OTHER Microprocessors 1,705

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

BSC9131NSE1HHKB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

0 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

PPC7448VU800NC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

800 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-N360

Not Qualified

800 rpm

YES

P5021NSN72QC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY

1.17 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

30

245

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

3

2200 rpm

YES

e1

PPC7448VS1600LD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.3 V

36

32

GRID ARRAY

1.2 V

105 Cel

0 Cel

BOTTOM

1.8 mm

25 mm

YES

64

200 MHz

25 mm

CMOS

1.25 V

1.27 mm

FLOATING POINT

S-CBGA-N360

Not Qualified

1600 rpm

YES

PPC7448HX667NC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

667 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-B360

Not Qualified

667 rpm

YES

BSC9131NSN1HHKB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

0 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

PPC7448VU1000LC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.2 V

36

32

GRID ARRAY

1.1 V

105 Cel

0 Cel

BOTTOM

2.4 mm

25 mm

LOW POWER TAKEN FROM SLEEP MODE

YES

64

200 MHz

25 mm

CMOS

1.15 V

1.27 mm

FLOATING POINT

S-CBGA-B360

Not Qualified

1000 rpm

YES

PPC7448VS1267NC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.15 V

0

32

GRID ARRAY

1.05 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

1267 MHz

25 mm

CMOS

1.1 V

1.27 mm

FIXED POINT

S-CBGA-N360

Not Qualified

1267 rpm

YES

PPC7448VS800ND

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

800 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-N360

Not Qualified

800 rpm

YES

PPC7448VS1000NC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

1000 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-N360

Not Qualified

1000 rpm

YES

PPC7448VU1420LC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.25 V

36

32

GRID ARRAY

1.15 V

105 Cel

0 Cel

BOTTOM

2.4 mm

25 mm

LOW POWER TAKEN FROM SLEEP MODE

YES

64

200 MHz

25 mm

CMOS

1.2 V

1.27 mm

FLOATING POINT

S-CBGA-B360

Not Qualified

1420 rpm

YES

PPC7448VS667ND

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

667 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-N360

Not Qualified

667 rpm

YES

PPC7448HX1000NC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

1000 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-B360

Not Qualified

1000 rpm

YES

BSC9131CLE1KHKB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

0 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

1000 rpm

YES

XPC755BRX400LD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

2.1 V

32

32

GRID ARRAY

BGA360,19X19,50

1.9 V

105 Cel

0 Cel

BOTTOM

3.2 mm

25 mm

YES

64

25 mm

CMOS

2 V

1.27 mm

FLOATING POINT

S-CBGA-B360

400 rpm

YES

XPC850DEZT66BU

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

26

32

GRID ARRAY

3.135 V

95 Cel

0 Cel

BOTTOM

2.35 mm

23 mm

YES

32

23 mm

CMOS

3.3 V

1.27 mm

FIXED POINT

S-PBGA-B256

66 rpm

YES

PPC7448VU1250ND

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.15 V

0

32

GRID ARRAY

1.05 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

1250 MHz

25 mm

CMOS

1.1 V

1.27 mm

FIXED POINT

S-CBGA-N360

Not Qualified

1250 rpm

YES

XPC7450RX533LD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

484

BGA

SQUARE

CERAMIC

YES

32

1.8

GRID ARRAY

BGA484,22X22,50

105 Cel

0 Cel

BOTTOM

CMOS

1.8 V

Microprocessors

1.27 mm

S-XBGA-B484

Not Qualified

533 rpm

PPC7448VS867NC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

867 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-N360

Not Qualified

867 rpm

YES

P5021PSN72QB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY

1.17 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

2200 rpm

YES

e1

LX2120SC71826B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

LX2120SN72232B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

MC94MX21DVKN3

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.3 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 V

70 Cel

-30 Cel

BOTTOM

1.49 mm

14 mm

YES

32

40

260

14 mm

CMOS

.65 mm

FIXED POINT

S-PBGA-B289

350 rpm

NO

MPC7457RX867LC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

483

BGA

SQUARE

CERAMIC

YES

32

1.3,1.5/2.5,1.8/2.5

GRID ARRAY

BGA483,22X22,50

105 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

1.27 mm

S-XBGA-B483

Not Qualified

867 rpm

LX2160SE72232B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2160SE72029B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2000 rpm

YES

e1

LX2160SN72029B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2000 rpm

YES

e1

LX2120SE72029B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2000 rpm

YES

e1

LX2080SE72232B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2120SN71826B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

LX2080SE71826B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

MCF5249LAG120

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

GULL WING

144

QFP

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

FLATPACK

QFP144,.87SQ,20

85 Cel

0 Cel

TIN

QUAD

40

260

CMOS

Microprocessors

.5 mm

S-PQFP-G144

3

Not Qualified

120 rpm

e3

LX2120SE71826B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

MPC7457RX1200LC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

483

BGA

SQUARE

CERAMIC

YES

32

1.3,1.5/2.5,1.8/2.5

GRID ARRAY

BGA483,22X22,50

105 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

1.27 mm

S-XBGA-B483

Not Qualified

1200 rpm

MPC603EFE100LX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

GULL WING

240

FQFP

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

3.465 V

32

32

3.3

FLATPACK, FINE PITCH

QFP240,1.3SQ,20

3.135 V

105 Cel

0 Cel

TIN LEAD

QUAD

4.15 mm

32 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

64

100 MHz

32 mm

CMOS

3.3 V

Microprocessors

.5 mm

FLOATING POINT

S-CQFP-G240

Not Qualified

100 rpm

YES

e0

LX2120SE72232B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2160SC71826B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

MPC7457VG1267LC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

483

BGA

SQUARE

CERAMIC

YES

32

1.3,1.5/2.5,1.8/2.5

GRID ARRAY

BGA483,22X22,50

105 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

1.27 mm

S-XBGA-B483

Not Qualified

1267 rpm

MPC7457VG1000LC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

483

BGA

SQUARE

CERAMIC

YES

32

1.3,1.5/2.5,1.8/2.5

GRID ARRAY

BGA483,22X22,50

105 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

1.27 mm

S-XBGA-B483

Not Qualified

1000 rpm

LX2080SN72232B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

MPC603ERX100LX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

255

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

3.465 V

32

32

3.3

GRID ARRAY

BGA255,16X16,50

3.135 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

3 mm

21 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

64

100 MHz

21 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FLOATING POINT

S-CBGA-B255

Not Qualified

100 rpm

YES

e0

LX2160SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

MCF5249LCAG120

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

GULL WING

144

QFP

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

FLATPACK

QFP144,.87SQ,20

85 Cel

0 Cel

TIN

QUAD

40

260

CMOS

Microprocessors

.5 mm

S-PQFP-G144

3

Not Qualified

120 rpm

e3

LX2160SE71826B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

LX2120SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2080SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2200 rpm

YES

e1

LX2120SC72029B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

2000 rpm

YES

e1

LX2080SC71826B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

.88 V

36

64

GRID ARRAY

BGA1517.39X39,40

.82 V

105 Cel

12

0 Cel

TIN SILVER COPPER

BOTTOM

3.51 mm

40 mm

YES

128

30

245

40 mm

CMOS

.05 mA

.85 V

17

1 mm

FIXED POINT

S-PBGA-B1517

3

1800 rpm

YES

e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.