BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
RTPXA270C5C416	Intel	MICROPROCESSOR, RISC		BALL	356	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.485 V			26	32		GRID ARRAY		1.2825 V					BOTTOM					YES	32	3.6864 MHz	30	240		CMOS		1.35 V					FIXED POINT	S-PBGA-B356		Not Qualified	416 rpm	YES
TMPR4937XBG-300	Toshiba	MICROPROCESSOR, RISC	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			20	64	1.5,3.3	GRID ARRAY	BGA484,26X26,50	1.4 V	70 Cel		0 Cel		BOTTOM	2.46 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	133.3 MHz	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS		1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B484		Not Qualified	300 rpm	YES
XPC755BRX300LD	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	YES	2.1 V						GRID ARRAY		1.9 V					BOTTOM					YES						CMOS		2 V					FIXED POINT	R-CBGA-B360			300 rpm	NO
XPC823ZT66B2	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES					32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM													3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	66 rpm
XPC860ENCZP50D4	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel		BOTTOM	2.05 mm		25 mm		YES	32	50 MHz			25 mm	CMOS		3.3 V			Other Microprocessor ICs	1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	50 rpm	YES
Z3735F	Intel	MICROPROCESSOR		BALL	592		SQUARE	PLASTIC/EPOXY	YES	YES					64									BOTTOM					NO						CMOS							FIXED POINT	S-PBGA-B592			1830 rpm	NO
MPC8250ACZUMHBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V			32	32		GRID ARRAY, LOW PROFILE		1.9 V					BOTTOM	1.65 mm		37.5 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	64		30	220	37.5 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm	NO
MPC8313ECVRAFFC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	NICKEL GOLD	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e4
P2010NSE2MFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
P2041NSE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V			16			GRID ARRAY	BGA780,28X28,32	1.71 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm		23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64		30	245	23 mm	CMOS		1.8 V	4			.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES	e1
ADSP-BF606KBCZ-4	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V				32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	400 rpm	YES	e1
ADSP-BF607KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V				32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
AM1802EZCED3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
AM5729BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz		250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5729BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V			16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V				.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AT91SAM9G15-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel	2	-40 Cel		BOTTOM	1.4 mm	32768	15 mm		YES	32	133 MHz			15 mm	CMOS		1 V	16	3	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
AT91SAM9X35-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	32768	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	16		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B217		Not Qualified	400 rpm	YES
ATSAMA5D22A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.1 V	85 Cel	1	-40 Cel	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	BOTTOM	1.2 mm	131072	11 mm		YES	32	24 MHz			11 mm	CMOS		1.2 V	51	1		.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D22C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D22C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32			.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D26C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D26C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D27A-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	105 Cel		-40 Cel		BOTTOM	1.4 mm		14 mm		YES	32	24 MHz			14 mm	CMOS		1.2 V				.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D41B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm		YES	16	50 MHz			14 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B289			600 rpm	YES
ATSAMA5D44A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361	3		600 rpm	YES	e2
CT80618003201AB	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	676	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			32	32		GRID ARRAY, FINE PITCH		.75 V	85 Cel		-40 Cel		BOTTOM	2.35 mm		22 mm		NO	32	14.318 MHz	NOT SPECIFIED	NOT SPECIFIED	22 mm	CMOS		1.05 V				.8 mm	FLOATING POINT	S-PBGA-B676			1300 rpm	YES
D6417750RBA240HVU0	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			26	32		GRID ARRAY, HEAT SINK/SLUG		1.35 V	85 Cel		-40 Cel		BOTTOM	2.6 mm		27 mm		YES	64	34 MHz			27 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B256	3		240 rpm	YES
IBM25PPC970MP7TR25AFT	Ibm Microelectronics	MICROPROCESSOR, RISC		BALL	575	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.75 V			0	64		GRID ARRAY	BGA576,24X24,40	2.65 V					BOTTOM	2.23 mm		25 mm		YES	0	700 MHz			25 mm	CMOS		2.7 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B575		Not Qualified	1800 rpm	YES
LS1020ASN7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B525	3		800 rpm	YES	e1
LS1043ASE8PQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V			14	64		GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
MC7447AHX1167NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32		GRID ARRAY		1.25 V				TIN LEAD	BOTTOM	3.24 mm		25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1167 rpm	YES	e0
MC7447ATHX1167NB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32		GRID ARRAY		1.25 V				TIN LEAD	BOTTOM	3.24 mm		25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz	40	260	25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1167 rpm	YES	e0
MC7447AVU1267LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32		GRID ARRAY		1.25 V					BOTTOM	2.8 mm		25 mm	ALSO REQUIRES 1.8V OR 2.5V SUPPLY	YES	64	167 MHz			25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES	e2
MC7448VU1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES
MC8640DTHJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V			32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		-40 Cel		BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1067 rpm	NO
MC8641DVJ1333JE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			16	32		GRID ARRAY		1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	64		30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3		1333 rpm	YES	e2
MCF52277CVM160	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		15 mm		YES	32	66.67 MHz	40	260	15 mm	CMOS	.7 mA	1.5 V			Microprocessors	.5 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	NO	e1
MCF5232CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MCF5253CVM140	NXP Semiconductors		OTHER	BALL	225	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.32 V			16			GRID ARRAY, FINE PITCH		1.08 V	70 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	2.85 mm		13 mm		YES	16	35 MHz	40	260	13 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B225	3		140 rpm	NO	e1
MCF54410CMF250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0			GRID ARRAY		1.14 V	85 Cel		-40 Cel		BOTTOM					YES	0					CMOS		1.2 V					FIXED POINT	S-PBGA-B196			250 rpm	YES
MCF54450VM240	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	40	260	17 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF5474VR200	NXP Semiconductors	MICROPROCESSOR		BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8		32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1.5 V	16	4		1 mm	FLOATING POINT	S-PBGA-B388	3			YES	e1
MCF5474ZP266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			32	32		GRID ARRAY		1.43 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES	32	66.66 MHz	40	260	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e0
MCF5475VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			32	32		GRID ARRAY		1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES	32	66.66 MHz	40	260	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e1
MCIMX6S6AVM10AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS						.8 mm		S-PBGA-B624	3				e1
MCIMX6U1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MPC5200CVR400	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			13			GRID ARRAY, HEAT SINK/SLUG		1.42 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.5 V				1.27 mm	FIXED POINT	S-PBGA-B272	3		400 rpm	YES	e1
MPC8255AVVMHBB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V			32	32		GRID ARRAY, LOW PROFILE		1.9 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	40	260	37.5 mm	CMOS						1.27 mm	FLOATING POINT	S-PBGA-B480	3		266 rpm	NO	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.