BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
XPC860TZP50D4	Motorola	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel		BOTTOM	2.05 mm		25 mm		YES	32	50 MHz			25 mm	CMOS		3.3 V			Other Microprocessor ICs	1.27 mm	FIXED POINT	S-PBGA-B357		Not Qualified	50 rpm	YES
AM5706BCBDD	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
IBM25PPC750FX-GB0133T	Ibm Microelectronics	MICROPROCESSOR, RISC		BALL	292	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.5 V			32	32	1.45,1.8/3.3	GRID ARRAY	BGA292,20X20,40	1.4 V					BOTTOM	3.087 mm		21.02 mm		YES	64	200 MHz			21.02 mm	CMOS		1.45 V			Microprocessors	1 mm	FLOATING POINT	S-CBGA-B292		Not Qualified	600 rpm	YES
KMPC852TVR100A	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32		GRID ARRAY		1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
MC9328MXSVP10R2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V			25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MPC8360ECVVAJDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			32	32	1.8/2.5,3.3	GRID ARRAY, LOW PROFILE	BGA740,37X37,40	1.15 V				TIN SILVER	BOTTOM	1.69 mm		37.5 mm		YES	32	66.67 MHz	40	260	37.5 mm	CMOS		1.3 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	533 rpm	YES	e2
AM1808EZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V				.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
FH8065301487918SR1X7	Intel	MICROPROCESSOR		BALL	1170	BGA	RECTANGULAR	UNSPECIFIED	YES	YES				16	64		GRID ARRAY							BOTTOM					YES	64		NOT SPECIFIED	NOT SPECIFIED		CMOS							FIXED POINT	R-XBGA-B1170			1750 rpm	YES
FH8065801974816SR267	Intel	MICROPROCESSOR		BALL	1168	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1168			3200 rpm	NO
MC7455ARX733LG	Motorola	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V			36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	733 rpm	YES
MPC8280ZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64		40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	YES	e0
RJ80530UY750512	Intel	MICROPROCESSOR, RISC		BALL	479	BGA	SQUARE	CERAMIC		YES					32	1.15,1.25	GRID ARRAY	BGA479,26X26,50					Tin/Lead (Sn/Pb)	BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B479		Not Qualified	750 rpm		e0
DM388AAAR21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAARD11FP	Texas Instruments	MICROPROCESSOR, RISC		BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V				TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		970 rpm	YES	e1
DM388AAARD21FP	Texas Instruments	MICROPROCESSOR, RISC		BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V				TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
FH8065301487717SR3UT	Intel	MICROPROCESSOR	INDUSTRIAL	BALL	1170		RECTANGULAR	UNSPECIFIED	YES	YES					64		GRID ARRAY			110 Cel		-40 Cel		BOTTOM					NO						CMOS							FIXED POINT	R-XBGA-B1170			1910 rpm	NO
MPC860PCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860PZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
MPC860SRVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
MPC860TCZQ66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			-40 Cel	TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC860TZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V			0 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
AM6411AKCGHAALV	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.79 V	16		0	64		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	1	-40 Cel		BOTTOM	2.652 mm	1048576	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	YES	16	25 MHz			17.2 mm	CMOS		.75 V				.8 mm	FIXED POINT	S-PBGA-B441			1000 rpm	YES
AT91SAM9G45-CU	Microchip Technology	MICROPROCESSOR, RISC		BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	37	7		.8 mm	FIXED POINT	S-PBGA-B324			400 rpm	YES
AT91SAM9G45-CU-999	Microchip Technology	MICROPROCESSOR, RISC		BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	.9 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	65536	15 mm		YES	32	50 MHz			15 mm	CMOS		1 V	37	7		.8 mm	FIXED POINT	S-PBGA-B324			400 rpm	YES
ATSAMA5D44B-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
DF8064101211300/SR0VY	Intel	MICROPROCESSOR, RISC		BALL	559	BGA		PLASTIC/EPOXY		YES					64	1,1.5	GRID ARRAY	BGA559(UNSPEC)						BOTTOM											CMOS	6700 mA				Microprocessors					Not Qualified	1860 rpm
FH8066802980002SR2YB	Intel	MICROPROCESSOR		BALL	1296	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1296			2400 rpm	NO
FH8066802980002SR2Z7	Intel	MICROPROCESSOR		BALL	1296	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY							BOTTOM					NO						CMOS							FIXED POINT	R-PBGA-B1296			2400 rpm	NO
KMPC8347EVRAGDB	Freescale Semiconductor	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY		1.14 V				Tin/Silver (Sn/Ag)	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
KMPC885VR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		40	260	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MC7448HX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MC7448HX1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.05 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz	40	260	25 mm	CMOS		1.1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1250 rpm	YES	e0
MC7448HX1700LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.32 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.25 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.3 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1700 rpm	YES	e0
MC7448HX600ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	600 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	600 rpm	YES	e0
MC7448THX1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES	e0
MC7448TVU1000ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V			0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1000 MHz	40	260	25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-B360	1		1000 rpm	YES
MC7448VU1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1000 rpm	YES
MC7448VU1600LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.3 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.2 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.25 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1600 rpm	YES
MCF5272CVM66	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
MCF5275LCVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166 rpm	YES	e1
MPC8309CVMAHFCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	489	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32	1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA489,23X23,32	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V			Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B489	3	Not Qualified	417 rpm	YES	e2
MPC8349CVVAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349CZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8349ECVVAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC860TVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
SPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V		AEC-Q100	32	32	1.4,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
STM32MP135FAE7T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.32 V	105 Cel		-40 Cel		BOTTOM	1.7 mm	172032	14 mm		YES	16	48 MHz			14 mm	CMOS	268 mA	1.35 V	56	10		.8 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.