BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8270ZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm			37.5 mm			YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs		1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	100 rpm	NO	e0
MPC8306CVMAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			0	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		0 Cel	TIN SILVER	BOTTOM	1.61 mm			19 mm			YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V					.8 mm	FLOATING POINT	S-PBGA-B369	3		333 rpm	YES	e2
MPC8309CVMADDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	489	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32	1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA489,23X23,32	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.61 mm			19 mm			YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V			Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B489	3	Not Qualified	266 rpm	YES	e2
MPC8313ECVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm			YES	32		40	260	27 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313ECVRAGDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm			YES	32		40	260	27 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8313EVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm			YES	32		40	260	27 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8313EVRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm		ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313ZQAFFC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.55 mm			27 mm			YES	32		40	260	27 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e0
MPC8323EVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm			27 mm			YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8343CZQADDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.46 mm			29 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e0
MPC8358CVVAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.8/2.5,3.3	GRID ARRAY, LOW PROFILE	BGA740,37X37,40	1.14 V				TIN SILVER	BOTTOM	1.69 mm			37.5 mm			YES	32	66.67 MHz	40	260	37.5 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	400 rpm	YES	e2
MPC8360VVAJDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		32	32	1.8/2.5,3.3	GRID ARRAY, LOW PROFILE	BGA740,37X37,40	1.15 V				TIN SILVER	BOTTOM	1.69 mm			37.5 mm			YES	32	66.67 MHz	40	260	37.5 mm	CMOS		1.3 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	533 rpm	YES	e2
MPC8541EVTALF	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	3.75 mm			29 mm			YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	R-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC8555EVTAPF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V					BOTTOM	3.75 mm			29 mm			YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	833 rpm	YES
MPC855TVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm			25 mm			YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC8569EVJANKGB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.97 V				TIN SILVER COPPER	BOTTOM	3.94 mm			29 mm			YES	64	133 MHz	30	245	29 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	800 rpm	YES	e1
NHPXA270C5C416	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V		26	32		GRID ARRAY		1.2825 V				TIN SILVER COPPER	BOTTOM							YES	32	3.6864 MHz				CMOS		1.35 V						FIXED POINT	S-PBGA-B360		Not Qualified	416 rpm	YES	e1
OMAP3530ECUS	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25		90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm						30	260	16 mm	CMOS					Graphics Processors		.65 mm		S-PBGA-B423	4	Not Qualified	720 rpm		e1
P2010NSN2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm			31 mm			YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V					1 mm	FLOATING POINT	S-PBGA-B689	3		1000 rpm	YES	e2
P2020NXE2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm			31 mm			YES	64		40	260	31 mm	CMOS		1.05 V	4		Microprocessors		1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1000 rpm	NO	e2
P2020NXE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm			31 mm			YES	64		40	260	31 mm	CMOS		1.05 V	4		Microprocessors		1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1200 rpm	NO	e2
P2041NSE1PNB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	0 Cel		BOTTOM	2.51 mm			23 mm		ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64				23 mm	CMOS		1.8 V	4				.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
P2041NXE1PNB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel		BOTTOM	2.51 mm			23 mm		ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64				23 mm	CMOS		1.8 V	4				.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
P4080NXE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm			37.5 mm			YES	16	133.3 MHz	30	245	37.5 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
PC7448FGH1267ND	Teledyne E2v (Uk)	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		36	32	1.05,1.5/2.5	GRID ARRAY	BGA360,19X19,50	1 V	125 Cel		-40 Cel		BOTTOM	2.8 mm			25 mm			YES	64	200 MHz			25 mm	CMOS		1.05 V			Microprocessors		1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1267 rpm	NO
PCX755BVZFU350LE	Atmel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32		GRID ARRAY		1.8 V					BOTTOM	2.77 mm			25 mm		ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz			25 mm	CMOS		2 V					1.27 mm	FLOATING POINT	S-PBGA-B360		Not Qualified	350 rpm	YES
PPC440SPE-ANB667C	Applied Micro Circuits	MICROPROCESSOR, RISC		BALL	675	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA675,26X26,40	1.425 V					BOTTOM	3.22 mm			27 mm			YES	64	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS	5400 mA	1.5 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B675		Not Qualified	667 rpm	YES
R7S721034VCBG#AC0	Renesas Electronics	MICROPROCESSOR, RISC		BALL	176	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	26			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA176,15X15,20	1.1 V	85 Cel	8	-40 Cel		BOTTOM	1.4 mm		3145728	8 mm			YES	32	13.33 MHz			8 mm	CMOS	492 mA	1.18 V	16	13			.5 mm	FLOATING POINT	S-PBGA-B176	3		400 rpm	YES
R7S910026CBG#AC0	Renesas Electronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	320	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		26	32		GRID ARRAY		1.14 V	125 Cel		-40 Cel		BOTTOM							YES	32					CMOS		1.2 V						FLOATING POINT	S-PBGA-B320	3		450 rpm	YES
SCIMX6Q5EYM10CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64		GRID ARRAY, HEAT SINK/SLUG		1.35 V					BOTTOM	1.6 mm			21 mm			YES	64	24 MHz			21 mm	CMOS							.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES
T1022NXE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm			23 mm			YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
T1042ME3PQB	Teledyne E2v (Uk)	MICROPROCESSOR, RISC	MILITARY	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		32	64		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.97 V	125 Cel	12	-55 Cel		BOTTOM	2.07 mm			23 mm			YES	16	133.3 MHz			23 mm	CMOS		1 V	6	8			.8 mm	FIXED POINT	S-PBGA-B780			1400 rpm	YES
T1042NSE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm			23 mm			YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
T4240NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm			45 mm			YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V					1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
TMS320DM8147BCYE1	Texas Instruments	MICROPROCESSOR, RISC		BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA688,28X28,32	1.28 V				TIN SILVER COPPER	BOTTOM	3.06 mm		16384	23 mm			YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
TMS320DM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm		16384	23 mm			YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72		Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
TDA1MDRCCYEA0	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm		16384	23 mm			YES	16	30 MHz	30	250	23 mm	CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
66AK2H12BXAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm			40 mm			YES	64		30	245	40 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B1517	4		1200 rpm	YES	e1
AM5K2E04ABDA	Texas Instruments	MICROPROCESSOR, RISC		BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.997 V		16			GRID ARRAY, FINE PITCH		.902 V					BOTTOM	3.55 mm			27 mm			YES	64				27 mm	CMOS		.95 V					.8 mm	FLOATING POINT	S-PBGA-B1089			1000 rpm	YES
OMAP3530DCBC72	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		26	32	1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20	1.71 V	85 Cel		-40 Cel		BOTTOM	1 mm			14 mm			YES	16	59 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.8 V			Graphics Processors		.65 mm	FLOATING POINT	S-PBGA-B515		Not Qualified	720 rpm	YES
AM5K2E02DABDA4	Texas Instruments	MICROPROCESSOR, RISC		BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.997 V		16			GRID ARRAY, FINE PITCH		.902 V					BOTTOM	3.55 mm			27 mm			YES	64				27 mm	CMOS		.95 V					.8 mm	FLOATING POINT	S-PBGA-B1089			1400 rpm	YES
XOMAP3530DCUSE	Texas Instruments	MICROPROCESSOR, RISC		BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			15			GRID ARRAY, LOW PROFILE, FINE PITCH							BOTTOM	1.4 mm			16 mm			YES	32	38.4 MHz			16 mm	CMOS		1.15 V					.65 mm	FLOATING POINT	S-PBGA-B423			600 rpm	YES
XOMAP3530DCBC	Texas Instruments	MICROPROCESSOR, RISC		BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			25	32	1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20						BOTTOM	1 mm			14 mm			YES	16	59 MHz			14 mm	CMOS					Graphics Processors		.65 mm	FLOATING POINT	S-PBGA-B515		Not Qualified	600 rpm	YES
DM383AAAR21	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		27	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm			16 mm			YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V					.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
X66AK2H06AAWA24	Texas Instruments	MICROPROCESSOR, RISC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		24			GRID ARRAY		.95 V					BOTTOM	3.75 mm			40 mm		ALSO OPERATES AT 1200 GHZ	YES	16	156.25 MHz			40 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B1517			1400 rpm	YES
X66AK2H06AAAWA2	Texas Instruments	MICROPROCESSOR, RISC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		24			GRID ARRAY		.95 V					BOTTOM	3.75 mm			40 mm			YES	16	156.25 MHz			40 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B1517			1200 rpm	YES
AMIC120BZDNA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	0	524288	17 mm	0	ALSO HAVING 28-BIT ADDRESS AND 16-BIT DATA OF GPMC	YES	32		30	260	17 mm	CMOS	600 mA	1.1 V	64	4		CAN, ETHERNET, I2C, SPI(2), UART, USB	.65 mm	FIXED POINT	S-PBGA-B491	3		300 rpm	YES	e1
OMAP3525ECBBA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.9 mm			12 mm						30	260	12 mm	CMOS					Graphics Processors		.4 mm		S-PBGA-B515	3	Not Qualified	600 rpm		e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.