OTHER Microprocessors 1,705

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MPC8347EVVADDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, LOW PROFILE

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

266 rpm

YES

MPC8280VRPKBX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.6 V

32

32

GRID ARRAY

1.45 V

105 Cel

0 Cel

BOTTOM

2.55 mm

27 mm

YES

64

66.67 MHz

27 mm

CMOS

1.5 V

1 mm

FLOATING POINT

S-PBGA-B516

Not Qualified

300 rpm

NO

MPC8555EPXAPD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

15

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

29 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

833 rpm

YES

P1010NSE5FHA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

667 rpm

NO

MPC8347ZQAJFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

533 rpm

YES

MPC8347ZUALDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

1

Not Qualified

667 rpm

YES

MPC8533ECVTALFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

32

GRID ARRAY

.95 V

90 Cel

0 Cel

TIN SILVER

BOTTOM

2.8 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

667 rpm

YES

e2

P1010NSN5KFB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

1000 rpm

NO

MPC8260AVVMHBB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

480

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

2.7 V

32

GRID ARRAY, LOW PROFILE

2.4 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.65 mm

37.5 mm

YES

64

40

260

37.5 mm

CMOS

2.5 V

1.27 mm

FLOATING POINT

S-PBGA-B480

3

266 rpm

YES

e1

MPC8555EPXAJFX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

533 rpm

YES

MPC857TVR100B

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

GRID ARRAY

3.135 V

105 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

2.52 mm

25 mm

YES

32

30

245

25 mm

CMOS

3.3 V

1.27 mm

FIXED POINT

S-PBGA-B357

3

100 rpm

YES

e1

MPC8306VMABDCA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

369

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.61 mm

19 mm

YES

0

66.67 MHz

40

260

19 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B369

3

Not Qualified

133 rpm

YES

e2

MPC8349EVVAJFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5/3.3

GRID ARRAY, LOW PROFILE

BGA672,34X34,40

1.14 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

40

260

35 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B672

3

Not Qualified

533 rpm

YES

e2

MPC8377EVRALFA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

125 Cel

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B689

667 rpm

YES

MPC8533VJAQG

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1000 rpm

YES

MPC8541EPXAQF

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1.35 V

64

32

GRID ARRAY, HEAT SINK/SLUG

1.25 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

30

245

29 mm

CMOS

1.3 V

1 mm

FLOATING POINT

R-PBGA-B783

3

Not Qualified

1000 rpm

YES

e0

MPC8555PXAJFX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

533 rpm

YES

MPC8533VTAQF

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1000 rpm

YES

MPC8567VTAUJJ

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1.045 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

40

260

33 mm

CMOS

1.1 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B1023

3

Not Qualified

1333 rpm

YES

e2

P1013SSN2MHB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

0

32

GRID ARRAY

1 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

0

133 MHz

31 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-PBGA-B689

1200 rpm

YES

e2

MPC8313EZQADDC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

516

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

GRID ARRAY, HEAT SINK/SLUG

.95 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

2.55 mm

27 mm

YES

32

40

260

27 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B516

3

266 rpm

YES

e0

MPC8379EVRAGDA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1,1.8/2.5,2.5/3.3

GRID ARRAY, HEAT SINK/SLUG

BGA689,29X29,40

.95 V

125 Cel

8

0 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

40

260

31 mm

CMOS

1 V

4

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B689

3

Not Qualified

400 rpm

YES

e2

MPC8379EVRAGD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

689

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

GRID ARRAY, HEAT SINK/SLUG

BGA689,29X29,40

.95 V

125 Cel

8

0 Cel

BOTTOM

2.46 mm

31 mm

YES

64

31 mm

CMOS

1 V

4

1 mm

FLOATING POINT

S-PBGA-B689

400 rpm

YES

MPC8349ZUAGDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, LOW PROFILE

1.14 V

105 Cel

0 Cel

Tin/Lead/Silver (Sn/Pb/Ag)

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

40

260

35 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B672

3

Not Qualified

400 rpm

YES

e0

MPC8555EPXAPEX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

833 rpm

YES

P1010CSE5KFA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

1000 rpm

NO

MPC8347VVADDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

672

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY, LOW PROFILE

1.14 V

105 Cel

0 Cel

BOTTOM

1.69 mm

35 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

35 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B672

Not Qualified

266 rpm

YES

T2080NSE8MQB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

896

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

64

GRID ARRAY

BGA896(UNSPEC)

105 Cel

0 Cel

BOTTOM

NO

30

250

CMOS

FIXED POINT

S-PBGA-B896

3

1200 rpm

NO

MPC8555EPXAJE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

15

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

29 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

533 rpm

YES

MC8641DVJ1250HB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

1250 rpm

YES

MC8640HX1000HE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

HBGA

SQUARE

CERAMIC

YES

YES

1.1 V

32

32

1,1.8/2.5,2.5/3.3

GRID ARRAY, HEAT SINK/SLUG

BGA1023,32X32,40

1 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

33 mm

CMOS

1.05 V

4

Microprocessors

1 mm

FLOATING POINT

S-CBGA-B1023

1

Not Qualified

1000 rpm

NO

MC8640DHX1250HC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

32

32

GRID ARRAY

1 V

105 Cel

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

Not Qualified

1250 rpm

YES

e0

MC8641DVJ1333JC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

1333 rpm

YES

MCIMX7S5EVK08SC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

488

TFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.95 V

105 Cel

-20 Cel

BOTTOM

1.1 mm

12 mm

SEATED-HGT CALCULATED

YES

32

40

260

12 mm

CMOS

1 V

.4 mm

FLOATING POINT

S-PBGA-B488

3

800 rpm

YES

MPC8347EZQAGDB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

40

260

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

3

Not Qualified

400 rpm

YES

e0

P1010CSE5FHB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

425

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, FINE PITCH

BGA425,23X23,32

.95 V

105 Cel

4

0 Cel

BOTTOM

1.9 mm

19 mm

YES

32

19 mm

CMOS

1 V

4

.8 mm

FIXED POINT

S-PBGA-B425

667 rpm

NO

MPC8555PXAQDX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

64

32

GRID ARRAY

1.25 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.3 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

1000 rpm

YES

MPC850VR50BU

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

26

32

3.3

GRID ARRAY

BGA256,16X16,50

3.135 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.35 mm

23 mm

YES

32

50 MHz

40

260

23 mm

CMOS

3.3 V

Microprocessors

1.27 mm

FIXED POINT

S-PBGA-B256

3

Not Qualified

50 rpm

YES

e1

MPC8347EZQALFB

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

YES

32

66 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

667 rpm

YES

MPC8533VTARGA

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1067 rpm

YES

MPC8347EZQALD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

620

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

32

32

1.2,2.5,3.3

GRID ARRAY

BGA620,28X28,40

1.14 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

2.46 mm

29 mm

YES

32

66 MHz

29 mm

CMOS

1.2 V

Microprocessors

1 mm

FLOATING POINT

S-PBGA-B620

Not Qualified

667 rpm

YES

e0

MPC8555EPXALDX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

667 rpm

YES

MC8641DVJ1500KB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.15 V

16

32

GRID ARRAY

1.05 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-CBGA-B1023

1500 rpm

YES

MPC8533VJARF

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1067 rpm

YES

MPC8536BVJANGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.76 mm

29 mm

YES

64

40

260

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

800 rpm

YES

e2

MPC8541PXAQE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1.35 V

64

32

GRID ARRAY, HEAT SINK/SLUG

1.25 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.3 V

1 mm

FLOATING POINT

R-PBGA-B783

Not Qualified

1000 rpm

YES

P1013SSE2MHA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

0

32

GRID ARRAY

1 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

0

133 MHz

31 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-PBGA-B689

1200 rpm

YES

e2

MPC8555EVTALE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

15

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

29 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

667 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.