NXP Semiconductors Microprocessors 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

P4040NXE7MMC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1295,36X36,40

.95 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

133.3 MHz

30

245

37.5 mm

CMOS

1 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B1295

3

Not Qualified

1200 rpm

YES

e1

P4040NSN1NNB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, HEAT SINK/SLUG

.95 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

133.3 MHz

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1333 rpm

YES

e1

935313642557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

245

3

e1

935313669557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER

40

260

3

e2

P5021PSN7TMB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

e1

P5010NSN7QMB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY, HEAT SINK/SLUG

1.05 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

30

245

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1600 rpm

YES

e1

SVF311R3K1CKU2

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

0

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

TIN

QUAD

1.6 mm

24 mm

YES

0

40

260

24 mm

CMOS

3.3 V

.5 mm

FLOATING POINT

S-PQFP-G176

3

266 rpm

YES

e3

SVF522R3N2CMK4R

NXP Semiconductors

MICROPROCESSOR, RISC

935325443557

NXP Semiconductors

MICROPROCESSOR

TIN SILVER

40

260

3

e2

935319811557

NXP Semiconductors

MICROPROCESSOR

TIN SILVER

40

260

3

e2

P2020NSN2KHC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

1.05

GRID ARRAY

BGA689,29X29,40

1 V

7

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

40

260

31 mm

CMOS

1.05 V

4

Microprocessors

1 mm

FIXED POINT

S-PBGA-B689

3

Not Qualified

1000 rpm

NO

e2

935331869557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

250

3

e1

935322963557

NXP Semiconductors

MICROPROCESSOR

XPC8260CZUIFBC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

480

LBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

GRID ARRAY, LOW PROFILE

1.7 V

BOTTOM

1.65 mm

37.5 mm

YES

64

66.66 MHz

37.5 mm

CMOS

1.8 V

1.27 mm

FLOATING POINT

S-PBGA-B480

3

Not Qualified

200 rpm

NO

T4161NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1932

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

16

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER COPPER

BOTTOM

3.33 mm

45 mm

YES

64

133.3 MHz

30

250

45 mm

CMOS

1 mm

FIXED POINT

S-PBGA-B1932

3

1500 rpm

YES

e1

BSC9131CLE1KHHB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

0 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

1000 rpm

YES

935313706557

NXP Semiconductors

MICROPROCESSOR, RISC

P5040PXN7VNC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY, HEAT SINK/SLUG

1.05 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

2000 rpm

YES

e1

BSC9132NSN7PNKB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

32

32

GRID ARRAY, FINE PITCH

.97 V

BOTTOM

2.53 mm

23 mm

YES

64

100 MHz

23 mm

CMOS

1 V

.8 mm

FLOATING POINT

S-PBGA-B780

1400 rpm

YES

XPC823ZT50Z3

NXP Semiconductors

MICROPROCESSOR

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

32

GRID ARRAY

70 Cel

0 Cel

BOTTOM

YES

CMOS

FIXED POINT

S-PBGA-B256

50 rpm

YES

XPC7445RX733NC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.35 V

36

32

GRID ARRAY

1.25 V

BOTTOM

3.2 mm

25 mm

YES

64

133 MHz

25 mm

CMOS

1.3 V

1.27 mm

FLOATING POINT

S-CBGA-B360

Not Qualified

733 rpm

YES

935344039557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

40

260

3

e1

935319202557

NXP Semiconductors

MICROPROCESSOR, RISC

P5010NSE7MMB,557

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY

.95 V

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

1200 rpm

YES

935320154557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

40

260

3

e1

PPC7448HX867NC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

1.05 V

0

32

GRID ARRAY

.95 V

105 Cel

0 Cel

BOTTOM

2.8 mm

25 mm

NO

0

867 MHz

25 mm

CMOS

1 V

1.27 mm

FIXED POINT

S-CBGA-B360

Not Qualified

867 rpm

YES

P5010NSN1MMB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, HEAT SINK/SLUG

.95 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

30

245

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1200 rpm

YES

e1

T4160NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

250

CMOS

3

e1

S9S08RNA8W2MTJ

NXP Semiconductors

MICROPROCESSOR

TIN

40

260

3

e3

T4160NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

30

250

CMOS

3

e1

XPC604ERX200LD

NXP Semiconductors

P5021NSE7VNC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

30

245

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

2000 rpm

YES

e1

P2010NSN2HFC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

1 V

TIN SILVER

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

40

260

31 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-PBGA-B689

3

800 rpm

YES

e2

P3041NXN7MMC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

0

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

0

133 MHz

30

245

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1200 rpm

YES

e1

PPC7447RX867NB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

360

BGA

SQUARE

CERAMIC

YES

32

1.1,1.8/2.5

GRID ARRAY

BGA360,19X19,50

TIN LEAD

BOTTOM

30

220

CMOS

Microprocessors

1.27 mm

S-XBGA-B360

1

Not Qualified

867 rpm

e0

XPC857DSLZP66B

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

32

32

GRID ARRAY

3.135 V

BOTTOM

2.05 mm

25 mm

YES

32

25 mm

CMOS

3.3 V

1.27 mm

FIXED POINT

S-PBGA-B357

66 rpm

YES

XPC750PRX366LE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

2.1 V

32

32

GRID ARRAY

2 V

105 Cel

0 Cel

BOTTOM

3.2 mm

25 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

64

366 MHz

25 mm

CMOS

2.05 V

1.27 mm

FLOATING POINT

S-CBGA-B360

Not Qualified

366 rpm

YES

935323626534

NXP Semiconductors

MICROPROCESSOR

TIN

40

260

3

e3

P5040NXN1VNB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY, HEAT SINK/SLUG

1.05 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

2000 rpm

YES

e1

935324031557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN

30

245

3

e3

P4040NSN1PNB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

GRID ARRAY, HEAT SINK/SLUG

.95 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

133.3 MHz

37.5 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

1500 rpm

YES

e1

935323443557

NXP Semiconductors

MICROPROCESSOR, RISC

TIN SILVER COPPER

40

260

3

e1

P5040NXN1TMC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1295

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY, HEAT SINK/SLUG

1.05 V

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

166 MHz

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

e1

PPC7445RX1000LC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

360

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.65 V

36

32

GRID ARRAY

1.55 V

BOTTOM

3.24 mm

25 mm

YES

64

133 MHz

25 mm

CMOS

1.6 V

1.27 mm

FLOATING POINT

S-CBGA-B360

Not Qualified

1000 rpm

YES

P2020PXE2NHC

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

689

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

16

GRID ARRAY

BGA689,29X29,40

1 V

125 Cel

7

BOTTOM

2.46 mm

31 mm

YES

64

100 MHz

31 mm

CMOS

1.05 V

4

1 mm

FIXED POINT

S-PBGA-B689

1333 rpm

NO

PPC8567ECVTANGGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

Not Qualified

800 rpm

YES

e2

935316889557

NXP Semiconductors

MICROPROCESSOR, RISC

BSC9131NSN1KHKB,557

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

0 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

1000 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.