OTHER Microprocessors 1,705

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
ST486DX2-12LS	STMicroelectronics	MICROPROCESSOR	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES			32	32		FLATPACK, FINE PITCH			85 Cel		0 Cel		QUAD	3.8 mm		28 mm		NO	32	60 MHz			28 mm	CMOS		5 V				.5 mm	FLOATING POINT	S-PQFP-G208		Not Qualified	120 rpm	YES
ST486DX2-V66GS	STMicroelectronics	MICROPROCESSOR	OTHER	PIN/PEG	168	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	3.6 V	0	32	32	3.3	GRID ARRAY	PGA168,17X17	3 V	85 Cel	3	0 Cel	TIN LEAD	PERPENDICULAR	4.57 mm	0	44.45 mm	SYSTEM MANAGEMENT MODE; 5 PIPELINE STAGES	NO	32	33 MHz			44.45 mm	CMOS	.85 mA	3.3 V	0	0	Microprocessors	2.54 mm	FLOATING POINT	S-CPGA-P168		Not Qualified	66 rpm	YES	e0
ST486DX2-66PS	STMicroelectronics	MICROPROCESSOR	OTHER	PIN/PEG	168	PGA	SQUARE	PLASTIC/EPOXY	YES	NO			32	32		GRID ARRAY			85 Cel		0 Cel		PERPENDICULAR	4.57 mm		44.45 mm		NO	32	33.33 MHz			44.45 mm	CMOS		5 V				2.54 mm	FLOATING POINT	S-PPGA-P168		Not Qualified	66 rpm	YES
PPC7448VU600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	600 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	600 rpm	YES
PPC7448VU1250NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz			25 mm	CMOS		1.1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1250 rpm	YES
XPC850DEZT80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			80 rpm	YES
P5021PSN7VNB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
XPC7445RX800LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.65 V		36	32		GRID ARRAY	BGA360,19X19,50	1.55 V	105 Cel		0 Cel		BOTTOM	3.2 mm		25 mm		YES	64	133 MHz			25 mm	CMOS		1.6 V				1.27 mm	FLOATING POINT	S-CBGA-B360			800 rpm	YES
PPC7457RX867NB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL		BGA	UNSPECIFIED	PLASTIC/EPOXY		YES	1.15 V					GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM											CMOS		1.1 V						X-PBGA-B			867 rpm
XPC755BRX400LE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V		32	32		GRID ARRAY	BGA360,19X19,50	1.9 V	105 Cel		0 Cel		BOTTOM	3.2 mm		25 mm		YES	64	100 MHz			25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-CBGA-B360			400 rpm	YES
BSC9131NSE1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
XPC7450RX600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	CERAMIC		YES				32	1.8	GRID ARRAY	BGA484,22X22,50		105 Cel		0 Cel		BOTTOM											CMOS		1.8 V			Microprocessors	1.27 mm		S-XBGA-B484		Not Qualified	600 rpm
P5021PSE1VNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
BSC9131CSN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
BSC9131NSN1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.97 mm		21 mm		YES	32		30	245	21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520	3		1000 rpm	YES	e1
BSC9131NLE1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.97 mm		21 mm		YES	32		30	245	21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520	3		800 rpm	YES	e1
PPC7448HX867ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	867 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	867 rpm	YES
PPC7448VU867NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	867 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	867 rpm	YES
P5021PSE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
BSC9131NSN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
PPC7448VU1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V		36	32		GRID ARRAY		1.2 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz			25 mm	CMOS		1.25 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
PPC7448HX1250NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz			25 mm	CMOS		1.1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	1250 rpm	YES
PPC7448VS600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	600 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	600 rpm	YES
PPC7448VS1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V		36	32		GRID ARRAY		1.1 V	105 Cel		0 Cel		BOTTOM	1.8 mm		25 mm		YES	64	200 MHz			25 mm	CMOS		1.15 V				1.27 mm	FLOATING POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES
PPC7448HX600NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	600 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
PPC7448VU1600LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V		36	32		GRID ARRAY		1.2 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.25 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1600 rpm	YES
P5021PSN12QC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
PPC7448HX800ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	800 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	800 rpm	YES
SCF5250LPV100	NXP Semiconductors	MICROPROCESSOR	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24	32		FLATPACK, LOW PROFILE, FINE PITCH		1.08 V	70 Cel		-20 Cel		QUAD	1.6 mm		20 mm		YES	16	33.86 MHz			20 mm	CMOS		1.2 V				.5 mm	FIXED POINT	S-PQFP-G144			100 rpm	YES
P5021NSE12QC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
BSC9131NLE1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
P5021PSN7VNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
PPC7448VU1420LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V		36	32		GRID ARRAY		1.15 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz			25 mm	CMOS		1.2 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
XPC850SRZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
XPC850ZT80BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			80 rpm	YES
BSC9131CSE1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
PPC7448VS1250NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz			25 mm	CMOS		1.1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1250 rpm	YES
P5021PSN1TMB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
PPC7448HX1420LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V		36	32		GRID ARRAY		1.15 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS		1.2 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
BSC9131NSN1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9131CSE1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P5021NSN12QC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5021PSE7TMB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
XPC850SRZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
MSCMMX6QZDK08AB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	500	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES			0			GRID ARRAY, FINE PITCH			85 Cel		0 Cel		BOTTOM	1.8 mm		14 mm		YES	0		40	260	17 mm	CMOS						.65 mm	FIXED POINT	R-PBGA-B500	3		800 rpm	YES
P5021PSN12QB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
XPC850ZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
PPC7448VU1000NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1000 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.