NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPE603EFE100LX	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	CERAMIC, GLASS-SEALED	YES	YES	3.465 V		32	32		FLATPACK, FINE PITCH		3.135 V					QUAD	4.15 mm		31.305 mm	YES	64	66.67 MHz			31.305 mm	CMOS		3.3 V				.5 mm	FLOATING POINT	S-GQFP-G240		Not Qualified	100 rpm	YES
P5021PSN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
935325249557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								40	260											4				e1
MPE603ERX100TX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V		32	32		GRID ARRAY		3.135 V					BOTTOM	3 mm		21 mm	YES	64	66.67 MHz			21 mm	CMOS		3.3 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	100 rpm	YES
XPC7445RX600LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		25 mm	YES	64	133 MHz			25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	600 rpm	YES
S9S08RNA16W2MTJ	NXP Semiconductors	MICROPROCESSOR																				TIN								40	260											3				e3
935315866557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								40	260											3				e1
935319681557	NXP Semiconductors	MICROPROCESSOR, RISC
935322709557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	245											3				e1
935338895557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	250											3				e1
935322679557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								40	260											3				e1
935365842557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								40	260											3				e1
P5010NSE1TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5040PSE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
935319173557	NXP Semiconductors	MICROPROCESSOR, RISC																				Tin/Lead/Silver (Sn/Pb/Ag)																				4				e0
935339743557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm	YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
P5040NXE12QB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
SVF532R3K1CMK4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm	YES	16		40	260	17 mm	CMOS		3.3 V				.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
BSC9132NXE7KNKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.53 mm		23 mm	YES	32		30	245	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1000 rpm	YES	e1
P4040NXN1MMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER OVER NICKEL	BOTTOM	3.53 mm		37.5 mm	YES	64	133.3 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES
SCF5250DAG120	NXP Semiconductors	MICROPROCESSOR	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24	32		FLATPACK, LOW PROFILE, FINE PITCH		1.08 V	70 Cel		-20 Cel		QUAD	1.6 mm		20 mm	YES	16	33.86 MHz			20 mm	CMOS		1.2 V				.5 mm	FIXED POINT	S-PQFP-G144			120 rpm	YES
MVF60NN152CMK50	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm	YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1
935325088557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	250											3				e1
XPC8260CVVHFBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm	YES	64	66.66 MHz	30	245	37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e1
SVF331R3K1CKU2R	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN								40	260											3				e3
935325833557	NXP Semiconductors	MICROPROCESSOR
935377468557	NXP Semiconductors	MICROPROCESSOR, RISC
935324764557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	250											3				e1
935350817557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER								40	260											3				e2
935314582557	NXP Semiconductors	MICROPROCESSOR, RISC
BSC9131NSE1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm		21 mm	YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P2020PXN2KFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm	YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
S9S08RNA16W2MTGR	NXP Semiconductors	MICROPROCESSOR																				TIN								40	260											3				e3
935344036557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN								40	260											3				e3
935326096557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	250											3				e1
935309512557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER								30	245											3				e2
XPC7455RX600NC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		29 mm	YES	64	133 MHz			29 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	600 rpm	YES
P2020NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm	YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO	e2
P2020NSE2NHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm	YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO	e2
935321125557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER								40	260											3				e2
P4080NSE1MMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	16	133.3 MHz			37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
S9S08RNA8W2CTJR	NXP Semiconductors	MICROPROCESSOR																				TIN								40	260											3				e3
MPE603EFE100TX	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	CERAMIC, GLASS-SEALED	YES	YES	3.465 V		32	32		FLATPACK, FINE PITCH		3.135 V					QUAD	4.15 mm		31.305 mm	YES	64	66.67 MHz			31.305 mm	CMOS		3.3 V				.5 mm	FLOATING POINT	S-GQFP-G240		Not Qualified	100 rpm	YES
935322733557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	245											3				e1
XPC862PCZP66B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32		GRID ARRAY		3.135 V					BOTTOM	2.05 mm		25 mm	YES	32				25 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B357			66 rpm	YES
PPC7455RX1000LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.65 V		36	32	1.3,1.5/2.5,1.8/2.5	GRID ARRAY	BGA483,22X22,50	1.55 V				TIN LEAD	BOTTOM	3.22 mm		29 mm	YES	64	133 MHz			29 mm	CMOS		1.6 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	1000 rpm	YES	e0
XCF5102PV20A	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY		YES				32	3.3	FLATPACK	QFP144,.87SQ,20				0 Cel		QUAD										CMOS		3.3 V			Microprocessors	.5 mm		S-PQFP-G144		Not Qualified	20 rpm
PS32V234CMN1AVUB	NXP Semiconductors	MICROPROCESSOR, RISC																													260											3

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.