NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
935324067557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	245											3				e1
935376005557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER									40	260											3				e2
935318015557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	245											3				e1
P5021NXN12QB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
SCIMX6Q5EYM10CC	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64	1.05/1.5	GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.35 V					BOTTOM	1.6 mm		21 mm		YES	64	24 MHz	NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS	3920 mA				Graphics Processors	.8 mm	FIXED POINT	S-PBGA-B624		Not Qualified	1000 rpm	YES
P5010NXN7TNB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V					BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES
935325951557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
935313759557	NXP Semiconductors	MICROPROCESSOR, RISC
S9S08RNA16W2VLC	NXP Semiconductors	MICROPROCESSOR																				TIN									40	260											3				e3
S9S08RN60W1MLC	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	0	8		FLATPACK, LOW PROFILE	QFP32,.35SQ,32	2.7 V	125 Cel	12	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	7 mm		NO	0	20 MHz	40	260	7 mm	CMOS	14.8 mA	3 V		2		.8 mm	FIXED POINT	S-PQFP-G32	3		20 rpm	YES	e3
935324051557	NXP Semiconductors	MICROPROCESSOR, RISC
XPC7445RX933LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		25 mm		YES	64	133 MHz			25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	933 rpm	YES
P4081NSE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	16	133.3 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
935316386557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
935313611557	NXP Semiconductors	MICROPROCESSOR
P5040NSN12QC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
S9S08RNA16W2MTJR	NXP Semiconductors	MICROPROCESSOR																				TIN									40	260											3				e3
PPC8567ECVTAUJJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm		33 mm		YES	0	166 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1333 rpm	YES	e2
935316394518	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									40	260											3				e1
P2020NSE2MFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS		1.05 V	4		Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1200 rpm	NO	e2
XPC8260ZUIHBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	220	37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e0
SVF522R3N2CMK4	NXP Semiconductors	MICROPROCESSOR, RISC
S9S08RN60W1MLH	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	10 mm		NO	0	20 MHz	40	260	10 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G64	3		20 rpm	YES	e3
P2020NSE2KHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS		1.05 V	4		Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1000 rpm	NO	e2
S9S08RNA8W2VLC	NXP Semiconductors	MICROPROCESSOR																				TIN									40	260											3				e3
PPC7457RX867LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	483	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	167 MHz			29 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B483		Not Qualified	867 rpm	YES
935320674557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
PPC7448VU1000LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V		36	32		GRID ARRAY		1.1 V	105 Cel		0 Cel		BOTTOM	2.4 mm		25 mm		YES	64	200 MHz			25 mm	CMOS		1.15 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
SCC68070CDA84-T	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY		YES				32	5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel		0 Cel		QUAD											CMOS	130 mA	5 V			Microprocessors	1.27 mm		S-PQCC-J84		Not Qualified	17.5 rpm
P2020NSN2KFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO	e2
MSC8152TAG1000B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	1,1.5/1.8,2.5	GRID ARRAY, HEAT SINK/SLUG	BGA783,28X28,40	.97 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.94 mm	8192	29 mm		YES	64		30	245	29 mm	CMOS		1 V			Digital Signal Processors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	1000 rpm	YES	e1
935311971557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									30	245											3				e2
935309493518	NXP Semiconductors	MICROPROCESSOR, RISC
P5040NSN1VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
BSC9131CJN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
T4161NSE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS						1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
935324829557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									40	260											3				e2
P5021NXN7VNC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64		30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
935318935557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER									30	250											3				e1
XPC8245TZU266B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	32		GRID ARRAY	BGA352,26X26,50	1.7 V	105 Cel		-40 Cel		BOTTOM	1.65 mm		35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32				35 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B352			266 rpm	YES
935317517557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER									40	260											3				e2
P5010NSE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		2000 rpm	YES	e1
P5010NXE7QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
BSC9131NLN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.97 mm		21 mm		YES	32		30	245	21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520	3		800 rpm	YES	e1
PPC7447RX1200LB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		29 mm		YES	64	167 MHz			29 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1200 rpm	YES
SVF532R2K1CMK4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	364	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		0			GRID ARRAY		1.16 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM					YES	0		40	260		CMOS		1.23 V					FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
PT4160PSE7QQA	NXP Semiconductors	MICROPROCESSOR, RISC																																CMOS
PPC7448VU600NC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V		0	32		GRID ARRAY		.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	600 MHz			25 mm	CMOS		1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	600 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.