BALL Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
P1021NXE2FFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0		32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM		2.46 mm		31 mm			YES		0	100 MHz	40	260	31 mm		CMOS			1 V						1 mm	FIXED POINT	S-PBGA-B689	3		667 rpm	YES	e2
PPC460EX-SUA1000T	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V			32				GRID ARRAY		1.2 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.65 mm		35 mm			YES		32	100 MHz			35 mm		CMOS			1.25 V						1 mm	FLOATING POINT	S-PBGA-B728		Not Qualified	1000 rpm	YES	e1
R7S721001VCBG	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		26	NO	32		GRID ARRAY, FINE PITCH	BGA324,22X22,32	1.1 V	85 Cel	8	-40 Cel		YES	BOTTOM	YES	2.1 mm	10485760	19 mm	0		YES	DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT	32	48 MHz			19 mm	10485760	CMOS	8-Ch 12-Bit		1.18 V	16	YES	8		CAN(5), ETHERNET(2), I2C(4), IEB, LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2)	.8 mm	FLOATING POINT	S-PBGA-B324			400 rpm	YES		169
STM32MP131FAF7T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	320	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26		32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA320,21X21,20	1.32 V	105 Cel		-40 Cel			BOTTOM		1.2 mm	172032	11 mm			YES		16	48 MHz			11 mm		CMOS		268 mA	1.35 V	56		8			.5 mm	FIXED POINT	S-PBGA-B320			1000 rpm	YES
STM32MP133FAE7	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.32 V	105 Cel		-40 Cel			BOTTOM		1.7 mm	172032	14 mm			YES		16	48 MHz			14 mm		CMOS		268 mA	1.35 V	56		10			.8 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP151AAA3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	1.18 V	125 Cel		-40 Cel	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)		BOTTOM		1.32 mm	724992	18 mm			YES		16	48 MHz	30	260	18 mm		CMOS		940 mA	1.2 V	48		8			.8 mm	FLOATING POINT	S-PBGA-B448	3		650 rpm	YES	e2
T1013NSN7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel			BOTTOM		2.07 mm		19 mm			YES		32				19 mm		CMOS		5 mA	1 V	2		5			.8 mm	FIXED POINT	S-PBGA-B525			1000 rpm	YES
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16		64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		19 mm			YES		32		40	260	19 mm		CMOS		5 mA	1 V	2		5			.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T4081NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES				16				GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER		BOTTOM		3.33 mm		45 mm			YES		64	133.3 MHz	30	250	45 mm		CMOS									1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
TMS320DM8147SCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		28		32	1.1/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.06 mm	8192	23 mm			YES		16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS			1.2 V	72			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
TMS320DM8148CCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		28		32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.06 mm	16384	23 mm			YES		16	30 MHz	NOT SPECIFIED	250	23 mm		CMOS			1.2 V	72			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
XAM5708BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.298 mm		17 mm			YES		32	38.4 MHz	30	260	17 mm		CMOS			1.15 V						.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
XAM5749ABZXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel			BOTTOM		1.63 mm		23 mm			YES		32	38.4 MHz			23 mm		CMOS			1.15 V						.8 mm	FIXED POINT	S-PBGA-B760			1500 rpm	YES
AM3703CBP	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26		32	1.1,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	.9 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		.71 mm	65536	12 mm			YES		16	54 MHz	NOT SPECIFIED	260	12 mm		CMOS		740 mA	1.1 V				Microprocessors		.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
AM3703CUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26		32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm	65536	16 mm			YES		16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS		740 mA	1.1 V				Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	1000 rpm	YES	e1
AM3715CUSA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8		26		32	1.1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	.9 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm	65536	16 mm			YES		16	54 MHz	NOT SPECIFIED	260	16 mm		CMOS		800 mA	1.1 V				Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B423	3	Not Qualified	800 rpm	YES	e1
AM5708BCBDJAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.298 mm		17 mm			YES		32	38.4 MHz	30	260	17 mm		CMOS			1.15 V						.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AM5708BCBDJAS	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.298 mm		17 mm		GPMC CONSISTS OF 28-BIT ADDRESS LINES AND 16-BIT DATA LINES	YES		32	38.4 MHz	30	260	17 mm		CMOS			1.15 V						.65 mm	FIXED POINT	S-PBGA-B538	3		1000 rpm	YES	e1
AU80586GE025D/SLB73	Intel	MICROPROCESSOR, RISC		BALL	437	BGA	SQUARE	PLASTIC/EPOXY		YES						32	1/1.5	GRID ARRAY	BGA437,21X21,40							BOTTOM															CMOS		3000 mA					Microprocessors		1 mm		S-PBGA-B437		Not Qualified	1600 rpm
FS32R274KSK2MMM	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	257	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V	8	ISO 26262			32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA257,17X17,32	1.19 V	125 Cel	1	-40 Cel	TIN SILVER		BOTTOM		1.51 mm	1572864	14 mm			YES			40 MHz	40	260	14 mm		CMOS		1642 mA	1.25 V	32					.8 mm	FLOATING-POINT	S-PBGA-B257	3		240 rpm	YES	e2
KMPC8347ECVRAGDB	Freescale Semiconductor	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32		32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM		2.46 mm		29 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	29 mm		CMOS			1.2 V						1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
LE80537GF0484MSLGFV	Intel	MICROPROCESSOR		BALL	479	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	YES				0		64		GRID ARRAY								BOTTOM							NO		0						CMOS										FIXED POINT	X-PBGA-B479			2160 rpm	YES
MCF5208CVM166J	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24		32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		15 mm			YES		32	40 MHz	40	260	15 mm		CMOS			1.5 V				Microprocessors		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	YES
MCF5274VM166	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24		32		GRID ARRAY, LOW PROFILE		1.4 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	83 MHz	40	260	17 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
MCF54450VM240J	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES				14		32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		70 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm		17 mm			YES		16		40	260	17 mm		CMOS							Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES
MCF5475ZP266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			32		32		GRID ARRAY		1.43 V	70 Cel		0 Cel	NICKEL GOLD		BOTTOM		2.55 mm		27 mm			YES		32	66.66 MHz	40	260	27 mm		CMOS			1.5 V						1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e4
MPC5200VR400B	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			32		32		GRID ARRAY		1.42 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.65 mm		27 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	66 MHz	40	260	27 mm		CMOS			1.5 V						1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
MPC5200VR400BR2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			13				GRID ARRAY		1.42 V	70 Cel		0 Cel			BOTTOM		2.65 mm		27 mm			YES		32	35 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm		CMOS			1.5 V						1.27 mm	FLOATING POINT	S-PBGA-B272			400 rpm	YES
MPC8241LVR266D	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32		32		GRID ARRAY		1.7 V				TIN SILVER COPPER		BOTTOM		2.56 mm		25 mm			YES		64	66 MHz	30	245	25 mm		CMOS			1.8 V						1.27 mm	FLOATING POINT	S-PBGA-B357	3	Not Qualified	266 rpm	YES	e1
MPC8275CVRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32		32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V				TIN SILVER		BOTTOM		2.55 mm		27 mm			YES		64	266 MHz	30	245	27 mm		CMOS			1.5 V				Other uPs/uCs/Peripheral ICs		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC8323EVRAFDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			14				GRID ARRAY, HEAT SINK/SLUG		.95 V						BOTTOM		2.55 mm		27 mm			YES		32		40	260	27 mm		CMOS			1 V						1 mm	FLOATING POINT	S-PBGA-B516			333 rpm	YES
MPC8349EVVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32		32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER		BOTTOM		1.69 mm		35 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	35 mm		CMOS			1.2 V				Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349VVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32		32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER		BOTTOM		1.69 mm		35 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	35 mm		CMOS			1.2 V				Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349VVAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32		32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel			BOTTOM		1.69 mm		35 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz	40	260	35 mm		CMOS			1.2 V				Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES
P1010NSE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	Tin/Silver (Sn/Ag)		BOTTOM		1.9 mm		19 mm			YES		32		40	260	19 mm		CMOS			1 V	4			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
P2020NSE2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16			1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER		BOTTOM		2.46 mm		31 mm			YES		64		40	260	31 mm		CMOS			1.05 V	4			Microprocessors		1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1000 rpm	NO	e2
P2020NXN2KHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16			1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER		BOTTOM		2.46 mm		31 mm			YES		64		40	260	31 mm		CMOS			1.05 V	4			Microprocessors		1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1000 rpm	NO	e2
PPC460EX-SUA600T	Applied Micro Circuits	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	728	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V			32				GRID ARRAY		1.2 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.65 mm		35 mm			YES		32	100 MHz			35 mm		CMOS			1.25 V						1 mm	FLOATING POINT	S-PBGA-B728		Not Qualified	600 rpm	YES	e1
STM32MP131FAE7	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.32 V	105 Cel		-40 Cel			BOTTOM		1.7 mm	172032	14 mm			YES		16	48 MHz			14 mm		CMOS		268 mA	1.35 V	56		8			.8 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP133FAG7	STMicroelectronics	MICROPROCESSOR, RISC		BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26		32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,20	1.32 V	105 Cel		-40 Cel			BOTTOM		1.2 mm	172032	9 mm			YES		16	48 MHz			9 mm		CMOS		268 mA	1.35 V	56		10			.5 mm	FIXED POINT	S-PBGA-B289			1000 rpm	YES
STM32MP157AAB3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	125 Cel		-40 Cel			BOTTOM		1.29 mm	724992	16 mm			YES		16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm		CMOS		1000 mA	.9 V	48					.8 mm	FLOATING POINT	S-PBGA-B354			650 rpm	YES
X66AK2H06AAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			24				GRID ARRAY		.95 V	85 Cel		0 Cel			BOTTOM		3.75 mm		40 mm		ALSO OPERATES AT 1200 GHZ	YES		16	156.25 MHz			40 mm		CMOS			1 V						1 mm	FLOATING POINT	S-PBGA-B1517			1400 rpm	YES
MPC8343ZQADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32		32		GRID ARRAY		1.14 V	105 Cel		0 Cel	TIN LEAD		BOTTOM		2.46 mm		29 mm		ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES		32	66 MHz			29 mm		CMOS			1.2 V						1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e0
STM32MP157AAD3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		16		32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel			BOTTOM		1.2 mm	724992	10 mm			YES		16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1000 mA	.9 V	48					.65 mm	FLOATING POINT	S-PBGA-B257			650 rpm	YES
FWIXP420BC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	492	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.365 V			32		32	1.3,3.3	GRID ARRAY	BGA492,26X26,50	1.235 V	70 Cel		0 Cel			BOTTOM		2.59 mm		35 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	33.33 MHz			35 mm		CMOS			1.3 V				Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B492	1	Not Qualified	400 rpm	NO
MCF5484CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V					32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN LEAD		BOTTOM		2.55 mm		27 mm			YES			66.67 MHz	40	260	27 mm		CMOS			3.3 V						1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
MCF53721CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24		32		GRID ARRAY		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.75 mm		15 mm			YES		32	80 MHz	40	260	15 mm		CMOS			1.5 V						1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MPC5200CBV266	Motorola	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V			32				GRID ARRAY		1.42 V	85 Cel		-40 Cel			BOTTOM		2.65 mm		27 mm			YES		32	35 MHz			27 mm		CMOS			1.5 V						1.27 mm	FIXED POINT	S-PBGA-B272		Not Qualified	266 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.