NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MIMXRT1165XVM5A	NXP Semiconductors	MICROPROCESSOR, RISC																																40	260														3
MPC8321ECVRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V					TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	0	66.67 MHz	40	260	27 mm		CMOS		1 V						1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
P1010NXE5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel		4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm			19 mm		YES	32		40	260	19 mm		CMOS		1 V	4		Microprocessors			.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
P1022NSN2MHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V				32		GRID ARRAY		1 V					TIN SILVER	BOTTOM	2.46 mm			31 mm		YES		133 MHz	40	260	31 mm		CMOS		1.05 V						1 mm	FIXED POINT	S-PBGA-B689	3		1200 rpm	YES	e2
MCF54417CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel			-40 Cel		BOTTOM						YES	0	100 MHz	40	260			CMOS		1.2 V			Microprocessors			1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MCF54455CVP200	NXP Semiconductors	MICROPROCESSOR																																40	260														3
MPC8270VRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel			0 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	64	266 MHz	30	245	27 mm		CMOS		1.5 V			Other uPs/uCs/Peripheral ICs			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
MCIMX6QP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, FINE PITCH		1.35 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS								.8 mm		S-PBGA-B624	3				e1
MPC8321VRADDCA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V					TIN SILVER	BOTTOM	2.55 mm			27 mm		YES	0	66.67 MHz	40	260	27 mm		CMOS		1 V						1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
P4080NSE7PNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32			GRID ARRAY		.95 V					TIN SILVER COPPER	BOTTOM	3.53 mm			37.5 mm		YES	16	133.3 MHz	30	245	37.5 mm		CMOS		1 V						1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
MPC8313CVRAFFC	NXP Semiconductors	MICROPROCESSOR		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			32	32		GRID ARRAY		.95 V					TIN SILVER	BOTTOM	2.55 mm			27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm		CMOS		1 V						1 mm	FLOATING POINT	S-PBGA-B516	3		333 rpm	YES	e2
MCF5373LCVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			17 mm		YES	32	80 MHz	40	260	17 mm		CMOS		1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
LS1020AXE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V					TIN SILVER COPPER	BOTTOM	2.07 mm			19 mm		YES	32	133.3 MHz	40	260	19 mm		CMOS		1 V						.8 mm	FLOATING POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MPC8280CZUQLDA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM	1.65 mm			37.5 mm		YES	64		40	260	37.5 mm		CMOS		1.5 V			Other uPs/uCs/Peripheral ICs			1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	YES	e0
MCIMX31CVMN4D	NXP Semiconductors	MICROPROCESSOR, RISC														1.5,3.3								TIN SILVER COPPER										40	260								Microprocessors		I2C; SPI; UART; USB				3	Not Qualified			e1	9
P1021NXE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel			-40 Cel	TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	0	100 MHz	40	260	31 mm		CMOS		1 V						1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	YES	e2
MIMXRT1051DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel		0	0 Cel		BOTTOM	1.43 mm		524288	10 mm		YES	0	24 MHz			10 mm		CMOS	105 mA		32	29				.65 mm	FLOATING-POINT	S-PBGA-B196			600 rpm	YES
MCF54416CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel			-40 Cel		BOTTOM						YES	0	100 MHz	40	260			CMOS		1.2 V			Microprocessors			1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MPC852TVR100A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA256,16X16,50	1.7 V					TIN SILVER COPPER	BOTTOM	2.54 mm			23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm		CMOS		1.8 V			Other uPs/uCs/Peripheral ICs			1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
MC9S08PT8VLC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY		YES					8	3/5	FLATPACK	QFP32,.35SQ,32		105 Cel	HCS08		-40 Cel	TIN	QUAD		8192							40	260		2048	CMOS	14 mA				Microcontrollers	FLASH		.8 mm		S-PQFP-G32	3	Not Qualified	20 rpm		e3
MCIMX6U6AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm		CMOS		1.35 V						.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
SPC5200CVR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm			27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm		CMOS		1.5 V			Microprocessors			1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
MCIMX6U1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm		CMOS								.8 mm	FLOATING POINT	S-PBGA-B624	3		800 rpm	YES	e1
MCF5206EAB54	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			28	32		FLATPACK		3 V	70 Cel			0 Cel	TIN	QUAD	3.85 mm			28 mm		YES	32	54 MHz	30	245	28 mm		CMOS		3.3 V						.65 mm	FIXED POINT	S-PQFP-G160	3		54 rpm	YES	e3
MPC8313EVRAFFC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel			0 Cel	TIN SILVER	BOTTOM	2.55 mm			27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm		CMOS		1 V			Microprocessors			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MCIMX6QP6AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V						GRID ARRAY, FINE PITCH		1.225 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS								.8 mm		S-PBGA-B624	3				e1
MCIMX6QP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm		CMOS								.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6S6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm		CMOS		1.35 V						.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MPC8270CVVUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm			37.5 mm		YES	64		40	260	37.5 mm		CMOS		1.5 V			Other uPs/uCs/Peripheral ICs			1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	450 rpm	YES	e1
T2080NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES					64		GRID ARRAY, FINE PITCH			105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			25 mm		NO			30	250	25 mm		CMOS								.8 mm	FIXED POINT	S-PBGA-B896	3		1800 rpm	NO	e1
MPC8315CVRAFDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA620,28X28,40	.95 V					TIN SILVER	BOTTOM	2.46 mm			29 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	29 mm		CMOS		1 V			Microprocessors			1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2
SPC5200CVR400BR2	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.65 mm			27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	40	260	27 mm		CMOS		1.5 V			Microprocessors			1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e1
P2010NXN2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16			GRID ARRAY		1 V					TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64	100 MHz	40	260	31 mm		CMOS		1.05 V						1 mm	FLOATING POINT	S-PBGA-B689	3		1000 rpm	YES	e2
MIMXRT595SFFOC	NXP Semiconductors	MICROPROCESSOR, RISC																																40	260														3
MPC8270CZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V					TIN LEAD SILVER	BOTTOM	2.55 mm			27 mm		YES	64	266 MHz	30	245	27 mm		CMOS		1.5 V			Other uPs/uCs/Peripheral ICs			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
MPC8270CZUQLDA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V					TIN LEAD SILVER	BOTTOM	1.65 mm			37.5 mm		YES	64	83.33 MHz	40	260	37.5 mm		CMOS		1.5 V			Other uPs/uCs/Peripheral ICs			1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	NO	e0
MC7448TVU1267ND	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			0			GRID ARRAY		1 V						BOTTOM	2.4 mm			25 mm		YES	0	200 MHz	40	260	25 mm		CMOS		1.05 V						1.27 mm	FLOATING POINT	S-CBGA-B360	1		1267 rpm	YES
MCIMX6S1AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm		CMOS		1.35 V						.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MPC8347CVVAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel			-40 Cel	TIN SILVER	BOTTOM	1.69 mm			35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm		CMOS		1.2 V			Microprocessors			1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	400 rpm	YES	e2
MPC8358ECZQAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	668	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V					TIN LEAD	BOTTOM	2.46 mm			29 mm		YES	32	66.67 MHz	40	260	29 mm		CMOS		1.2 V						1 mm	FLOATING POINT	S-PBGA-B668	3	Not Qualified	400 rpm	YES	e0
MCF5307AI66B	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			32	32		FLATPACK, FINE PITCH		3 V	70 Cel			0 Cel	TIN	QUAD	4.1 mm			28 mm		YES	32	33.33 MHz	30	250	28 mm		CMOS		3.3 V						.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	66 rpm	YES	e3
MCIMX31CVMN4C	NXP Semiconductors	MICROPROCESSOR, RISC														1.5,3.3								TIN SILVER COPPER										40	260								Microprocessors		I2C; SPI; UART; USB				3	Not Qualified			e1	9
MCIMX6U6AVM08AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64	24 MHz	40	260	21 mm		CMOS		1.35 V						.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MIMXRT595SFFOCR	NXP Semiconductors	MICROPROCESSOR, RISC																																40	260														3
P2010NXN2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			16	32		GRID ARRAY		1 V					TIN SILVER	BOTTOM	2.46 mm			31 mm		YES	64	100 MHz	40	260	31 mm		CMOS		1.05 V						1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
T1042NSN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V						BOTTOM	2.07 mm			23 mm		YES	64	133.3 MHz	30	250	23 mm		CMOS		1 V						.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES
MCF5271CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm		CMOS		1.5 V						1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MPC8572CLVJAULE	NXP Semiconductors	MICROPROCESSOR																						TIN SILVER										30	245														3				e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.