OTHER Microprocessors 1,705

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
PPC7457RX1000NB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL		BGA	UNSPECIFIED	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY		1.05 V	105 Cel	0 Cel		BOTTOM										CMOS	1.1 V				X-PBGA-B			1000 rpm
BSC9131CSN1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9131CLN1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9131CLN1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
XPC850ZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
MSCMMX6DZDK08AB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	500	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES		0			GRID ARRAY, FINE PITCH			85 Cel	0 Cel		BOTTOM	1.8 mm	14 mm		YES	0			260	17 mm	CMOS			.65 mm	FIXED POINT	R-PBGA-B500	3		800 rpm	YES
P5021PSN7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5021NSE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64		30	245	37.5 mm	CMOS	1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5021PSE12QB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY		1.17 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
BSC9131CLN1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
XPC750PRX400LE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY		2 V	105 Cel	0 Cel		BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	400 MHz			25 mm	CMOS	2.05 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	400 rpm	YES
P5021PSE7VNB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5021NSE1TMC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
BSC9131CSN1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9131NLE1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9131CSN1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
PPC7448VS600NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	600 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	600 rpm	YES
PPC7448VS1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
PPC7448HX600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	600 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
PPC7448VS1000LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	105 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
PPC7448VS1600LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	105 Cel	0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-N360		Not Qualified	1600 rpm	YES
BSC9131NLE1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
PPC7448VU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1000 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
BSC9132NSN7KNKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.53 mm	23 mm		YES	32		30	245	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3		1000 rpm	YES	e1
P5021NSN7VNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64		30	245	37.5 mm	CMOS	1.1 V		1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
XPC750PRX333LE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2 V	32	32	1.9,3.3	GRID ARRAY	BGA360,19X19,50	1.8 V	105 Cel	0 Cel	TIN LEAD	BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	100 MHz			25 mm	CMOS	1.9 V	Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	333 rpm	YES	e0
P5021PSN72QC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY		1.17 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
PPC7448VU1267NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32		GRID ARRAY		1.05 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1267 MHz			25 mm	CMOS	1.1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1267 rpm	YES
PPC7448HX1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
BSC9131NSE1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
PPC7448VU800ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	800 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	800 rpm	YES
XPC7450RX667LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	CERAMIC		YES			32	1.8	GRID ARRAY	BGA484,22X22,50		105 Cel	0 Cel		BOTTOM										CMOS	1.8 V	Microprocessors	1.27 mm		S-XBGA-B484		Not Qualified	667 rpm
PPC7448HX1600LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V	36	32		GRID ARRAY		1.2 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.25 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
XPC850SRZT80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32		GRID ARRAY		3.135 V	95 Cel	0 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V		1.27 mm	FIXED POINT	S-PBGA-B256			80 rpm	YES
PPC7448HX1000LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
BSC9132NSE7KNKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.53 mm	23 mm		YES	32		30	245	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3		1000 rpm	YES	e1
PPC7448VU1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32		GRID ARRAY		1.1 V	105 Cel	0 Cel		BOTTOM	2.4 mm	25 mm		YES	64	200 MHz			25 mm	CMOS	1.15 V		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
BSC9131NLN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.97 mm	21 mm		YES	32		30	245	21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520	3		800 rpm	YES	e1
PPC7448VU600NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	600 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	600 rpm	YES
BSC9131NLN1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
P5021NSE72QC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V	16			GRID ARRAY		1.17 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64		30	245	37.5 mm	CMOS	1.2 V		1 mm	FIXED POINT	S-PBGA-B1295	3		2200 rpm	YES	e1
XPC8240RZU250E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.75 V	32	32		GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2.5 V	105 Cel	0 Cel		BOTTOM	1.65 mm	35 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	66 MHz			35 mm	CMOS	2.625 V		1.27 mm	FLOATING POINT	S-PBGA-B352			250 rpm	YES
P5021NSE1VNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
PPC7448VU667NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V	0	32		GRID ARRAY		.95 V	105 Cel	0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	667 MHz			25 mm	CMOS	1 V		1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	667 rpm	YES
BSC9131CLN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P5021NSN1TMC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5021PSN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
SCF5250DAG120	NXP Semiconductors	MICROPROCESSOR	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	24	32		FLATPACK, LOW PROFILE, FINE PITCH		1.08 V	70 Cel	-20 Cel		QUAD	1.6 mm	20 mm		YES	16	33.86 MHz			20 mm	CMOS	1.2 V		.5 mm	FIXED POINT	S-PQFP-G144			120 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.