Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
241 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
24 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
85 Cel |
-20 Cel |
BOTTOM |
1.2 mm |
12 mm |
YES |
16 |
10 MHz |
12 mm |
CMOS |
3.3 V |
.65 mm |
FLOATING POINT |
S-PBGA-B241 |
Not Qualified |
80 rpm |
YES |
||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.46 V |
0 |
64 |
64 |
GRID ARRAY |
3.14 V |
85 Cel |
7 |
0 Cel |
PERPENDICULAR |
4.52 mm |
0 |
47.24 mm |
5 PIPELINE STAGES; TLB |
YES |
64 |
67 MHz |
47.24 mm |
CMOS |
3.3 V |
0 |
0 |
2.54 mm |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
133 rpm |
YES |
||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
281 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.65 V |
24 |
32 |
GRID ARRAY |
1.35 V |
85 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
YES |
16 |
13.5 MHz |
CMOS |
1.5 V |
FIXED POINT |
S-PBGA-B281 |
Not Qualified |
54 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
281 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
24 |
32 |
GRID ARRAY |
1.35 V |
85 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
YES |
16 |
54 MHz |
CMOS |
FIXED POINT |
S-PBGA-B281 |
Not Qualified |
54 rpm |
NO |
e1 |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
193 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
24 |
32 |
1.5,2.5,3.3 |
GRID ARRAY |
BGA193,14X14,25 |
1.35 V |
85 Cel |
-20 Cel |
BOTTOM |
393216 |
YES |
16 |
40 MHz |
20480 |
CMOS |
74 mA |
Microcontrollers |
MROM |
.635 mm |
FIXED POINT |
S-PBGA-B193 |
Not Qualified |
40 rpm |
NO |
||||||||||||||||||||||||||||||
|
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
24 |
32 |
1.5 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,20X20,20 |
1.35 V |
85 Cel |
-20 Cel |
BOTTOM |
1.06 mm |
1048576 |
11 mm |
SEATED HGT-NOM |
YES |
16 |
13.5 MHz |
11 mm |
49152 |
CMOS |
49 mA |
1.5 V |
Microcontrollers |
FLASH |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
Not Qualified |
54 rpm |
YES |
|||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
120 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
32 |
64 |
3.3 |
FLATPACK |
QFP120,1.2SQ,32 |
3 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.45 mm |
28 mm |
YES |
32 |
133 MHz |
28 mm |
CMOS |
3.3 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PQFP-G120 |
Not Qualified |
133 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
OTHER |
BALL |
241 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
24 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
85 Cel |
-20 Cel |
BOTTOM |
1.2 mm |
12 mm |
YES |
16 |
10 MHz |
12 mm |
CMOS |
3.3 V |
.65 mm |
FLOATING POINT |
S-PBGA-B241 |
Not Qualified |
80 rpm |
YES |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
32 |
3.3 |
CHIP CARRIER |
LDCC84,1.2SQ |
3.135 V |
85 Cel |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
4.57 mm |
29.286 mm |
BURST BUS; 5 PIPELINE STAGES |
NO |
32 |
33.33 MHz |
30 |
225 |
29.2862 mm |
CMOS |
130 mA |
3.3 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J84 |
1 |
Not Qualified |
16.67 rpm |
NO |
e0 |
||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
32 |
64 |
FLATPACK |
2.375 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
250 MHz |
28 mm |
CMOS |
2.5 V |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
250 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
90 MHz |
28 mm |
CMOS |
3.3 V |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
180 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
64 |
64 |
FLATPACK, FINE PITCH |
2.375 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
100 MHz |
28 mm |
CMOS |
2.5 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
200 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
64 |
64 |
FLATPACK, FINE PITCH |
2.97 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
90 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
3 |
Not Qualified |
180 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
NO |
64 |
75 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
150 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
32 |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
4.75 V |
90 Cel |
6 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
4.826 mm |
0 |
39.9923 mm |
5 PIPELINE STAGES; MULTIPROCESSOR SUPPORT |
NO |
32 |
80 MHz |
39.9923 mm |
CMOS |
850 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P144 |
Not Qualified |
40 rpm |
NO |
e0 |
||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
HQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
FLATPACK, HEAT SINK/SLUG |
HQFP128,1.2SQ,32 |
3.135 V |
85 Cel |
6 |
0 Cel |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
90 MHz |
28 mm |
CMOS |
1050 mA |
3.3 V |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
180 rpm |
YES |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
PERPENDICULAR |
5.207 mm |
47.244 mm |
NO |
64 |
75 MHz |
47.244 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
150 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
120 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.5 V |
32 |
64 |
3.3 |
FLATPACK |
QFP120,1.2SQ,32 |
3 V |
85 Cel |
0 Cel |
TIN BISMUTH |
QUAD |
3.5 mm |
28 mm |
YES |
32 |
66.7 MHz |
10 |
260 |
28 mm |
MOS |
850 mA |
3.3 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PQFP-G120 |
4 |
Not Qualified |
167 rpm |
NO |
e6 |
||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
YES |
64 |
90 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
180 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
HQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
32 |
64 |
FLATPACK, HEAT SINK/SLUG |
QFP128,1.2SQ,32 |
2.375 V |
85 Cel |
6 |
0 Cel |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
100 MHz |
28 mm |
CMOS |
715 mA |
2.5 V |
.8 mm |
FLOATING-POINT |
S-PQFP-G128 |
200 rpm |
YES |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
PERPENDICULAR |
5.207 mm |
47.244 mm |
NO |
64 |
87.5 MHz |
47.244 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
175 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
1.6 mm |
20 mm |
YES |
32 |
50 MHz |
20 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
Not Qualified |
100 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
1.6 mm |
20 mm |
YES |
32 |
50 MHz |
20 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
3 |
Not Qualified |
100 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
OTHER |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
MIL-PRF-38535 Class V |
20 |
16 |
IN-LINE |
4.75 V |
125 Cel |
-35 Cel |
GOLD |
DUAL |
5.72 mm |
15.24 mm |
QUALIFIED TO MIL-38535-V |
NO |
16 |
5 MHz |
100k Rad(Si) |
CMOS |
5 V |
2.54 mm |
FIXED POINT |
R-CDIP-T40 |
Qualified |
5 rpm |
YES |
e4 |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
NO |
64 |
100 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
200 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
NO |
64 |
100 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
200 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
64 |
64 |
FLATPACK, FINE PITCH |
2.97 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
100 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
200 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
3.3 |
FLATPACK |
QFP128,1.2SQ,32 |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.86 mm |
27.69 mm |
NO |
32 |
75 MHz |
30 |
225 |
27.69 mm |
CMOS |
625 mA |
3.3 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
150 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
YES |
64 |
125 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
250 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
32 |
64 |
FLATPACK |
2.97 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
90 MHz |
28 mm |
CMOS |
3.3 V |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
180 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
PERPENDICULAR |
5.207 mm |
47.244 mm |
NO |
64 |
67 MHz |
47.244 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
133 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
32 |
64 |
FLATPACK, FINE PITCH |
2.375 V |
85 Cel |
-10 Cel |
TIN LEAD |
QUAD |
3.8 mm |
28 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
83.3 MHz |
28 mm |
MOS |
2.5 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
167 rpm |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.63 V |
64 |
64 |
FLATPACK, FINE PITCH |
2.97 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
90 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
180 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
PERPENDICULAR |
5.207 mm |
47.244 mm |
NO |
64 |
87.5 MHz |
47.244 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
175 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
J BEND |
84 |
QCCJ |
SQUARE |
METAL |
YES |
32 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
95 Cel |
0 Cel |
TIN LEAD |
QUAD |
30 |
225 |
CMOS |
400 mA |
5 V |
Microprocessors |
1.27 mm |
S-MQCC-J84 |
1 |
Not Qualified |
20 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
NO |
64 |
87.5 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
175 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
YES |
64 |
125 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
250 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
YES |
64 |
90 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
180 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
CACHE COHERENCY |
YES |
64 |
100 MHz |
52.324 mm |
CMOS |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
100 rpm |
NO |
e0 |
||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
NO |
64 |
75 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
150 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
3.3 |
FLATPACK |
QFP128,1.2SQ,32 |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.86 mm |
27.69 mm |
NO |
32 |
100 MHz |
30 |
225 |
27.69 mm |
CMOS |
450 mA |
3.3 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
100 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
YES |
64 |
90 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
180 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
PERPENDICULAR |
5.207 mm |
47.244 mm |
NO |
64 |
100 MHz |
47.244 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
200 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
HQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
FLATPACK, HEAT SINK/SLUG |
HQFP128,1.2SQ,32 |
3.135 V |
85 Cel |
6 |
0 Cel |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
125 MHz |
28 mm |
CMOS |
1400 mA |
3.3 V |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
250 rpm |
YES |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
YES |
64 |
100 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
200 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
32 |
32 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
4.75 V |
85 Cel |
6 |
0 Cel |
TIN LEAD |
QUAD |
4.57 mm |
0 |
29.083 mm |
BURST BUS; 5 PIPELINE STAGES |
NO |
32 |
40 MHz |
30 |
225 |
29.083 mm |
CMOS |
400 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J84 |
1 |
Not Qualified |
20 rpm |
NO |
e0 |
|||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
64 |
64 |
FLATPACK |
2.375 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
100 MHz |
28 mm |
CMOS |
2.5 V |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
200 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
3.3 |
FLATPACK |
QFP128,1.2SQ,32 |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.86 mm |
27.69 mm |
NO |
32 |
90 MHz |
30 |
225 |
27.69 mm |
CMOS |
625 mA |
3.3 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
180 rpm |
YES |
e0 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.