NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC860SRCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC860TVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MCF5208CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm		YES	32	40 MHz	40	260	15 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166.67 rpm	YES	e1
MPC8270CZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	8		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm	32768	37.5 mm		YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V	4	16	Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	NO	e0
P1020NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32	1	GRID ARRAY	BGA689,29X29,40	.95 V		12		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	32		40	260	31 mm	CMOS		1 V	4		Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	800 rpm	NO	e2
MPC885VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		40	260	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
P1022NXE2LFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES		133 MHz	40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		1067 rpm	YES	e2
LS1046ASE8Q1A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	HBGA	SQUARE	PLASTIC/EPOXY		YES							GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm					30	250	23 mm	CMOS						.8 mm		S-PBGA-B780	3		64 rpm		e1
MC7448HX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.2 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		NO	0	1400 MHz	40	260	25 mm	CMOS		1.15 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MCIMX6S6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MIMXRT1015CAF4B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		0	32		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.15 V	105 Cel	0	-40 Cel		QUAD	1.7 mm	131072	14 mm		YES	0	24 MHz	40	260	14 mm	CMOS	90 mA		32	6		.5 mm	FLOATING POINT	S-PQFP-G100	3		396 rpm	YES
MPC880CVR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
P1014NXE5HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY, FINE PITCH		.95 V				TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	0	100 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425	3		800 rpm	YES	e2
MC7448VU800ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.05 V			0	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	.95 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm		NO	0	800 MHz	40	260	25 mm	CMOS		1 V			Microprocessors	1.27 mm	FIXED POINT	S-CBGA-N360	1	Not Qualified	800 rpm	YES
MCF5270VM100	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MCIMX6S4AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MIMXRT533SFFOC	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260											3
MPC8347EVRAGDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC860DEVR80D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
P1011NSN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY	BGA689,29X29,40	.95 V		7			BOTTOM	2.46 mm		31 mm		YES	32		40	260	31 mm	CMOS		1 V	4			1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	NO
P1021NSE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
T1023NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T1042NXE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
MCF54451CVM180	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	40	260	17 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MCIMX6S1AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V				.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MPC5121YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V			0	32		GRID ARRAY		1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0		40	260	27 mm	CMOS		1.4 V				1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8347VVAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MIMXRT1061DVL6A	NXP Semiconductors	MICROCONTROLLER, RISC																					TIN SILVER COPPER									40	260											3				e1
MIMXRT1061XVN5B	NXP Semiconductors	MICROPROCESSOR																														40	260											3
MPC8270VVUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	100 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	NO	e1
MPC8323ECVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
P3041NXN7NNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0			GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	0	133 MHz	30	245	37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1333 rpm	YES	e1
T1023NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
MC8640DTVJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V			32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO	e2
MC8641VJ1500KE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V			16	32		GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.77 mm		33 mm		YES	64		30	245	33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-CBGA-B1023	3		1500 rpm	YES	e2
MC9328MXSVP10	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V			25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MCIMX7D2DVK12SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V			26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		1.2 V	85 Cel		0 Cel		BOTTOM	1.1 mm		12 mm		YES	16		40	260	12 mm	CMOS		1.225 V				.4 mm	FLOATING POINT	S-PBGA-B488	3		1200 rpm	YES
MPC8323ECVRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8343CVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MCF54452CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MCF54455CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.48 mm		23 mm		YES	32	66 MHz	40	260	23 mm	CMOS		1.5 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MPC8347ECVRAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
LS1020AXN7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MCF5275CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
SPC5200CBV400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
LS1012ASN7HKA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V			16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		800 rpm	YES
MC9328MXSVP10R2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V			25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MPC8360ECVVAJDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			32	32	1.8/2.5,3.3	GRID ARRAY, LOW PROFILE	BGA740,37X37,40	1.15 V				TIN SILVER	BOTTOM	1.69 mm		37.5 mm		YES	32	66.67 MHz	40	260	37.5 mm	CMOS		1.3 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	533 rpm	YES	e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.