Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
TIN SILVER COPPER |
40 |
260 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
TIN SILVER COPPER |
40 |
260 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
40 |
260 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
40 |
260 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.71 V |
125 Cel |
-40 Cel |
BOTTOM |
1.52 mm |
2097152 |
14 mm |
YES |
48 MHz |
40 |
260 |
14 mm |
CMOS |
850 mA |
1.8 V |
32 |
1 |
.8 mm |
FLOATING-POINT |
S-PBGA-B289 |
3 |
800 rpm |
YES |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
1.5,3.3 |
GRID ARRAY |
BGA516,26X26,40 |
1.45 V |
TIN SILVER |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
266 MHz |
30 |
245 |
27 mm |
CMOS |
1.5 V |
Other uPs/uCs/Peripheral ICs |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
3 |
Not Qualified |
66.67 rpm |
NO |
e2 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
25 |
32 |
1.8,1.8/3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER OVER NICKEL |
BOTTOM |
1.6 mm |
14 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
16 MHz |
40 |
260 |
14 mm |
CMOS |
1.8 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
150 rpm |
YES |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,25 |
1.25 V |
95 Cel |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.43 mm |
524288 |
10 mm |
YES |
0 |
24 MHz |
40 |
260 |
10 mm |
CMOS |
105 mA |
32 |
29 |
.65 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
e1 |
|||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
8 |
26 |
32 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.05 V |
125 Cel |
-40 Cel |
BOTTOM |
1.85 mm |
147456 |
19 mm |
YES |
32 |
27 MHz |
40 |
260 |
19 mm |
CMOS |
800 mA |
1.1 V |
32 |
52 |
.8 mm |
FLOATING POINT |
S-PBGA-B529 |
3 |
800 rpm |
YES |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.4 V |
8 |
26 |
32 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.2 V |
85 Cel |
-20 Cel |
BOTTOM |
1.85 mm |
147456 |
19 mm |
YES |
32 |
27 MHz |
40 |
260 |
19 mm |
CMOS |
800 mA |
1.25 V |
5 |
.8 mm |
FLOATING POINT |
S-PBGA-B529 |
3 |
1000 rpm |
YES |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
13 |
GRID ARRAY |
1.42 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.65 mm |
27 mm |
YES |
32 |
35 MHz |
40 |
260 |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
3 |
400 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.71 V |
125 Cel |
-40 Cel |
BOTTOM |
1.52 mm |
2097152 |
14 mm |
YES |
48 MHz |
40 |
260 |
14 mm |
CMOS |
850 mA |
1.8 V |
32 |
1 |
.8 mm |
FLOATING-POINT |
S-PBGA-B289 |
3 |
800 rpm |
YES |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
COMMERCIAL |
BALL |
225 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
24 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA225,15X15,32 |
1.08 V |
70 Cel |
0 Cel |
BOTTOM |
1.6 mm |
13 mm |
YES |
32 |
140 MHz |
40 |
260 |
13 mm |
CMOS |
1.2 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B225 |
3 |
Not Qualified |
140 rpm |
NO |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
24 |
32 |
GRID ARRAY, LOW PROFILE |
1.4 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.6 mm |
17 mm |
YES |
32 |
80 MHz |
40 |
260 |
17 mm |
CMOS |
1.5 V |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
240 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,32 |
1.25 V |
95 Cel |
0 |
0 Cel |
TIN SILVER |
BOTTOM |
1.52 mm |
524288 |
12 mm |
YES |
0 |
24 MHz |
40 |
260 |
12 mm |
CMOS |
105 mA |
32 |
29 |
.8 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
e2 |
|||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
40 |
260 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
13 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.25 V |
95 Cel |
0 Cel |
TIN |
YES |
QUAD |
YES |
1.6 mm |
262144 |
20 mm |
YES |
32 |
24 MHz |
40 |
260 |
20 mm |
CMOS |
90 mA |
32 |
YES |
14 |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
3 |
500 rpm |
YES |
e3 |
96 |
||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
40 |
260 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
40 |
260 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
32 |
1.1,1.3 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.05 V |
125 Cel |
-40 Cel |
TIN SILVER |
BOTTOM |
1.9 mm |
19 mm |
YES |
32 |
27 MHz |
40 |
260 |
19 mm |
CMOS |
1.1 V |
Graphics Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B529 |
3 |
Not Qualified |
800 rpm |
YES |
e2 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,25 |
1.25 V |
85 Cel |
0 |
0 Cel |
BOTTOM |
1.43 mm |
1048576 |
10 mm |
YES |
0 |
24 MHz |
40 |
260 |
10 mm |
CMOS |
110 mA |
32 |
10 |
.65 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,32 |
1.25 V |
95 Cel |
0 |
0 Cel |
TIN SILVER |
BOTTOM |
1.52 mm |
524288 |
12 mm |
YES |
0 |
24 MHz |
40 |
260 |
12 mm |
CMOS |
105 mA |
32 |
29 |
.8 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
e2 |
|||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
24 |
32 |
GRID ARRAY |
1.4 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
15 mm |
YES |
32 |
80 MHz |
40 |
260 |
15 mm |
CMOS |
1.5 V |
1 mm |
FIXED POINT |
S-PBGA-B196 |
3 |
Not Qualified |
240 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.71 V |
125 Cel |
-40 Cel |
BOTTOM |
1.52 mm |
2097152 |
14 mm |
YES |
48 MHz |
40 |
260 |
14 mm |
CMOS |
850 mA |
1.8 V |
32 |
1 |
.8 mm |
FLOATING-POINT |
S-PBGA-B289 |
3 |
800 rpm |
YES |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
13 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
3 V |
95 Cel |
0 Cel |
QUAD |
1.6 mm |
262144 |
20 mm |
YES |
16 |
24 MHz |
40 |
260 |
20 mm |
CMOS |
90 mA |
3.3 V |
32 |
8 |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
3 |
500 rpm |
YES |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.71 V |
125 Cel |
-40 Cel |
BOTTOM |
1.52 mm |
2097152 |
14 mm |
YES |
48 MHz |
40 |
260 |
14 mm |
CMOS |
850 mA |
1.8 V |
32 |
1 |
.8 mm |
FLOATING-POINT |
S-PBGA-B289 |
3 |
800 rpm |
YES |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
13 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.25 V |
95 Cel |
0 Cel |
TIN |
QUAD |
1.7 mm |
262144 |
14 mm |
YES |
32 |
24 MHz |
40 |
260 |
14 mm |
CMOS |
90 mA |
32 |
14 |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
3 |
500 rpm |
YES |
e3 |
||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
26 |
32 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
.9 V |
125 Cel |
-40 Cel |
TIN SILVER |
BOTTOM |
1.85 mm |
73728 |
19 mm |
1.1V NOMIVAL AVAILABLE WITH 800MHZ |
YES |
32 |
27 MHz |
40 |
260 |
19 mm |
CMOS |
1450 mA |
.95 V |
2 |
CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB |
.8 mm |
FLOATING POINT |
S-PBGA-B529 |
3 |
Not Qualified |
800 rpm |
YES |
e2 |
19 |
|||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
0 |
32 |
1.2,1.8,1.8/3.3,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER |
BOTTOM |
YES |
0 |
100 MHz |
40 |
260 |
CMOS |
1.2 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
250 rpm |
YES |
e2 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
40 |
260 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
32 |
GRID ARRAY |
1.42 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.65 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
35 MHz |
40 |
260 |
27 mm |
CMOS |
1.5 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
3 |
Not Qualified |
400 rpm |
YES |
e1 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
13 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.25 V |
95 Cel |
0 Cel |
TIN |
YES |
QUAD |
YES |
1.7 mm |
262144 |
14 mm |
YES |
32 |
24 MHz |
40 |
260 |
14 mm |
CMOS |
90 mA |
32 |
YES |
14 |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
3 |
500 rpm |
YES |
e3 |
57 |
||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
TIN SILVER COPPER |
40 |
260 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
TIN SILVER |
40 |
260 |
3 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
425 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
GRID ARRAY, FINE PITCH |
BGA425,23X23,32 |
.95 V |
105 Cel |
4 |
-40 Cel |
TIN SILVER |
BOTTOM |
1.9 mm |
19 mm |
YES |
32 |
40 |
260 |
19 mm |
CMOS |
1 V |
4 |
.8 mm |
FIXED POINT |
S-PBGA-B425 |
3 |
1000 rpm |
NO |
e2 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
TIN SILVER COPPER |
40 |
260 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,25 |
1.25 V |
85 Cel |
0 |
0 Cel |
BOTTOM |
1.43 mm |
1048576 |
10 mm |
YES |
0 |
24 MHz |
40 |
260 |
10 mm |
CMOS |
110 mA |
32 |
10 |
.65 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
13 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.25 V |
95 Cel |
0 Cel |
QUAD |
1.6 mm |
262144 |
20 mm |
YES |
32 |
24 MHz |
40 |
260 |
20 mm |
CMOS |
90 mA |
32 |
14 |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
3 |
500 rpm |
YES |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
0 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.15 V |
105 Cel |
0 |
-40 Cel |
QUAD |
1.6 mm |
262144 |
20 mm |
YES |
0 |
24 MHz |
40 |
260 |
20 mm |
CMOS |
90 mA |
32 |
20 |
.5 mm |
FLOATING-POINT |
S-PQFP-G144 |
3 |
396 rpm |
YES |
|||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
516 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
32 |
32 |
GRID ARRAY |
1.45 V |
BOTTOM |
2.55 mm |
27 mm |
YES |
64 |
266 MHz |
27 mm |
CMOS |
1.5 V |
1 mm |
FLOATING POINT |
S-PBGA-B516 |
66.67 rpm |
NO |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
TIN |
40 |
260 |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,32 |
1.25 V |
85 Cel |
0 |
0 Cel |
BOTTOM |
1.52 mm |
1048576 |
12 mm |
YES |
0 |
24 MHz |
40 |
260 |
12 mm |
CMOS |
110 mA |
32 |
10 |
.8 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
225 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
24 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.08 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.6 mm |
13 mm |
YES |
32 |
140 MHz |
40 |
260 |
13 mm |
CMOS |
1.2 V |
.8 mm |
FIXED POINT |
S-PBGA-B225 |
3 |
140 rpm |
NO |
e1 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,25 |
1.25 V |
95 Cel |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.43 mm |
524288 |
10 mm |
YES |
0 |
24 MHz |
40 |
260 |
10 mm |
CMOS |
105 mA |
32 |
29 |
.65 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
e1 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.