NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8323EVRADDC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			14			GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.55 mm		27 mm		YES	32		40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516			266 rpm	YES
MPC860ENVR66D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CVR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880CZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880CZP66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32		GRID ARRAY		1.7 V					BOTTOM	2.52 mm		25 mm		YES	32	66.67 MHz	30	245	25 mm	CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B357	3		66 rpm	YES
MPC880VR133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
MPC880VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e1
MPC880VR80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e1
MPC880ZP133	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				TIN LEAD	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e0
MPC880ZP66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
P1011NXN2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY	BGA689,29X29,40	.95 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	32		40	260	31 mm	CMOS		1 V	4			1 mm	FIXED POINT	S-PBGA-B689	3		800 rpm	NO	e2
SPC5125YVN400	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES			AEC-Q100		32	1.4,3.3	GRID ARRAY	BGA324,22X22,40		85 Cel		-40 Cel	TIN SILVER	BOTTOM								40	260							Microprocessors	1 mm		S-PBGA-B324	3	Not Qualified	400 rpm		e2
T1013NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T1042NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32		GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1400 rpm	YES	e1
LX2160XC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V		17		1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MC8640DTHX1250HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			32	32		GRID ARRAY		1 V	105 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	YES	e0
MCF5270CVM150R2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MCF5327CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	80 MHz	40	260	15 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	240 rpm	YES	e1
MCF53281CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	80 MHz	40	260	17 mm	CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF54453CVP200	NXP Semiconductors	MICROPROCESSOR																														40	260											3
MCF54455VP266	NXP Semiconductors	MICROPROCESSOR																														40	260											3
MCIMX6Q4AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MIMXRT1015CAF4BR	NXP Semiconductors	MICROPROCESSOR, RISC
MIMXRT106ADVL6B	NXP Semiconductors	MICROCONTROLLER, RISC																														40	260											3
MIMXRT106LCVL5B	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260											3
MIMXRT555SFFOCR	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260											3
MPC8245LVV266D	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V			32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		35 mm		YES	32	66 MHz	30	245	35 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	266 rpm	YES	e1
MPC8270VVQLDA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	83.33 MHz	40	260	37.5 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	333 rpm	NO	e1
MPC8270ZQMIBA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			32	32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			Other uPs/uCs/Peripheral ICs	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
MPC8309CVMAGDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	489	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32	1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA489,23X23,32	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.61 mm		19 mm		YES	0	66.67 MHz	40	260	19 mm	CMOS		1 V			Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B489	3	Not Qualified	400 rpm	YES	e2
MPC8313VRADDC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8343VRADDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e2
MPC8347ECZQAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e0
MPC8347EVVAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES
MPC8349EZUAJDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8377VRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	64		40	260	31 mm	CMOS	.03 mA	1 V	4		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	400 rpm	YES	e2
MPC860PCVR50D4	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA357,19X19,50	3.135 V				TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32	50 MHz	30	245	25 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	50 rpm	YES	e1
MPC875VR66	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,16X16,50	1.7 V				TIN SILVER COPPER	BOTTOM	2.54 mm		23 mm		YES	32		30	245	23 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC880ZP80	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V			32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V				Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm		25 mm		YES	32		30	245	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	80 rpm	YES	e0
P1010NXN5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
P1011NSN2DFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY	BGA689,29X29,40	.95 V		7			BOTTOM	2.46 mm		31 mm		YES	32		40	260	31 mm	CMOS		1 V	4			1 mm	FIXED POINT	S-PBGA-B689	3		533 rpm	NO
P1013NXE2LFB	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	133 MHz	40	260	31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1067 rpm	YES	e2
P1021NXE2FFB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			0	32		GRID ARRAY		.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm		31 mm		YES	0	100 MHz	40	260	31 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B689	3		667 rpm	YES	e2
T1013NSN7KNA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel		BOTTOM	2.07 mm		19 mm		YES	32				19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525			1000 rpm	YES
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
T4081NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES				16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS						1 mm	FIXED POINT	S-PBGA-B1932	3		1800 rpm	YES	e1
FS32R274KSK2MMM	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	257	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.31 V	8	ISO 26262		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA257,17X17,32	1.19 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	1.51 mm	1572864	14 mm		YES		40 MHz	40	260	14 mm	CMOS	1642 mA	1.25 V	32			.8 mm	FLOATING-POINT	S-PBGA-B257	3		240 rpm	YES	e2
LS1012AXN7KKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V			16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm		9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.