Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
16 |
0 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
65536 |
14 mm |
YES |
0 |
24 MHz |
14 mm |
CMOS |
1.2 V |
51 |
1 |
.8 mm |
FIXED POINT |
S-PBGA-B289 |
500 rpm |
YES |
||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
8 |
26 |
NO |
32 |
1.8,1.8/3.3,3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
1.65 V |
85 Cel |
3 |
-40 Cel |
MATTE TIN |
YES |
QUAD |
YES |
4.1 mm |
32768 |
8192 |
28 mm |
ALSO OPERATES AT 3.3V SUPPLY |
YES |
32 |
50 MHz |
28 mm |
8192 |
CMOS |
1.8 V |
22 |
YES |
1 |
Microcontrollers |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
3 |
Not Qualified |
180 rpm |
YES |
e3 |
96 |
|||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
217 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
8 |
TS 16949 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA217,17X17,32 |
.9 V |
85 Cel |
3 |
-40 Cel |
BOTTOM |
1.4 mm |
32768 |
15 mm |
YES |
32 |
50 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
CMOS |
1 V |
24 |
1 |
.8 mm |
FIXED POINT |
S-PBGA-B217 |
400 rpm |
YES |
|||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
8 |
26 |
NO |
32 |
1,1.8/3.3,3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA324,18X18,32 |
.9 V |
85 Cel |
ARM9 |
1 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.4 mm |
65536 |
65536 |
15 mm |
YES |
32 |
50 MHz |
40 |
260 |
15 mm |
65536 |
CMOS |
1 V |
37 |
YES |
7 |
Microcontrollers |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B324 |
3 |
Not Qualified |
400 rpm |
YES |
e1 |
160 |
|||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
16 |
0 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
65536 |
14 mm |
YES |
0 |
24 MHz |
14 mm |
CMOS |
1.2 V |
51 |
1 |
.8 mm |
FIXED POINT |
S-PBGA-B289 |
500 rpm |
YES |
||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.2 V |
85 Cel |
1 |
-40 Cel |
BOTTOM |
1.4 mm |
131072 |
14 mm |
ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED |
YES |
16 |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
CMOS |
1.25 V |
32 |
.8 mm |
FLOATING POINT |
S-PBGA-B289 |
500 rpm |
YES |
||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
32 |
0 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
32768 |
16 mm |
YES |
0 |
24 MHz |
16 mm |
CMOS |
1.8 V |
51 |
1 |
.8 mm |
FIXED POINT |
S-PBGA-G361 |
500 rpm |
YES |
||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
217 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA217,17X17,32 |
1.65 V |
85 Cel |
3 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
8192 |
15 mm |
YES |
32 |
50 MHz |
15 mm |
CMOS |
1.8 V |
22 |
.8 mm |
FIXED POINT |
S-PBGA-B217 |
210 rpm |
YES |
e1 |
|||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
8 |
26 |
NO |
32 |
1.8,3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
1.65 V |
85 Cel |
ARM7 |
7 |
-40 Cel |
MATTE TIN |
NO |
QUAD |
YES |
4.1 mm |
131072 |
16384 |
28 mm |
SEATED HEIGHT -MIN |
YES |
32 |
80 MHz |
260 |
28 mm |
16384 |
CMOS |
1.8 V |
20 |
YES |
1 |
Microcontrollers |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
3 |
Not Qualified |
209 rpm |
YES |
e3 |
94 |
|||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
233 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA233,17X17,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
14 mm |
1-Gbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
14 mm |
CMOS |
1.8 V |
16 |
.8 mm |
FIXED POINT |
R-PBGA-B233 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
217 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA217,17X17,32 |
1.08 V |
85 Cel |
3 |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1.4 mm |
163840 |
15 mm |
YES |
32 |
20 MHz |
15 mm |
CMOS |
1.2 V |
19 |
7 |
Microcontrollers |
.8 mm |
FIXED POINT |
S-PBGA-B217 |
3 |
Not Qualified |
190 rpm |
YES |
e1 |
||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
32 |
0 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
32768 |
16 mm |
YES |
0 |
24 MHz |
16 mm |
CMOS |
1.8 V |
51 |
1 |
.8 mm |
FIXED POINT |
S-PBGA-G361 |
500 rpm |
YES |
||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
16 |
0 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
65536 |
14 mm |
YES |
0 |
24 MHz |
14 mm |
CMOS |
1.2 V |
51 |
1 |
.8 mm |
FIXED POINT |
S-PBGA-B289 |
500 rpm |
YES |
||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
105 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.2 V |
105 Cel |
1 |
-40 Cel |
BOTTOM |
1.4 mm |
131072 |
14 mm |
ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED |
YES |
16 |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
CMOS |
1.25 V |
32 |
.8 mm |
FLOATING POINT |
S-PBGA-B289 |
500 rpm |
YES |
||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
32 |
0 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
32768 |
16 mm |
YES |
0 |
24 MHz |
16 mm |
CMOS |
1.8 V |
51 |
1 |
.8 mm |
FIXED POINT |
S-PBGA-G361 |
500 rpm |
YES |
||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
105 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
233 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA233,17X17,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
14 mm |
1-Gbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
14 mm |
CMOS |
1.8 V |
16 |
.8 mm |
FIXED POINT |
R-PBGA-B233 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.2 V |
85 Cel |
1 |
-40 Cel |
BOTTOM |
1.4 mm |
131072 |
14 mm |
ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED |
YES |
16 |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
CMOS |
1.25 V |
32 |
.8 mm |
FLOATING POINT |
S-PBGA-B289 |
500 rpm |
YES |
||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
217 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA217,17X17,32 |
1.08 V |
85 Cel |
3 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
163840 |
15 mm |
YES |
32 |
20 MHz |
15 mm |
CMOS |
1.2 V |
19 |
7 |
.8 mm |
FIXED POINT |
S-PBGA-B217 |
190 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.2 V |
85 Cel |
1 |
-40 Cel |
BOTTOM |
1.4 mm |
131072 |
14 mm |
ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED |
YES |
16 |
24 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
CMOS |
1.25 V |
32 |
.8 mm |
FLOATING POINT |
S-PBGA-B289 |
500 rpm |
YES |
||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
16 |
0 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
65536 |
14 mm |
YES |
0 |
24 MHz |
14 mm |
CMOS |
1.8 V |
51 |
1 |
.8 mm |
FIXED POINT |
S-PBGA-B289 |
500 rpm |
YES |
||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA196,14X14,30 |
1.2 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
1.2 mm |
131072 |
11 mm |
ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED |
YES |
16 |
24 MHz |
11 mm |
CMOS |
1.25 V |
32 |
.75 mm |
FLOATING POINT |
S-PBGA-B196 |
500 rpm |
YES |
e2 |
||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
233 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA233,17X17,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
14 mm |
512-Mbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
14 mm |
CMOS |
1.8 V |
16 |
.8 mm |
FIXED POINT |
R-PBGA-B233 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
BALL |
343 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.21 V |
8 |
26 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA343,21X21,25 |
1.12 V |
105 Cel |
2 |
-40 Cel |
BOTTOM |
1.2 mm |
131072 |
14 mm |
YES |
16 |
50 MHz |
14 mm |
CMOS |
72 |
1 |
.65 mm |
FLOATING POINT |
S-PBGA-B343 |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
233 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA233,17X17,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
14 mm |
512-Mbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
14 mm |
CMOS |
1.8 V |
16 |
.8 mm |
FIXED POINT |
R-PBGA-B233 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
BALL |
361 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY |
1.1 V |
85 Cel |
1 |
-40 Cel |
BOTTOM |
131072 |
YES |
16 |
24 MHz |
CMOS |
1.2 V |
51 |
7 |
FLOATING POINT |
S-PBGA-B361 |
500 rpm |
YES |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA196,16X16,25 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
11 mm |
64-Mbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
11 mm |
CMOS |
1.8 V |
16 |
.65 mm |
FIXED POINT |
R-PBGA-B196 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
16 |
0 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA196,14X14,30 |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
1.2 mm |
65536 |
11 mm |
YES |
0 |
24 MHz |
11 mm |
CMOS |
1.2 V |
51 |
1 |
.75 mm |
FIXED POINT |
S-PBGA-B196 |
500 rpm |
YES |
e2 |
|||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
BALL |
361 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY |
1.1 V |
85 Cel |
1 |
-40 Cel |
BOTTOM |
131072 |
YES |
16 |
24 MHz |
CMOS |
1.2 V |
51 |
7 |
FLOATING POINT |
S-PBGA-B361 |
500 rpm |
YES |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
8 |
6 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA196,16X16,25 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
69632 |
11 mm |
64-Mbit DDR2--SDRAM AVAILABLE |
YES |
16 |
50 MHz |
30 |
260 |
11 mm |
CMOS |
1.8 V |
16 |
.65 mm |
FIXED POINT |
R-PBGA-B196 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
85 Cel |
2 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
98304 |
15 mm |
YES |
32 |
50 MHz |
15 mm |
CMOS |
73.3 mA |
1.2 V |
22 |
.8 mm |
FIXED POINT |
S-PBGA-B324 |
240 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
105 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
228 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.21 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA228,16X16,26 |
1.12 V |
105 Cel |
1 |
-40 Cel |
BOTTOM |
1.2 mm |
69632 |
11 mm |
YES |
32 |
48 MHz |
11 mm |
CMOS |
1.15 V |
16 |
.65 mm |
FIXED POINT |
S-PBGA-B228 |
600 rpm |
YES |
||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA196,14X14,30 |
1.2 V |
85 Cel |
1 |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
1.2 mm |
131072 |
11 mm |
ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED |
YES |
16 |
24 MHz |
11 mm |
CMOS |
1.25 V |
32 |
.75 mm |
FLOATING POINT |
S-PBGA-B196 |
500 rpm |
YES |
e2 |
||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
26 |
32 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
1.08 V |
105 Cel |
1 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
131072 |
15 mm |
YES |
16 |
48 MHz |
15 mm |
CMOS |
1.2 V |
39 |
10 |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
536 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
217 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
8 |
26 |
32 |
1,1.8/3.3,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA217,17X17,32 |
.9 V |
85 Cel |
1 |
-40 Cel |
BOTTOM |
1.4 mm |
32768 |
15 mm |
YES |
32 |
16 MHz |
15 mm |
CMOS |
1 V |
16 |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B217 |
Not Qualified |
400 rpm |
YES |
||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
TS 16949 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.16 V |
85 Cel |
1 |
-40 Cel |
BOTTOM |
1.2 mm |
131072 |
16 mm |
YES |
32 |
50 MHz |
16 mm |
CMOS |
1.26 V |
32 |
2 |
.8 mm |
FLOATING POINT |
S-PBGA-B361 |
600 rpm |
YES |
||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
217 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
8 |
26 |
32 |
1,1.8/3.3,3.3 |
GRID ARRAY, FINE PITCH |
BGA217,17X17,32 |
.9 V |
85 Cel |
1 |
-40 Cel |
BOTTOM |
1.4 mm |
32768 |
15 mm |
YES |
32 |
16 MHz |
15 mm |
CMOS |
1 V |
16 |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B217 |
Not Qualified |
400 rpm |
YES |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.