NXP Semiconductors Microprocessors 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
935313719557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260												3				e1
935311591557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									30	245												3				e2
P5020NXE7QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V					TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm		CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
935338906557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250												3				e1
MSCMMX6QZCK08AB	NXP Semiconductors	MICROPROCESSOR, RISC																														260												3
LX2120SC71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V	17			1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
LX2120SN72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V	17			1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MC68040FE25V	NXP Semiconductors	MICROPROCESSOR		GULL WING	184	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	5.25 V	32	32	5	FLATPACK	QFP184,1.4SQ	4.75 V				0 Cel	MATTE TIN	QUAD					YES	32	25 MHz	40	260			HCMOS		5 V		Microprocessors		.635 mm	FIXED POINT	S-PQFP-G184	1	Not Qualified	25 rpm	YES	e3
MC9S08GT60ACB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	3.6 V		8	2/3.3	IN-LINE, SHRINK PITCH	SDIP42,.6	1.8 V	85 Cel			-40 Cel		DUAL	5.08 mm	61440	15.24 mm		NO		40 MHz			36.83 mm	4096	CMOS	7.5 mA	2 V		Microcontrollers	FLASH	1.778 mm	FIXED POINT	R-PDIP-T42	1	Not Qualified	40 rpm	YES
MPC7457VG1267LB	NXP Semiconductors
MPC603PRX200LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V						BOTTOM	3 mm		21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm		CMOS		2.5 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	200 rpm	YES
MC9S08PT16VTJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	0	8	3/5	SMALL OUTLINE	TSSOP20,.25	2.7 V	105 Cel	HCS08		-40 Cel	TIN	DUAL		16384			NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH	.635 mm	FIXED POINT	R-PDSO-G20	3	Not Qualified	20 rpm	YES	e3
MPC7410THX400LE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.9 V				GRID ARRAY		1.7 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM					NO			40	260			CMOS		1.8 V					FIXED POINT	R-PBGA-B	1	Not Qualified	400 rpm	NO	e0
MC68LC040RC25B	NXP Semiconductors	MICROPROCESSOR		PIN/PEG	179	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	NO	5.25 V	32	32	5	GRID ARRAY	PGA179,18X18	4.75 V				0 Cel		PERPENDICULAR	3.05 mm		47.245 mm		YES	32	50 MHz			47.245 mm		HCMOS		5 V		Microprocessors		2.54 mm	FIXED POINT	S-CPGA-P179		Not Qualified	25 rpm	NO
MPC755BRX300LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V					TIN LEAD	BOTTOM	3.2 mm		25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm		CMOS		2 V				1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	300 rpm	YES	e0
MPC7457RX1267LB	NXP Semiconductors
MPC755CPX400LER2	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.9 V					TIN LEAD	BOTTOM	2.77 mm		25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm		CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B360	3	Not Qualified	400 rpm	YES	e0
MC94MX21DVKN3	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.3 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel			-30 Cel		BOTTOM	1.49 mm		14 mm		YES	32		40	260	14 mm		CMOS						.65 mm	FIXED POINT	S-PBGA-B289			350 rpm	NO
LX2120XC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V	17			1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MPC603PRX240LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V						BOTTOM	3 mm		21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			21 mm		CMOS		2.5 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	240 rpm	YES
MPC7441RX700LG	NXP Semiconductors	MICROPROCESSOR, RISC
MPC603RRX266TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V						BOTTOM	3 mm		21 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	75 MHz			21 mm		CMOS		2.5 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	266 rpm	YES
MCF5234CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel		BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MPC603RZT200LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V						BOTTOM	2.6 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			23 mm		CMOS		2.5 V				1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	200 rpm	YES
MC68LC302CRC20	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	PIN/PEG	132	PGA	SQUARE	CERAMIC		NO			32	3.3,5	GRID ARRAY	PGA132,13X13		85 Cel			-40 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR												CMOS				Microprocessors		2.54 mm		S-XPGA-P132		Not Qualified	20 rpm		e0
MCF5274LVF166	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	70 Cel			0 Cel	TIN LEAD	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3		166 rpm	YES	e0
LX2080XC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V	17			1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MPC603PFE225LX	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		FLATPACK, FINE PITCH		2.375 V						QUAD	4.1 mm		32 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			32 mm		CMOS		2.5 V				.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified	225 rpm	YES
MPC755BRX300	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V						BOTTOM	3.2 mm		25 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			25 mm		CMOS		2 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	300 rpm	YES
MPC745BVT350LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY		1.8 V						BOTTOM	2.8 mm		21 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	64	100 MHz			21 mm		CMOS		2 V				1.27 mm	FLOATING POINT	S-PBGA-B255	3	Not Qualified	350 rpm	YES	e2
MC68EC040FE33B	NXP Semiconductors	MICROPROCESSOR		GULL WING	184	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	5.25 V	32	32	5	FLATPACK	QFP184,1.4SQ	4.75 V				0 Cel		QUAD					YES	32	66.66 MHz					HCMOS		5 V		Microprocessors		.635 mm	FLOATING POINT	S-PQFP-G184		Not Qualified	33 rpm	NO
LX2120XE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V	17			1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MCF54450CVM180	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	40	260	17 mm		CMOS		1.5 V		Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MCF5206E	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	28			FLATPACK		3 V	70 Cel			0 Cel		QUAD	3.85 mm		28 mm		YES	32				28 mm		CMOS		3.3 V				.65 mm	FIXED POINT	S-PQFP-G160			54 rpm	YES
MPC603RZT200TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V	32	32		GRID ARRAY		2.375 V						BOTTOM	2.6 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			23 mm		CMOS		2.5 V				1.27 mm	FLOATING POINT	S-PBGA-B255		Not Qualified	200 rpm	YES
MCF5274CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	17 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
MPC7457RX867LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	483	BGA	SQUARE	CERAMIC		YES			32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50		105 Cel			0 Cel		BOTTOM												CMOS				Microprocessors		1.27 mm		S-XBGA-B483		Not Qualified	867 rpm
LX2160SE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V	36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	0 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V	17			1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MPC755BPX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,2.5/3.3	GRID ARRAY	BGA255,16X16,50							BOTTOM												CMOS				Microprocessors		1.27 mm		S-PBGA-B255		Not Qualified	400 rpm
MPC603PRX240L	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC		YES			32	2.5,3.3	GRID ARRAY	BGA255,16X16,50							BOTTOM												CMOS				Microprocessors		1.27 mm		S-XBGA-B255		Not Qualified	240 rpm
MPC603PFE180LX	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.625 V	32	32		FLATPACK, FINE PITCH		2.375 V						QUAD	4.1 mm		32 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.67 MHz			32 mm		CMOS		2.5 V				.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified	180 rpm	YES
MCF5206EAB40	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	28	32		FLATPACK		3 V	85 Cel			-40 Cel	TIN	QUAD	3.85 mm		28 mm		YES	32	40 MHz	30	245	28 mm		CMOS		3.3 V				.65 mm	FIXED POINT	S-PQFP-G160	3		40 rpm	YES	e3
MPC7547EVUAQG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40							BOTTOM												CMOS				Microprocessors		1 mm		S-PBGA-B783		Not Qualified	1000 rpm
MCF5480CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32		GRID ARRAY		3 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm		CMOS		3.3 V				1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
MCF5232CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	15 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MPC750ARX200TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2.7 V	32	32		GRID ARRAY		2.5 V						BOTTOM	3.2 mm		25 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.3 MHz			25 mm		CMOS		2.6 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	200 rpm	YES
MCF5407CAI162	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES			32	3.3	FLATPACK	QFP208,1.2SQ,20		85 Cel			-40 Cel	TIN	QUAD								30	245			CMOS		3.3 V		Microprocessors		.5 mm		S-PQFP-G208	3	Not Qualified	162 rpm		e3
MPC7547EHXAQG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40							BOTTOM												CMOS				Microprocessors		1 mm		S-PBGA-B783		Not Qualified	1000 rpm

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.