NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC180LMA	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	1.95 V		12			FLATPACK, LOW PROFILE, FINE PITCH		1.65 V	70 Cel		0 Cel		QUAD	1.7 mm		14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz			14 mm	CMOS		1.8 V				.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES
S32V234CKN1VUB	NXP Semiconductors
P4040NSE7PNAC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, HEAT SINK/SLUG		.97 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295			1500 rpm	YES	e1
P2020NXN2HHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
935325825557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									40	260											3				e2
935311292557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									40	260											3				e2
935321158557	NXP Semiconductors	MICROPROCESSOR, RISC
P5010NXN7TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
BSC9132NXE7KNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm		23 mm		YES	64	100 MHz			23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1000 rpm	YES
BSC9132NJE7PNKB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm		23 mm		YES	64	100 MHz			23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1400 rpm	YES
935315738557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									40	260											3				e2
PPC603-FX-080-2	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	240	QFP	SQUARE	CERAMIC		YES				32	3.3	FLATPACK	QFP240,1.3SQ,20						QUAD											CMOS		3.3 V			Microprocessors	.5 mm		S-XQFP-G240		Not Qualified	80 rpm
935309535557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	245											3				e1
935316148528	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN									40	260											3				e3
P5021NXE12QB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
935323184557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									40	260											3				e2
P5020NSN7MMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY		.95 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295			1200 rpm	YES
935313963699	NXP Semiconductors	MICROPROCESSOR, RISC
P5021NXE12QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5021PXN72QB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
935319791557	NXP Semiconductors	MICROPROCESSOR, RISC
BSC9132NLN7KNKB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm		23 mm		YES	64	100 MHz			23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1000 rpm	YES
935324171557	NXP Semiconductors	MICROPROCESSOR, RISC
P5040PXN72QC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
935325946557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
XPC7410RX533PD	NXP Semiconductors	MICROPROCESSOR
935325812557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	245											3				e1
S9S08RNA8W2VTJ	NXP Semiconductors	MICROPROCESSOR																				TIN									40	260											3				e3
935313639557	NXP Semiconductors	MICROPROCESSOR, RISC
935324023557	NXP Semiconductors	MICROPROCESSOR, RISC
935313668557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	245											3				e1
935324046557	NXP Semiconductors	MICROPROCESSOR, RISC
P5010NXN1QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
935373993538	NXP Semiconductors	MICROPROCESSOR, RISC
935313707557	NXP Semiconductors	MICROPROCESSOR, RISC
935325883557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									30	245											3				e2
935313063557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
P5020NSE7QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
P5020NXE7QMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1600 rpm	YES
P2020PXE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm		YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1200 rpm	NO
935316733557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									40	260											3				e2
935323596557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									40	260											3				e2
BSC9131CJE1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
935312076557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									40	260											3				e2
XC7455BRX1333PF	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC		YES				32	1.55	GRID ARRAY	BGA483,22X22,50					Tin/Lead (Sn/Pb)	BOTTOM											CMOS		1.55 V			Microprocessors	1.27 mm		S-XBGA-B483		Not Qualified	1333 rpm		e0
S9S08RN8W2MTJ	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	8	0	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	2.7 V	125 Cel	8	-40 Cel	TIN	DUAL	1.2 mm	2048	4.4 mm		NO	0	20 MHz	40	260	6.5 mm	CMOS	14 mA	3 V		1		.65 mm	FIXED POINT	R-PDSO-G20	3		20 rpm	YES	e3
KXPC755CRX400LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES				64	2,2.5/3.3	GRID ARRAY	BGA360,19X19,50					Tin/Lead (Sn/Pb)	BOTTOM											CMOS					Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	400 rpm		e0
935324485557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									40	260											3				e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.