BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCF5485CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
STM32MP157DAC1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz			12 mm	CMOS	865 mA	.9 V	48				.65 mm	FLOATING POINT	S-PBGA-B361			800 rpm	YES
AM3352BZCZD30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
MPC8308VMAGDA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.54 mm		19 mm		YES		66.67 MHz	40	260	19 mm	CMOS		1 V		2			.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
ATSAMA5D21C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32				.75 mm	FLOATING POINT	S-PBGA-B196			500 rpm	YES	e2
AM3505AZER	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1400 mA	1.2 V	32		Microprocessors		1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
STM32MP151DAC1	STMicroelectronics	MICROPROCESSOR, RISC		BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,23X23,25/20	1.3 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	16	48 MHz			12 mm	CMOS	955 mA	1.34 V	48	8			.65 mm	FLOATING POINT	S-PBGA-B361			800 rpm	YES
MCIMX535DVP2C2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4 V	8		26	32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.3 V	85 Cel		-20 Cel		BOTTOM	1.85 mm	147456	19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	800 mA	1.35 V		5			.8 mm	FLOATING POINT	S-PBGA-B529	3		1200 rpm	YES
MCF5272VM66R2	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32	3.3	GRID ARRAY	BGA196,14X14,40	3 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
P1010NXE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		667 rpm	NO	e2
AM3356BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3352BZCEA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors		.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
AM3352BZCED30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors		.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
ADSP-BF609BBCZ-5X	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			25			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel		BOTTOM	1.5 mm		19 mm	ALSO AVAILABLE IN 3.3V AND 14 BIT ADDRESS	YES	16				19 mm	CMOS		1.8 V					.8 mm	FIXED POINT	S-PBGA-B349			500 rpm	YES
MPC8569EVTAUNLB	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.133 V			16	32	1.1,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	1.067 V				TIN SILVER COPPER OVER NICKEL	BOTTOM	3.94 mm		29 mm		YES	64	133 MHz	30	245	29 mm	CMOS		1.1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B783	3	Not Qualified	1333 rpm	YES
P3041NSN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY	BGA1295,36X36,40	.95 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	133 MHz	30	245	37.5 mm	CMOS		1 V	8	8			1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
AM3358BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V			28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO HAVING MULTIPLEXED 16 BIT ADDRESS	YES	16	26 MHz	30	260	13 mm	CMOS		1.1 V					.65 mm	FIXED POINT	S-PBGA-B298	3		600 rpm	YES	e1
AM3354BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
MCIMX6L8DVN10AB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	576	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm	16384	13 mm		YES	32		40	260	13 mm	CMOS	1100 mA					CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B	3	Not Qualified	1000 rpm	YES	e1	162
SAM9X60D5MT-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16				.8 mm	FIXED POINT	R-PBGA-B233	3		600 rpm	YES	e1
DM3730CBPA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.08 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm	CMOS	1400 mA	1.14 V	128		Digital Signal Processors		.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
SAMA7G54-V/4HB	Microchip Technology	MICROPROCESSOR, RISC		BALL	343	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.21 V	8		26			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA343,21X21,25	1.12 V	105 Cel	2	-40 Cel		BOTTOM	1.2 mm	131072	14 mm		YES	16	50 MHz			14 mm	CMOS			72	1			.65 mm	FLOATING POINT	S-PBGA-B343			1000 rpm	YES
AM3351BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64				.65 mm	FIXED POINT	S-PBGA-B298	3		600 rpm	YES	e1
MIMXRT1052DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0	0 Cel		BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	105 mA		32	29			.65 mm	FLOATING-POINT	S-PBGA-B196			600 rpm	YES
AM3354BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
SAM9X60D5M-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	512-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16				.8 mm	FIXED POINT	R-PBGA-B233	3		600 rpm	YES	e1
APQ-8016E-1-760NSP-TR-01-0	Qualcomm	MICROPROCESSOR, RISC	OTHER	BALL	760	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.12 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.84 V	60 Cel		-30 Cel		BOTTOM	.96 mm		12 mm						255	14 mm	CMOS									R-PBGA-B760	3				e1
MCF5328CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	80 MHz	40	260	17 mm	CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
ATSAMA5D27C-LD2G-CUR22	Microchip Technology	MICROPROCESSOR, RISC		BALL	361	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY		1.1 V	85 Cel	1	-40 Cel		BOTTOM		131072			YES	16	24 MHz				CMOS		1.2 V	51	7				FLOATING POINT	S-PBGA-B361			500 rpm	YES
AM3351BZCE60R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64				.65 mm	FIXED POINT	S-PBGA-B298	3		600 rpm	YES	e1
SAM9X60D6K-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm	CMOS		1.8 V	16				.65 mm	FIXED POINT	R-PBGA-B196	3		600 rpm	YES	e1
ATSAMA5D225C-D1M-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16		0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	65536	11 mm		YES	0	24 MHz			11 mm	CMOS		1.2 V	51	1			.75 mm	FIXED POINT	S-PBGA-B196			500 rpm	YES	e2
ATSAMA5D27C-LD2G-CU22	Microchip Technology	MICROPROCESSOR, RISC		BALL	361	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY		1.1 V	85 Cel	1	-40 Cel		BOTTOM		131072			YES	16	24 MHz				CMOS		1.2 V	51	7				FLOATING POINT	S-PBGA-B361			500 rpm	YES
MCIMX6U5EVM10ACR	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES				16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		21 mm		YES	64	24 MHz	40	260	21 mm	CMOS							.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
SAM9X60D6KT-I/4GB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8		6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,16X16,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	11 mm	64-Mbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	11 mm	CMOS		1.8 V	16				.65 mm	FIXED POINT	R-PBGA-B196	3		600 rpm	YES	e1
AM3505AZCN	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8		16	16	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	65536	17 mm		YES	16	26 MHz	30	260	17 mm	CMOS	1400 mA	1.2 V	32		Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B491	3	Not Qualified	600 rpm	YES	e1
SPC5125YVN400R	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES			AEC-Q100		32	1.4,3.3	GRID ARRAY	BGA324,22X22,40		85 Cel		-40 Cel	TIN SILVER	BOTTOM								40	260							Microprocessors		1 mm		S-PBGA-B324	3	Not Qualified	400 rpm		e2
MCIMX536AVV8CR2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			26	32	1.1,1.3,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	1450 mA	1.1 V			Graphics Processors		.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES	e2
ATSAMA5D33A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
AM3357BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
MPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V			32			GRID ARRAY, HEAT SINK/SLUG		1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V					1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
ATSAMA5D34A-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
AM3356BZCZ80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8		28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AT91SAM9263B-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	98304	15 mm		YES	32	50 MHz			15 mm	CMOS	73.3 mA	1.2 V	22				.8 mm	FIXED POINT	S-PBGA-B324			240 rpm	YES	e1
ATSAMA5D35A-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
DM3730CUS100NEP	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			26	32	1.2,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.08 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm		YES	16	54 MHz	30	260	16 mm	CMOS	37 mA	1.14 V			Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
MCF5484CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
SAM9X60T-V/DWB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	228	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.21 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA228,16X16,26	1.12 V	105 Cel	1	-40 Cel		BOTTOM	1.2 mm	69632	11 mm		YES	32	48 MHz			11 mm	CMOS		1.15 V	16				.65 mm	FIXED POINT	S-PBGA-B228			600 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.