVJAVNE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		TIN SILVER	BOTTOM	3.38 mm		33 mm		YES	64	133 MHz	30	245	33 mm	CMOS		1.1 V					1 mm	FIXED POINT	S-PBGA-B1023	3		1500 rpm	YES	e2
MPC857TZQ66B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel		Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		3.3 V					1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.