NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
935319424557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260										3				e2
935322717557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260										3				e2
PPC7448VS1420LC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V	36	32		GRID ARRAY		1.15 V	105 Cel		0 Cel		BOTTOM	1.8 mm	25 mm	LOW POWER TAKEN FROM SLEEP MODE	YES	64	200 MHz			25 mm	CMOS	1.2 V				1.27 mm	FLOATING POINT	S-CBGA-N360		Not Qualified	1420 rpm	YES
P2020NXN2KHB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO	e2
935324738557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER								40	260										3				e2
P5021NSE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	0	64		GRID ARRAY	BGA1295,36X36,40	1.05 V	105 Cel	12	0 Cel		BOTTOM	3.53 mm	37.5 mm		YES	0				37.5 mm	CMOS	1.1 V	8	2		1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES
XPC750PRX300LE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	2 V	32	32	1.9,3.3	GRID ARRAY	BGA360,19X19,50	1.8 V	105 Cel		0 Cel	TIN LEAD	BOTTOM	3.2 mm	25 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	100 MHz			25 mm	CMOS	1.9 V			Microprocessors	1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	300 rpm	YES	e0
SVF332R3K1CKU2R	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN								40	260										3				e3
935319343557	NXP Semiconductors	MICROPROCESSOR																			TIN								40	260										3				e3
935313616557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER								40	260										3				e1
P5040PSN1VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P2020PXN2KHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
935320343557	NXP Semiconductors	MICROPROCESSOR, RISC
P4080PSE1MMB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V				GRID ARRAY		1.71 V	105 Cel		0 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	3.53 mm	37.5 mm	IT ALSO OPERATES AT 3.3 V AND 2.5 V	YES		133.3 MHz	30	245	37.5 mm	CMOS	1.8 V				1 mm	FIXED POINT	S-PBGA-B1295	3	Not Qualified	1200 rpm	YES
935324071557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER								40	260										4				e1
935324795528	NXP Semiconductors	MICROPROCESSOR																			TIN								40	260										3				e3
XPC755BPX400LE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32		GRID ARRAY	BGA360,19X19,50	1.9 V	105 Cel		0 Cel		BOTTOM	2.77 mm	25 mm		YES	64	100 MHz			25 mm	CMOS	2 V				1.27 mm	FLOATING POINT	S-PBGA-B360			400 rpm	YES
935324047557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER								30	245										3				e1
P5010NXE7QMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY		1.05 V					BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1600 rpm	YES
935325243557	NXP Semiconductors	MICROPROCESSOR, RISC
PPC7448VS1250ND	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	360	LGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	YES	1.15 V	0	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.8 mm	25 mm		NO	0	1250 MHz			25 mm	CMOS	1.1 V				1.27 mm	FIXED POINT	S-CBGA-N360		Not Qualified	1250 rpm	YES
935324254557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260										3				e2
P2020PXE2NFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
935325263557	NXP Semiconductors	MICROPROCESSOR, RISC
935323188557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260										3				e2
P2010NSE2MHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm	31 mm		YES	64	100 MHz	40	260	31 mm	CMOS	1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1200 rpm	YES	e2
935322739557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN								30	250										3				e3
BSC9131CLE1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
935313315557	NXP Semiconductors	MICROPROCESSOR, RISC																			TIN SILVER COPPER								30	250										3				e1
P2020PXE2KFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1000 rpm	NO
XPC850SRCZT80B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3.135 V					BOTTOM	2.35 mm	23 mm		YES	32	80 MHz			23 mm	CMOS	3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	80 rpm	YES
935315417557	NXP Semiconductors	MICROPROCESSOR
PCIMX6Q6AVT10AC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY		YES			32		GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm					40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3		1000 rpm		e1
P5021NXN1TMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	0	64		GRID ARRAY	BGA1295,36X36,40	1.05 V	105 Cel	12	-40 Cel		BOTTOM	3.53 mm	37.5 mm		YES	0				37.5 mm	CMOS	1.1 V	8	2		1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES
BSC9132NSE7KNMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm	23 mm		YES	64	100 MHz			23 mm	CMOS	1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1000 rpm	YES
P5020NXN7TNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz	30	245	37.5 mm	CMOS	1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
935310344557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260										3				e2
P5040PXN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
XPC850SEZT25	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA256,16X16,50		70 Cel		0 Cel		BOTTOM										CMOS	3.3 V			Microprocessors	1.27 mm		S-PBGA-B256		Not Qualified	25 rpm
935325275557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260										3				e2
935319381557	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260										3				e2
P4040NSE1MMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	133.3 MHz			37.5 mm	CMOS	1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
P2020NXE2HHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm	31 mm		YES	64	100 MHz			31 mm	CMOS	1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			800 rpm	NO
SCIMX6D5EYM10CD	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	64		GRID ARRAY, HEAT SINK/SLUG		1.35 V					BOTTOM	1.6 mm	21 mm		YES	64	24 MHz			21 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B624			1000 rpm	YES
P5040PSE1VNC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64	166 MHz			37.5 mm	CMOS	1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
935309501557	NXP Semiconductors	MICROPROCESSOR, RISC
T4161NXN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES		16			GRID ARRAY, HEAT SINK/SLUG						TIN SILVER COPPER	BOTTOM	3.33 mm	45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS					1 mm	FIXED POINT	S-PBGA-B1932	3		1667 rpm	YES	e1
S9S08RN60W1MLHR	NXP Semiconductors	MICROPROCESSOR																											40	260										3

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.