BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MC7448THX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V		36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V		Microprocessors		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MPC7410HX500LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V		32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V				TIN LEAD	BOTTOM	3.2 mm		25 mm		YES	64	133 MHz	40	260	25 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	500 rpm	YES	e0
MPC8313CVRADDC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V		Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
XPC8240LZU200E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2.375 V	105 Cel	5	0 Cel		BOTTOM	1.65 mm		35 mm		YES	64	66 MHz			35 mm	CMOS		2.5 V	2			1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
MCF5207CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA144,12X12,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	40 MHz	40	260	13 mm	CMOS		1.5 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	166.67 rpm	YES	e1
MCF54453CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
CL8068404165200SRFEH	Intel	MICROPROCESSOR		BALL	1440		RECTANGULAR	PLASTIC/EPOXY	YES	YES				64			BGA1440(UNSPEC)						BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1440			4100 rpm	NO
GCIXP1200GA	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	432	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA432,31X31,50	1.9 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.67 mm		40 mm		YES	32	166 MHz			40 mm	CMOS		2 V		Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B432		Not Qualified	166 rpm	NO	e0
LH8066803102701SREKA	Intel	MICROPROCESSOR		BALL	1296		RECTANGULAR	PLASTIC/EPOXY	YES	YES				64					85 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1296			1800 rpm	NO
MCF5233CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCF5235CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
P1022NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES		133 MHz	40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
P2010NXE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16	32		GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
P3041NXN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.04 V		0			GRID ARRAY		.96 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	0	133 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
AF82801JIRSLB8S	Intel	MICROPROCESSOR		BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40						BOTTOM											CMOS				Other uPs/uCs/Peripheral ICs		1 mm		S-PBGA-B676		Not Qualified
LUPXA255A0C400	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.43 V		26	32	1.3,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.235 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2 mm		17 mm		YES	32	3.6864 MHz	40	250	17 mm	CMOS		1.3 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	400 rpm	YES	e1
MCF54454CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MPC860DEZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
XPC860SRZP50C1	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD	BOTTOM	2.05 mm		25 mm			32	50 MHz			25 mm	CMOS		3.3 V		Other Microprocessor ICs		1.27 mm		S-PBGA-B357		Not Qualified	50 rpm		e0
CH80566EE014DT/SLGPP	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	437	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	AEC-Q100	28	64	1	GRID ARRAY, HEAT SINK/SLUG	BGA437,21X21,40	.9 V	85 Cel		-40 Cel		BOTTOM	2.792 mm		22 mm	IT ALSO OPERATES IN 800 MHZ AT 0.9V SUPPLY	YES	64		NOT SPECIFIED	NOT SPECIFIED	22 mm	CMOS		1 V		Microprocessors		1 mm	FLOATING POINT	S-PBGA-B437		Not Qualified	1330 rpm	YES
FH8065301487715SR1RE	Intel	MICROPROCESSOR		BALL	1170	BGA	RECTANGULAR	UNSPECIFIED	YES	YES			16	64		GRID ARRAY							BOTTOM					YES	64		NOT SPECIFIED	NOT SPECIFIED		CMOS							FIXED POINT	R-XBGA-B1170			1910 rpm	YES
FH8065301487717SR1X6	Intel	MICROPROCESSOR		BALL	1170	BGA	RECTANGULAR	UNSPECIFIED	YES	YES			16	64		GRID ARRAY							BOTTOM					YES	64		NOT SPECIFIED	NOT SPECIFIED		CMOS							FIXED POINT	R-XBGA-B1170			1910 rpm	YES
GG8067402570801SR2M5	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1667	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			0	64		GRID ARRAY			85 Cel		-40 Cel		BOTTOM					NO	0					CMOS							FIXED POINT	S-PBGA-B1667			1500 rpm	NO
LUPXA255A0C200	Intel	MICROPROCESSOR	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		26	32	1,2.5/3.3,3.3	GRID ARRAY	BGA256,16X16,40	.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2 mm		17 mm		YES	32	3.6864 MHz			17 mm	CMOS		1 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B256		Not Qualified	200 rpm	YES	e1
MC9328MXLVH15	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25	32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel		0 Cel		BOTTOM	1.6 mm		14 mm		YES	32	16 MHz			14 mm	CMOS		1.8 V		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256		Not Qualified	150 rpm	YES
MCF54452VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
MPC5123VY400B	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	70 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8321EVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC860ENCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
P1013NSN2LFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		1067 rpm	YES	e2
P2020NSE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS		1.05 V	4	Microprocessors		1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1200 rpm	NO	e2
P4040NSE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1295,36X36,40	.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1200 rpm	YES	e1
PRIXP425ABD	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY		YES					1.3,3.3	GRID ARRAY	BGA492,26X26,50		70 Cel		0 Cel		BOTTOM											CMOS				Microprocessors		1.27 mm		S-PBGA-B492		Not Qualified
T1022NXN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES
FJ8066201931104SR2EU	Intel	MICROPROCESSOR		BALL	1356	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1356			2300 rpm	NO
HW8076502639602SR38B	Intel	MICROPROCESSOR		BALL	1310	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1310			2200 rpm	NO
HW8076502640002SR38F	Intel	MICROPROCESSOR		BALL	1310		RECTANGULAR	PLASTIC/EPOXY	YES	YES				64							-40 Cel		BOTTOM					NO						CMOS							FIXED-POINT	R-PBGA-B1310			1700 rpm	NO
MCIMX6L3EVN10AB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	576	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm	16384	13 mm		YES	32		40	260	13 mm	CMOS	1.1 mA				CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B	3	Not Qualified	1000 rpm	YES	e1	162
MCIMX6L3EVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm					40	260	13 mm	CMOS						.5 mm		S-PBGA-B	3				e1
MPC8569ECVJAQLJB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.97 V				TIN SILVER COPPER	BOTTOM	3.94 mm		29 mm		YES	64	133 MHz	30	245	29 mm	CMOS		1 V		Microprocessors		1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1067 rpm	YES	e1
MPC860DEZQ50D4R2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860ENCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V		Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
NHPXA270C5C520	Intel	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.595 V		26	32		GRID ARRAY		1.3775 V				TIN SILVER COPPER	BOTTOM					YES	32	3.6864 MHz				CMOS		1.45 V					FIXED POINT	S-PBGA-B360		Not Qualified	520 rpm	YES	e1
P1010NXN5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
PR80321M400SL84R	Intel	MICROPROCESSOR		BALL	544	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V		64			GRID ARRAY		1.235 V					BOTTOM	2.59 mm		35 mm		YES	64	133 MHz			35 mm	CMOS		1.3 V				1.27 mm	FIXED POINT	S-PBGA-B544		Not Qualified	400 rpm	YES
S3C2410A20-YO80	Samsung	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel		BOTTOM	1.26 mm		14 mm		YES	32	20 MHz			14 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B272			200 rpm	YES
XPC850DSLZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.