BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
P1010NXE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
STM32MP135FAG7	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.32 V	105 Cel		-40 Cel		BOTTOM	1.2 mm	172032	9 mm		YES	16	48 MHz			9 mm	CMOS	268 mA	1.35 V	56	10		.5 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP135AAE3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.21 V	125 Cel		-40 Cel		BOTTOM	1.7 mm	172032	14 mm		YES	16	48 MHz			14 mm	CMOS	239 mA	1.25 V	56	10		.8 mm	FIXED POINT	S-PBGA-B289			650 rpm	YES
AM3517AZCN	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16	16	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	65536	17 mm		YES	16	26 MHz	30	260	17 mm	CMOS	1500 mA	1.2 V	32		Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B491	3	Not Qualified	600 rpm	YES	e1
MIMXRT1064DVL6AR	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196.14X14,25	1.25 V	85 Cel		0 Cel		BOTTOM	1.43 mm	1048576	10 mm		YES			40	260	10 mm	CMOS	100 mA					.65 mm	FLOATING POINT	S-PBGA-B196	3		600 rpm	YES
SAM9X60D1G-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	1-Gbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16			.8 mm	FIXED POINT	R-PBGA-B233	3		600 rpm	YES	e1
AT91SAM9261B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	1.08 V	85 Cel	3	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm	163840	15 mm		YES	32	20 MHz			15 mm	CMOS		1.2 V	19	7	Microcontrollers	.8 mm	FIXED POINT	S-PBGA-B217	3	Not Qualified	190 rpm	YES	e1
MIMXRT1064DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	85 Cel	0	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	1048576	12 mm		YES	0	24 MHz	40	260	12 mm	CMOS	110 mA		32	10		.8 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES	e1
MPC8308CVMAGDA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.54 mm		19 mm		YES			40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
OSD3358-512M-IND	Octavo Systems	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	NO	YES		8	28			GRID ARRAY	BGA400,20X20,50		85 Cel	1	-40 Cel		BOTTOM	2.6 mm	65536	27 mm	64kbytes shared l3 ram also available	YES	16			245	27 mm	CMOS	2000 mA	1.1 V				1.27 mm	FIXED POINT	S-PBGA-B400	4		1000 rpm	NO
AM5708BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm		17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS		1.15 V				.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
ATSAMA5D27C-LD2G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1		.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
ATSAMA5D27C-D5M-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16	0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,32	1.14 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	65536	14 mm		YES	0	24 MHz			14 mm	CMOS		1.2 V	51	1		.8 mm	FIXED POINT	S-PBGA-B289			500 rpm	YES
P1010NXE5KHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	1000 rpm	NO	e2
AM3517AZCNC	Texas Instruments	MICROPROCESSOR, RISC		BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		16	16	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V				TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm		YES	16	26 MHz	30	260	17 mm	CMOS		1.2 V			Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B491	3	Not Qualified	600 rpm	YES	e1
ATSAMA5D36A-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
DM3730CBPD100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,23X23,20	1.08 V	90 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm	CMOS	37 mA	1.14 V	128		Digital Signal Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
STM32MP151DAD1	STMicroelectronics	MICROPROCESSOR, RISC		BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.3 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	48 MHz			10 mm	CMOS	955 mA	1.34 V	48	8		.65 mm	FLOATING POINT	S-PBGA-B257			800 rpm	YES
MCF5272VM66	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		23	32		GRID ARRAY		3 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
ATSAMA5D27C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
ATSAMA5D34A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
ADSP-BF609BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
MCF54418CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel		BOTTOM					YES	0	100 MHz	40	260		CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
AM3352BZCE30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
MCF5485CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
STM32MP151DAB1	STMicroelectronics	MICROPROCESSOR, RISC		BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	1.3 V	105 Cel		-20 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	48 MHz			16 mm	CMOS	955 mA	1.34 V	48	8		.8 mm	FLOATING POINT	S-PBGA-B354			800 rpm	YES
STM32MP135DAE7	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.32 V	105 Cel		-40 Cel		BOTTOM	1.7 mm	172032	14 mm		YES	16	48 MHz			14 mm	CMOS	268 mA	1.35 V	56	10		.8 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
XAM3517AZCN	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		15			GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V	90 Cel		0 Cel		BOTTOM	1.3 mm		17 mm		YES	32	59 MHz			17 mm	CMOS		1.2 V				.65 mm	FLOATING POINT	S-PBGA-B491			600 rpm	YES
AM3894CCYG135	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.31 mm	65536	25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V	72		Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
P1010NXE5FFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
ATSAMA5D27C-LD1G-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1		.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
P1010NXE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
ATSAMA5D36A-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	48 MHz			15 mm	CMOS		1.2 V	39	10	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
STM32MP151AAD3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.18 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	940 mA	1.2 V	48	8		.65 mm	FLOATING POINT	S-PBGA-B257			650 rpm	YES
SAM9X60D1GT-I/4FB	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	233	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.9 V	8	6			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA233,17X17,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm	69632	14 mm	1-Gbit DDR2--SDRAM AVAILABLE	YES	16	50 MHz	30	260	14 mm	CMOS		1.8 V	16			.8 mm	FIXED POINT	R-PBGA-B233	3		600 rpm	YES	e1
KMPC8270CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
ATSAMA5D27C-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
P1010NXE5DFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
AT91SAM9261B-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	1.08 V	85 Cel	3	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	163840	15 mm		YES	32	20 MHz			15 mm	CMOS		1.2 V	19	7		.8 mm	FIXED POINT	S-PBGA-B217			190 rpm	YES	e1
STM32MP157DAD1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B257			800 rpm	YES
ATSAMA5D26C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32			.8 mm	FLOATING POINT	S-PBGA-B289			500 rpm	YES
MPC8314VRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
AM3505AZCNC	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16	16	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	65536	17 mm		YES	16	26 MHz	30	260	17 mm	CMOS	1400 mA	1.2 V	32		Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B491	3	Not Qualified	600 rpm	YES	e1
AM3352BZCZT60	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.2 V	64			.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
MCF5474VR266	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8	32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1.5 V	16	4		1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e1
ATSAMA5D27C-D5M-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	16	0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	65536	14 mm		YES	0	24 MHz			14 mm	CMOS		1.8 V	51	1		.8 mm	FIXED POINT	S-PBGA-B289			500 rpm	YES
STM32MP151AAA3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	1.18 V	125 Cel		-40 Cel	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	BOTTOM	1.32 mm	724992	18 mm		YES	16	48 MHz	30	260	18 mm	CMOS	940 mA	1.2 V	48	8		.8 mm	FLOATING POINT	S-PBGA-B448	3		650 rpm	YES	e2
AM3505AZERAC	Texas Instruments	MICROPROCESSOR, RISC		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V				TIN SILVER COPPER	BOTTOM	2.48 mm		23 mm		YES	16	26 MHz	30	260	23 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.