OTHER Microprocessors 1,705

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MPC8541PXAKE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MC8610PX1066JZ	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.7 mm		29 mm		YES	64				29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	1066 rpm	YES
P1010CSN5FHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MPC8280ZUQLDX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY, LOW PROFILE		1.45 V	105 Cel		0 Cel		BOTTOM	1.65 mm		37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz			37.5 mm	CMOS		1.5 V					1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	333 rpm	NO
MPC8347EZQADFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm		29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	1	Not Qualified	266 rpm	YES
MPC8306VMADDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V					.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	266 rpm	YES	e2
MPC8347EZQADDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	1	Not Qualified	266 rpm	YES
MPC8536BVJAKGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm		29 mm		YES	64		40	260	29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783	3		600 rpm	YES	e2
MC8640DVJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4				1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO	e2
MPC8555EPXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MC8641VJ1333JC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm		33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V					1 mm	FLOATING POINT	S-CBGA-B1023			1333 rpm	YES
MCIMX7S3DVK08SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.95 V	95 Cel		0 Cel		BOTTOM	1.1 mm		12 mm	SEATED-HGT CALCULATED	YES	32		40	260	12 mm	CMOS		1 V					.4 mm	FLOATING POINT	S-PBGA-B488	3		800 rpm	YES
MCIMX7D2DVM12SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.2 V	85 Cel		0 Cel		BOTTOM	1.42 mm		19 mm		YES	16		40	260	19 mm	CMOS		1.225 V					.75 mm	FLOATING POINT	S-PBGA-B541	3		1200 rpm	YES
T1023NSN7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5			.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
MPC8306VMAFFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz			19 mm	CMOS		1 V					.8 mm	FLOATING POINT	S-PBGA-B369			333 rpm	YES	e1
MPC8568VTAUJJ	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40	1.045 V	105 Cel		0 Cel		BOTTOM	2.75 mm		33 mm		YES	64		40	260	33 mm	CMOS		1.1 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B1023	3	Not Qualified	1333 rpm	YES	e2
MC8640DHX1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4		Microprocessors		1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	NO	e0
MPC8555EVTAJE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm		29 mm		YES	64				29 mm	CMOS		1.2 V					1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
P1010NSN5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		667 rpm	NO	e2
P1010CSN5FHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MPC8379EVRALGA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS		1 V	4				1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	667 rpm	YES	e2
MCIMX6L7DVN10AB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	576	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm	16384	13 mm		YES	32		40	260	13 mm	CMOS	1.1 mA					CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B	3	Not Qualified	1000 rpm	YES	e1	162
LS1012ASE7EKA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V	16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V					.5 mm	FIXED POINT	S-XBGA-N211	3		600 rpm	YES
MPC8377VRAJGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V	125 Cel		0 Cel		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B689			533 rpm	YES
MPC8240LZU200X	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32		GRID ARRAY, LOW PROFILE		2.375 V	105 Cel		0 Cel		BOTTOM	1.65 mm		35 mm		YES	64				35 mm	CMOS		2.5 V					1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
MPC8533ECVTAQGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	32	66 MHz			29 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e2
MPC8541VTAKE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
T1020NSE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			64		GRID ARRAY			105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM					NO		1400 MHz	30	250		CMOS									S-PBGA-B780	3			NO	e1
P1010NSN5KFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
MPC857TZQ100B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		3.3 V					1.27 mm	FIXED POINT	S-PBGA-B357	3		100 rpm	YES	e0
MPC8560VT833JC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	3.85 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MCIMX7S3EVK08SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.95 V	105 Cel		-20 Cel		BOTTOM	1.1 mm		12 mm	SEATED-HGT CALCULATED	YES	32		40	260	12 mm	CMOS		1 V					.4 mm	FLOATING POINT	S-PBGA-B488	3		800 rpm	YES
LS1012ASN7KKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V	16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V					.5 mm	FIXED POINT	S-XBGA-N211	3		1000 rpm	YES
MPC8572ELVJATLE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		0 Cel		BOTTOM	3.38 mm		33 mm		YES	64	133 MHz			33 mm	CMOS		1.1 V					1 mm	FIXED POINT	S-PBGA-B1023			1200 rpm	YES
P1010CSN5KFA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
MPC8349EZUALFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	667 rpm	YES	e0
MC8641VJ1000HC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		0 Cel		BOTTOM	2.77 mm		33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V					1 mm	FLOATING POINT	S-CBGA-B1023			1000 rpm	YES
MPC8378EVRANF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	1 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm		31 mm		YES	64				31 mm	CMOS		1.05 V	4				1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC859PVR133A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC8349EZUALFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	1	Not Qualified	667 rpm	YES
MPC8555EVTALFX	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8313EZQAGD	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	YES	e0
MPC8533VTAQJ	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			1000 rpm	YES
MPC8347EZUAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	1	Not Qualified	400 rpm	YES
MPC8535BVJATHA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.76 mm		29 mm		YES	64		40	260	29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783	3		1250 rpm	YES	e2
P1010CSE5FHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MC8640DVU1250HC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32		GRID ARRAY		1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V					1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	YES	e2
P1010CSE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.