NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
XPC755BRX400LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V		32	32		GRID ARRAY	BGA360,19X19,50	1.9 V	105 Cel		0 Cel		BOTTOM	3.2 mm		25 mm		YES	64				25 mm	CMOS		2 V				1.27 mm	FLOATING POINT	S-CBGA-B360			400 rpm	YES
BSC9132NXN7PNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm		23 mm		YES	64	100 MHz			23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1400 rpm	YES
935317359557	NXP Semiconductors	MICROPROCESSOR, RISC
935323773557	NXP Semiconductors	MICROPROCESSOR																													NOT SPECIFIED	NOT SPECIFIED
XPC850DECZT80B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V					BOTTOM	2.35 mm		23 mm		YES	32	80 MHz			23 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	80 rpm	YES
935339753557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
935316788557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN									30	250											3				e3
935322498557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
P5010NSE1QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
MPE603EFE133LX	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	CERAMIC, GLASS-SEALED	YES	YES	3.465 V		32	32		FLATPACK, FINE PITCH		3.135 V					QUAD	4.15 mm		31.305 mm		YES	64	66.67 MHz			31.305 mm	CMOS		3.3 V				.5 mm	FLOATING POINT	S-GQFP-G240		Not Qualified	133.33 rpm	YES
935317903574	NXP Semiconductors	MICROPROCESSOR, RISC
P5040PSN7VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5040PSE1TMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
935331865557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
S9S08RN32W1MLH	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	10 mm		NO	0	20 MHz	40	260	10 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G64	3		20 rpm	YES	e3
XPC850DEZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		0 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
P2020NSN2HHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO	e2
935315314557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									30	245											3				e2
PPC561MZP56R2	NXP Semiconductors	MICROPROCESSOR, RISC																													30	240											3
XPC850SRCZT66BU	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V					BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			66 rpm	YES
PPC7448VU1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V		0	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	1250 MHz			25 mm	CMOS		1.1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1250 rpm	YES
SC512856MZP40R2	NXP Semiconductors	MICROPROCESSOR, RISC																													30	240											3
935324045557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
935321512557	NXP Semiconductors	MICROPROCESSOR
P5040NXE72QC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2200 rpm	YES	e1
935321346518	NXP Semiconductors	MICROPROCESSOR, RISC
MVF60NN152CMK40	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm		YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
XPC7450RX533LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	CERAMIC		YES				32	1.8	GRID ARRAY	BGA484,22X22,50		105 Cel		0 Cel		BOTTOM											CMOS		1.8 V			Microprocessors	1.27 mm		S-XBGA-B484		Not Qualified	533 rpm
935318691557	NXP Semiconductors	MICROPROCESSOR																													NOT SPECIFIED	NOT SPECIFIED
P2020NSE2MHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	NO	e2
935318887557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
XPC750PRX300RE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	2 V			32		GRID ARRAY		1.8 V					BOTTOM	3.2 mm		25 mm	ALSO REQUIRES 3.3V SUPPLY	NO		100 MHz			25 mm	CMOS		1.9 V				1.27 mm	FIXED POINT	S-CBGA-B360		Not Qualified	300 rpm	YES
P5040NXN7VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
935313685557	NXP Semiconductors	MICROPROCESSOR, RISC
MPE603PRX200LX	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V		32	32		GRID ARRAY		2.375 V	70 Cel		0 Cel		BOTTOM	3 mm		21 mm		YES	64	66.67 MHz			21 mm	CMOS		2.5 V				1.27 mm	FIXED POINT	S-CBGA-B255		Not Qualified	200 rpm	YES
P2020NSE2KHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO	e2
935344041557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
P5040PSE72QC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P4080PSE1PNB	NXP Semiconductors	MICROPROCESSOR
XPC862TZP100B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32		GRID ARRAY		3.135 V					BOTTOM	2.05 mm		25 mm		YES	32				25 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B357			100 rpm	YES
PPC7448VS867NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	867 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	867 rpm	YES
935365838557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
P5021PSN72QB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
935323959557	NXP Semiconductors	MICROPROCESSOR																				TIN									40	260											3				e3
935350822557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									40	260											3				e2
P4080NSE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	16	133.3 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
935315415557	NXP Semiconductors	MICROPROCESSOR
SVF532R3N2CMK4R	NXP Semiconductors	MICROPROCESSOR, RISC

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.