NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MCF5251CVM140	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			24	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	85 Cel		-40 Cel		BOTTOM	1.6 mm		13 mm		YES	32	140 MHz	40	260	13 mm	CMOS		1.2 V					.8 mm	FIXED POINT	S-PBGA-B225	3		140 rpm	NO
MCIMX6S6AVM08AC	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	64		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32	24 MHz	40	260	21 mm	CMOS		1.35 V					.8 mm	FIXED POINT	S-PBGA-B624	3		800 rpm	YES	e1
MC7448THX1267ND	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V			36	32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50	1 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.8 mm		25 mm		YES	64	200 MHz	40	260	25 mm	CMOS		1.05 V			Microprocessors		1.27 mm	FLOATING POINT	S-CBGA-B360	1	Not Qualified	1267 rpm	YES	e0
P1010NXE5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
P1010NXE5HFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		800 rpm	NO	e2
MIMXRT1051DVL6BR	NXP Semiconductors	MICROPROCESSOR, RISC																					TIN SILVER COPPER									40	260												3				e1
P1010NXE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
MIMXRT1064DVL6AR	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196.14X14,25	1.25 V	85 Cel		0 Cel		BOTTOM	1.43 mm	1048576	10 mm		YES			40	260	10 mm	CMOS	100 mA						.65 mm	FLOATING POINT	S-PBGA-B196	3		600 rpm	YES
MIMXRT1064DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	85 Cel	0	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	1048576	12 mm		YES	0	24 MHz	40	260	12 mm	CMOS	110 mA		32	10			.8 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES	e1
MPC8308CVMAGDA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.54 mm		19 mm		YES			40	260	19 mm	CMOS		1 V					.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
P1010NXE5KHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	1000 rpm	NO	e2
MCF5272VM66	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32		GRID ARRAY		3 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
MCF54418CMJ250	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			0	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	85 Cel		-40 Cel		BOTTOM					YES	0	100 MHz	40	260		CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	250 rpm	YES
MIMXRT1024CAG4B	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260												3
MCF5485CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
MCF54418CMJ250R	NXP Semiconductors	MICROPROCESSOR																														40	260												3
P1010NXE5FFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
P1010NXE5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	800 rpm	NO	e2
P1010NXE5DFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
MPC8314VRAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.46 mm		29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MIMXRT1165CVM5A	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260												3
MIMXRT1015CAF4A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8		0	32		FLATPACK	QFP100,.63SQ,20	1.15 V	105 Cel	0	-40 Cel	TIN	QUAD	1.7 mm	131072	14 mm	OPERATES UPTO 400 MHZ, BUT WE HAVE CHARACTERISTICS FOR 396 MHZ	YES	0	24 MHz	40	260	14 mm	CMOS	90 mA		32	6			.5 mm	FLOATING POINT	S-PQFP-G100	3		396 rpm	YES	e3
MCF5474VR266	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	8		32	32		GRID ARRAY	BGA388,26X26,40	1.43 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm	32768	27 mm		YES	32	66.67 MHz	40	260	27 mm	CMOS		1.5 V	16	4			1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	266.66 rpm	YES	e1
MIMXRT1061DVL6B	NXP Semiconductors	MICROCONTROLLER, RISC																					TIN SILVER COPPER									40	260												3				e1
MIMXRT1011DAE5AR	NXP Semiconductors	MICROPROCESSOR, RISC
MCF5485CZP200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e0
MPC8308VMAGDA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	1.54 mm		19 mm		YES		66.67 MHz	40	260	19 mm	CMOS		1 V		2			.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
MIMXRT1166DVM6A	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260												3
MCIMX535DVP2C2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4 V	8		26	32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.3 V	85 Cel		-20 Cel		BOTTOM	1.85 mm	147456	19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	800 mA	1.35 V		5			.8 mm	FLOATING POINT	S-PBGA-B529	3		1200 rpm	YES
MIMXRT1166XVM5A	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260												3
MCF5272VM66R2	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			23	32	3.3	GRID ARRAY	BGA196,14X14,40	3 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		15 mm		YES	32	66 MHz	40	260	15 mm	CMOS		3.3 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	66 rpm	YES	e1
P1010NXE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425	3		667 rpm	NO	e2
MIMXRT1165DVM6A	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260												3
MIMXRT1166CVM5A	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260												3
P3041NSN7PNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY	BGA1295,36X36,40	.95 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64	133 MHz	30	245	37.5 mm	CMOS		1 V	8	8			1 mm	FIXED POINT	S-PBGA-B1295	3		1500 rpm	YES	e1
MCIMX6L8DVN10AB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	576	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm	16384	13 mm		YES	32		40	260	13 mm	CMOS	1100 mA					CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B	3	Not Qualified	1000 rpm	YES	e1	162
MIMXRT1061DVJ6B	NXP Semiconductors	MICROCONTROLLER, RISC																					TIN SILVER									40	260												3				e2
MIMXRT1015DAF5A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.25 V	95 Cel	0	0 Cel	TIN	QUAD	1.7 mm	131072	14 mm		YES	0	24 MHz	40	260	14 mm	CMOS	90 mA		32	16			.5 mm	FLOATING POINT	S-PQFP-G100	3		500 rpm	YES	e3
MIMXRT1052DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0	0 Cel		BOTTOM	1.43 mm	524288	10 mm		YES	0	24 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	105 mA		32	29			.65 mm	FLOATING-POINT	S-PBGA-B196			600 rpm	YES
MCF5328CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	80 MHz	40	260	17 mm	CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MIMXRT117FDVMAA	NXP Semiconductors	MICROPROCESSOR, RISC
MIMXRT1015DAF5B	NXP Semiconductors	MICROPROCESSOR, RISC																														40	260												3
MCIMX6U5EVM10ACR	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES				16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		21 mm		YES	64	24 MHz	40	260	21 mm	CMOS							.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
SPC5125YVN400R	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES			AEC-Q100		32	1.4,3.3	GRID ARRAY	BGA324,22X22,40		85 Cel		-40 Cel	TIN SILVER	BOTTOM								40	260							Microprocessors		1 mm		S-PBGA-B324	3	Not Qualified	400 rpm		e2
MCIMX536AVV8CR2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			26	32	1.1,1.3,1.8/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm		YES	32	27 MHz	40	260	19 mm	CMOS	1450 mA	1.1 V			Graphics Processors		.8 mm	FLOATING POINT	S-PBGA-B529	3	Not Qualified	800 rpm	YES	e2
MPC5123YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V			32			GRID ARRAY, HEAT SINK/SLUG		1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	32	35 MHz	40	260	27 mm	CMOS		1.4 V					1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MCF5484CVR200	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		27 mm		YES		66.67 MHz	40	260	27 mm	CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	200 rpm	YES	e1
SPC5200CBV400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	27 mm	CMOS		1.5 V			Microprocessors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.