NXP Semiconductors Microprocessors 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

P2020NSE2NFB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1333 rpm

NO

e2

SVF522R3K2CMK4R

NXP Semiconductors

MICROPROCESSOR, RISC

P5020NSN1MMB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, HEAT SINK/SLUG

.95 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1200 rpm

YES

e1

935314623557

NXP Semiconductors

MICROPROCESSOR

TIN SILVER

40

260

3

e2

P5010NSE1MMB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, HEAT SINK/SLUG

.95 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1200 rpm

YES

e1

935318058557

NXP Semiconductors

MICROPROCESSOR, RISC

P2020NXE2NHA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1333 rpm

NO

P4081NSN7KKC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

16

133.3 MHz

30

245

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1000 rpm

YES

e1

935316158557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

40

260

3

e1

SVF511R3K2CMK4R

NXP Semiconductors

MICROPROCESSOR, RISC

935309518557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

245

3

e1

935325718557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN

40

260

3

e3

935316067557

NXP Semiconductors

MICROPROCESSOR

TIN SILVER COPPER

40

260

3

e1

935325231557

NXP Semiconductors

MICROPROCESSOR, RISC

S9S08RN48W1MLC

NXP Semiconductors

MICROPROCESSOR

AUTOMOTIVE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

NO

YES

5.5 V

8

0

8

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

2.7 V

125 Cel

12

-40 Cel

MATTE TIN

QUAD

1.6 mm

4096

7 mm

NO

0

20 MHz

40

260

7 mm

CMOS

14.8 mA

3 V

2

.8 mm

FIXED POINT

S-PQFP-G32

3

20 rpm

YES

e3

SVF311R3K2CKU2

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

0

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.16 V

85 Cel

-40 Cel

TIN

QUAD

1.6 mm

24 mm

YES

0

40

260

24 mm

CMOS

1.23 V

.5 mm

FLOATING POINT

S-PQFP-G176

3

266 rpm

YES

e3

935322151557

NXP Semiconductors

MICROPROCESSOR

TIN SILVER

40

260

3

e2

P2020PSN2NHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1333 rpm

NO

935317239557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

40

260

3

e2

935323603557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

30

245

3

e2

XPC850ZT40

NXP Semiconductors

MICROPROCESSOR, RISC

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

32

3.3

GRID ARRAY

BGA256,16X16,50

70 Cel

0 Cel

BOTTOM

CMOS

3.3 V

Microprocessors

1.27 mm

S-PBGA-B256

Not Qualified

40 rpm

PPC7448VS1000LC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.2 V

36

32

GRID ARRAY

1.1 V

105 Cel

0 Cel

BOTTOM

1.8 mm

25 mm

LOW POWER TAKEN FROM SLEEP MODE

YES

64

200 MHz

25 mm

CMOS

1.15 V

1.27 mm

FLOATING POINT

S-CBGA-N360

Not Qualified

1000 rpm

YES

S32V234BKN1CUB

NXP Semiconductors

SVF312R3N2CKU2R

NXP Semiconductors

MICROPROCESSOR, RISC

P5040PSN7TMC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY, HEAT SINK/SLUG

1.05 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

e1

S9S08RN8W2MTG

NXP Semiconductors

MICROPROCESSOR

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

NO

YES

5.5 V

8

0

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

2.7 V

125 Cel

8

-40 Cel

TIN

DUAL

1.2 mm

2048

4.4 mm

NO

0

20 MHz

40

260

5 mm

CMOS

14 mA

3 V

1

.65 mm

FIXED POINT

R-PDSO-G16

3

20 rpm

YES

e3

935325836557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

245

3

e1

S9S08RNA8W2MLC

NXP Semiconductors

MICROPROCESSOR

TIN

40

260

3

e3

935309493557

NXP Semiconductors

MICROPROCESSOR, RISC

935331864557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

250

3

e1

935323482557

NXP Semiconductors

MICROPROCESSOR, RISC

935325302557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

40

260

3

e2

P2020NXN2HHB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

800 rpm

NO

e2

935314346557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

40

260

3

e2

935326097557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

250

3

e1

935321965557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

30

245

3

e2

P5040PSN72QB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY, HEAT SINK/SLUG

1.17 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

2200 rpm

YES

e1

T4241NSE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.055 V

16

GRID ARRAY

.995 V

TIN SILVER COPPER

BOTTOM

3.33 mm

45 mm

YES

64

133.3 MHz

30

250

45 mm

CMOS

1.025 V

1 mm

FIXED POINT

S-PBGA-B1932

3

1800 rpm

YES

e1

P2020NSN2HHC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

1.05

GRID ARRAY

BGA689,29X29,40

1 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

40

260

31 mm

CMOS

1.05 V

4

Microprocessors

1 mm

FIXED POINT

S-PBGA-B689

3

Not Qualified

800 rpm

NO

e2

PPC7457RX1267LB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

483

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.35 V

36

32

GRID ARRAY

1.25 V

BOTTOM

3.2 mm

29 mm

YES

64

167 MHz

29 mm

CMOS

1.3 V

1.27 mm

FLOATING POINT

S-CBGA-B483

Not Qualified

1267 rpm

YES

SCCZ562CR2

NXP Semiconductors

MICROPROCESSOR, RISC

NOT SPECIFIED

NOT SPECIFIED

935321141557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

245

3

e1

P5010NSE7VNB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY, HEAT SINK/SLUG

1.05 V

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

30

245

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

2000 rpm

YES

e1

PPC7448VS1600LC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.3 V

36

32

GRID ARRAY

1.2 V

105 Cel

0 Cel

BOTTOM

1.8 mm

25 mm

LOW POWER TAKEN FROM SLEEP MODE

YES

64

200 MHz

25 mm

CMOS

1.25 V

1.27 mm

FLOATING POINT

S-CBGA-N360

Not Qualified

1600 rpm

YES

BSC9131NLE1HHKB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

0 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

PPC7448VU1000ND

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

NO LEAD

360

LGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

1000 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-N360

Not Qualified

1000 rpm

YES

935317796557

NXP Semiconductors

MICROPROCESSOR, RISC

BSC9132NLE7MNMB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

32

GRID ARRAY, FINE PITCH

.97 V

BOTTOM

2.53 mm

23 mm

YES

64

100 MHz

23 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B780

1200 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.