NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCF5274VM166	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			17 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
MCF5475ZP266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	32	32		GRID ARRAY		1.43 V	70 Cel			0 Cel	NICKEL GOLD	BOTTOM	2.55 mm			27 mm		YES	32	66.66 MHz	40	260	27 mm		CMOS		1.5 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e4
MIMXRT106ADVL6A	NXP Semiconductors	MICROCONTROLLER, RISC																				TIN SILVER COPPER										40	260													3				e1
MPC5200VR400B	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	32	32		GRID ARRAY		1.42 V	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm			27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm		CMOS		1.5 V					1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
MPC5200VR400BR2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	13			GRID ARRAY		1.42 V	70 Cel			0 Cel		BOTTOM	2.65 mm			27 mm		YES	32	35 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm		CMOS		1.5 V					1.27 mm	FLOATING POINT	S-PBGA-B272			400 rpm	YES
MPC8241LVR266D	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32		GRID ARRAY		1.7 V					TIN SILVER COPPER	BOTTOM	2.56 mm			25 mm		YES	64	66 MHz	30	245	25 mm		CMOS		1.8 V					1.27 mm	FLOATING POINT	S-PBGA-B357	3	Not Qualified	266 rpm	YES	e1
MPC8275CVRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V					TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	64	266 MHz	30	245	27 mm		CMOS		1.5 V		Other uPs/uCs/Peripheral ICs			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MPC8323EVRAFDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	14			GRID ARRAY, HEAT SINK/SLUG		.95 V						BOTTOM	2.55 mm			27 mm		YES	32		40	260	27 mm		CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B516			333 rpm	YES
MPC8349EVVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			0 Cel	TIN SILVER	BOTTOM	1.69 mm			35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V		Microprocessors			1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349VVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			0 Cel	TIN SILVER	BOTTOM	1.69 mm			35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V		Microprocessors			1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8349VVAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			0 Cel		BOTTOM	1.69 mm			35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V		Microprocessors			1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES
P1010NSE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4	Microprocessors			.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
P2020NSE2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16		1.05	GRID ARRAY	BGA689,29X29,40	1 V			7		TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64		40	260	31 mm		CMOS		1.05 V	4	Microprocessors			1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1000 rpm	NO	e2
P2020NXN2KHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16		1.05	GRID ARRAY	BGA689,29X29,40	1 V			7		TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64		40	260	31 mm		CMOS		1.05 V	4	Microprocessors			1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1000 rpm	NO	e2
S9S08RNA16W2MLCR	NXP Semiconductors	MICROPROCESSOR																				TIN										40	260													3				e3
MPC8343ZQADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel			0 Cel	TIN LEAD	BOTTOM	2.46 mm			29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm		CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e0
MCF5484CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32		GRID ARRAY		3 V	85 Cel			-40 Cel	TIN LEAD	BOTTOM	2.55 mm			27 mm		YES		66.67 MHz	40	260	27 mm		CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
MCF53721CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm			15 mm		YES	32	80 MHz	40	260	15 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MC7448THX1400ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.2 V	36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1.1 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM	2.8 mm			25 mm		YES	64	200 MHz	40	260	25 mm		CMOS		1.15 V		Microprocessors			1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1400 rpm	YES	e0
MPC7410HX500LE	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	HBGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.9 V	32	32		GRID ARRAY, HEAT SINK/SLUG		1.7 V					TIN LEAD	BOTTOM	3.2 mm			25 mm		YES	64	133 MHz	40	260	25 mm		CMOS		1.8 V					1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	500 rpm	YES	e0
MCF54452CVP200	NXP Semiconductors	MICROPROCESSOR																														40	260													3
MPC8313CVRADDC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel			-40 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	32	66.67 MHz	40	260	27 mm		CMOS		1 V		Microprocessors			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
XPC8240LZU200E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V	32	32		GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2.375 V	105 Cel		5	0 Cel		BOTTOM	1.65 mm			35 mm		YES	64	66 MHz			35 mm		CMOS		2.5 V	2				1.27 mm	FLOATING POINT	S-PBGA-B352			200 rpm	YES
MCF5207CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32	1.5,1.8/3.3	GRID ARRAY, LOW PROFILE	BGA144,12X12,40	1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			13 mm		YES	32	40 MHz	40	260	13 mm		CMOS		1.5 V		Microprocessors			1 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified	166.67 rpm	YES	e1
MCF54453CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel			-40 Cel	TIN SILVER	BOTTOM	2.48 mm			23 mm		YES	32	66 MHz	40	260	23 mm		CMOS		1.5 V		Microprocessors			1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MCF54454CVP200	NXP Semiconductors	MICROPROCESSOR																														40	260													3
MCF54452VP266	NXP Semiconductors	MICROPROCESSOR																														40	260													3
MIMXRT106SCVL5B	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260													3
MCF5233CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm			17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCF5235CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm			17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
P1022NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32		GRID ARRAY		.95 V					TIN SILVER	BOTTOM	2.46 mm			31 mm		YES		133 MHz	40	260	31 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
P2010NXE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16	32		GRID ARRAY		1 V					TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64	100 MHz	40	260	31 mm		CMOS		1.05 V					1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
P3041NXN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.04 V	0			GRID ARRAY		.96 V					TIN SILVER COPPER	BOTTOM	3.53 mm			37.5 mm		YES	0	133 MHz	30	245	37.5 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
LS1012ASE7KKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V	16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel			0 Cel		BOTTOM	.925 mm			9.6 mm		YES	16	25 MHz	40	260	9.6 mm		CMOS		.9 V					.5 mm	FIXED POINT	S-XBGA-N211	3		1000 rpm	YES
MCF54454CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	85 Cel			-40 Cel	TIN SILVER	BOTTOM	2.48 mm			23 mm		YES	32	66 MHz	40	260	23 mm		CMOS		1.5 V		Microprocessors			1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	200 rpm	YES	e2
MPC860DEZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				0 Cel	TIN LEAD	BOTTOM	2.52 mm			25 mm		YES	32	50 MHz	30	245	25 mm		CMOS		3.3 V		Microprocessors			1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
SCC68070CCA84	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY		YES			32	5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel			0 Cel		QUAD													CMOS	112 mA	5 V		Microprocessors			1.27 mm		S-PQCC-J84		Not Qualified	15 rpm
MC9S08PT16VLD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	8	3/5	FLATPACK	QFP44,.47SQ,32	2.7 V	105 Cel	HCS08		-40 Cel	TIN	QUAD		16384				NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		.8 mm	FIXED POINT	S-PQFP-G44	3	Not Qualified	20 rpm	YES	e3
MCF54452VR266	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	32	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA360,22X22,40	1.35 V	70 Cel			0 Cel	TIN SILVER	BOTTOM	2.48 mm			23 mm		YES	32	66 MHz	40	260	23 mm		CMOS		1.5 V		Microprocessors			1 mm	FIXED POINT	S-PBGA-B360	3	Not Qualified	266 rpm	YES	e2
MCF54453VP266	NXP Semiconductors	MICROPROCESSOR																														40	260													3
MPC8321EVRAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	0	32		GRID ARRAY		.95 V					TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	0	66.67 MHz	40	260	27 mm		CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC860ENCZQ50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm			25 mm		YES	32	50 MHz	30	245	25 mm		CMOS		3.3 V		Microprocessors			1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e0
P1013NSN2LFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel			0 Cel	TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64		40	260	31 mm		CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B689	3		1067 rpm	YES	e2
P2020NSE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16		1.05	GRID ARRAY	BGA689,29X29,40	1 V			7		TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64		40	260	31 mm		CMOS		1.05 V	4	Microprocessors			1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1200 rpm	NO	e2
P4040NSE7MMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1295,36X36,40	.95 V					TIN SILVER COPPER	BOTTOM	3.53 mm			37.5 mm		YES	64	133.3 MHz	30	245	37.5 mm		CMOS		1 V		Microprocessors			1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1200 rpm	YES	e1
T1022NXN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	32		GRID ARRAY, FINE PITCH		.97 V						BOTTOM	2.07 mm			23 mm		YES	64	133.3 MHz	30	250	23 mm		CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1500 rpm	YES
MCIMX6L3EVN10AB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	576	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		16384	13 mm		YES	32		40	260	13 mm		CMOS	1.1 mA					CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B	3	Not Qualified	1000 rpm	YES	e1	162
MCIMX6L3EVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm			13 mm					40	260	13 mm		CMOS							.5 mm		S-PBGA-B	3				e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.